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1. 发明申请

WO2004040593B1 PROCESS FOR PREPARING NANOSIZED ACICULAR MAGNETIC MAGHEMITE PHASE IRON OXIDE PARTICLES 审中-公开
标题翻译：制备纳米颗粒磁性相磁性氧化镁颗粒的方法
公开(公告)号：WO2004040593B1
公开(公告)日：2004-08-26
申请号：PCT/IB0304689
申请日：2003-10-23
申请人： COUNCIL SCIENT IND RES , SINHA ARVIND , CHAKRABORTY JUI , RAO VENKATESH
发明人： SINHA ARVIND , CHAKRABORTY JUI , RAO VENKATESH
IPC分类号： C01G49/08 , G11B5/706 , H01F1/00 , H01F1/36 , C01G49/06 , H01F1/44
CPC分类号： B82Y30/00 , B82Y25/00 , C01G49/08 , C01P2004/03 , C01P2004/10 , C01P2004/30 , C01P2004/32 , C01P2004/38 , C01P2004/50 , C01P2004/54 , C01P2004/62 , C01P2004/64 , C01P2006/42 , G11B5/70663 , H01F1/0063 , H01F1/36 , Y10S977/811 , Y10S977/896
摘要： AbstractThe present invention relates to a single-step simple and economical process for the preparation of nanosized acicular magnetic iron oxide particles of maghemite phase of size ranging between 300-350 nm in magnetic field at room temperature by biomimetic route, and a method of obtaining a magnetic memory storage device using the said particles.
摘要翻译：摘要本发明涉及一种单步简单经济的方法，用于通过仿生途径在室温下在磁场中制备大小在300-350nm之间的磁赤铁矿相的纳米针状磁性氧化铁颗粒，以及一种获得使用所述颗粒的磁存储器存储装置。

2. 发明申请

WO2004040593A1 PROCESS FOR PREPARING NANOSIZED ACICULAR MAGNETIC MAGHEMITE PHASE IRON OXIDE PARTICLES 审中-公开
标题翻译：制备纳米磁敏磁性氧化镁相氧化铁颗粒的方法
公开(公告)号：WO2004040593A1
公开(公告)日：2004-05-13
申请号：PCT/IB2003/004689
申请日：2003-10-23
申请人： COUNCIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH , SINHA, Arvind , CHAKRABORTY, Jui , RAO, Venkatesh
发明人： SINHA, Arvind , CHAKRABORTY, Jui , RAO, Venkatesh
IPC分类号： H01F1/00
CPC分类号： B82Y30/00 , B82Y25/00 , C01G49/08 , C01P2004/03 , C01P2004/10 , C01P2004/30 , C01P2004/32 , C01P2004/38 , C01P2004/50 , C01P2004/54 , C01P2004/62 , C01P2004/64 , C01P2006/42 , G11B5/70663 , H01F1/0063 , H01F1/36 , Y10S977/811 , Y10S977/896
摘要： AbstractThe present invention relates to a single-step simple and economical process for the preparation of nanosized acicular magnetic iron oxide particles of maghemite phase of size ranging between 300-350 nm in magnetic field at room temperature by biomimetic route, and a method of obtaining a magnetic memory storage device using the said particles.
摘要翻译：摘要本发明涉及通过仿生在室温磁场中制备尺寸在300-350nm范围内的磁赤铁矿相的纳米尺寸针状磁性氧化铁颗粒的单步简单和经济的方法路线，以及使用所述颗粒获得磁性记忆存储装置的方法。

3. 发明申请

WO2011154316A1 FLEXIBLE HEAT EXCHANGER 审中-公开
标题翻译：柔性热交换器
公开(公告)号：WO2011154316A1
公开(公告)日：2011-12-15
申请号：PCT/EP2011/059175
申请日：2011-06-02
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , KLINE, Eric, Vance , HOLAHAN, Maurice, Francis , RASMUSSEN, Michael, Robert , KRYSTEK, Paul , ZINS, Stephen , SINHA, Arvind, Kumar
发明人： KLINE, Eric, Vance , HOLAHAN, Maurice, Francis , RASMUSSEN, Michael, Robert , KRYSTEK, Paul , ZINS, Stephen , SINHA, Arvind, Kumar
IPC分类号： H01L23/433 , H01L23/473
CPC分类号： H01L23/4332 , F28F3/12 , F28F2255/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method for constructing a heat exchanger for cooling one or more semiconductor components comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
摘要翻译：用于构造用于冷却一个或多个半导体部件的热交换器的方法包括提供具有特定导热金属箔的第一和第二平面片材的步骤，其中每个片材具有外侧和内侧。该方法还包括在第一片材中形成一个或多个热接触节点（TCN），其中每个TCN从第一片材的外侧向外延伸，并且包括平面接触构件和一个或多个侧面部分，侧面部分包括能够使TCN的接触构件朝向和远离第一板的外侧移动的弹性部件，以及TCN的侧部和接触部件共同形成冷却剂室。通道段沿着第一片材的内侧配置，其中每个通道选择性地在冷却剂室和两个TCN之间或TCN的冷却剂室与输入端口或输出端口之间延伸。该方法还包括将第二片材的内侧连接到第一片材的内侧，以便形成包括每个通道段的密封流动路径，并且使得液体冷却剂能够流入和流出每个通道段的冷却剂室 TCN。

4. 发明申请

WO2008012209A3 INTEGRATED CIRCUIT HEAT DISSIPATION DEVICE 审中-公开
标题翻译：集成电路散热装置
公开(公告)号：WO2008012209A3
公开(公告)日：2008-05-08
申请号：PCT/EP2007057198
申请日：2007-07-12
申请人： IBM , IBM UK , COLBERT JOHN LEE , CORBIN JR JOHN SAUNDERS , EAGLE JASON RODNEY , HAMILTON ROGER DUANE , MIKHAIL AMANDA ELISA , SINHA ARVIND KUMAR , SOBOTTA TERRY LEO
发明人： COLBERT JOHN LEE , CORBIN JR JOHN SAUNDERS , EAGLE JASON RODNEY , HAMILTON ROGER DUANE , MIKHAIL AMANDA ELISA , SINHA ARVIND KUMAR , SOBOTTA TERRY LEO
IPC分类号： H01L23/40
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.
摘要翻译：给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。该方法包括将弹簧板中的致动螺钉紧固在散热装置的一部分上。可以防止致动螺钉被紧固超过对应于特定压缩力的预设校准的机械约束，其可以大于或等于对应于最小热界面压力中较大者的最小压缩力，以及最小接触界面压力。此外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。

5. 发明申请

WO2012010395A3 ALIGNMENT OF GRAPHITE NANOFIBERS IN THERMAL INTERFACE MATERIAL 审中-公开
标题翻译：石墨纳米纤维在热界面材料中的排列
公开(公告)号：WO2012010395A3
公开(公告)日：2012-04-26
申请号：PCT/EP2011061063
申请日：2011-06-30
申请人： IBM , IBM UK , SINHA ARVIND KUMAR , KUCZYNSKI JOSEPH , TOFIL TIMOTHY , SPLITTSTOESSER KEVIN
发明人： SINHA ARVIND KUMAR , KUCZYNSKI JOSEPH , TOFIL TIMOTHY , SPLITTSTOESSER KEVIN
IPC分类号： C01B31/02 , C01B31/04 , H01L23/373
CPC分类号： B82Y40/00 , B82Y30/00 , C01B32/15 , C01B32/20 , H01L23/373 , H01L23/3733 , H01L2924/0002 , H01L2924/00
摘要： A method for aligning graphite nanofibers in a thermal interface material includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.
摘要翻译：一种用于在热界面材料中对准石墨纳米纤维的方法包括：制备人字形构造的石墨纳米纤维;以及将人造构造中的石墨纳米纤维分散到热界面材料中。该方法还包括施加足够强度的磁场以将石墨纳米纤维排列在热界面材料中。

6. 发明申请

WO2008012209A2 INTEGRATED CIRCUIT HEAT DISSIPATION DEVICE 审中-公开
标题翻译：集成电路散热装置
公开(公告)号：WO2008012209A2
公开(公告)日：2008-01-31
申请号：PCT/EP2007/057198
申请日：2007-07-12
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , COLBERT, John, Lee , CORBIN JR, John, Saunders , EAGLE, Jason, Rodney , HAMILTON, Roger, Duane , MIKHAIL, Amanda, Elisa , SINHA, Arvind, Kumar , SOBOTTA, Terry, Leo
发明人： COLBERT, John, Lee , CORBIN JR, John, Saunders , EAGLE, Jason, Rodney , HAMILTON, Roger, Duane , MIKHAIL, Amanda, Elisa , SINHA, Arvind, Kumar , SOBOTTA, Terry, Leo
IPC分类号： H01L23/40
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a 10 portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or 15 equal to a maximum pressure which may be exerted on the integrated circuit device.
摘要翻译：给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。该方法包括将弹簧板中的致动螺钉紧固在散热装置的10个部分上。可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且最小接触界面压力。另外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。

7. 发明申请

WO2013014542A1 A SYSTEM AND METHOD TO PROCESS HORIZONTALLY ALIGNED GRAPHITE NANOFIBERS IN A THERMAL INTERFACE MATERIAL USED IN 3D CHIP STACKS 审中-公开
标题翻译：在三维芯片堆栈中使用的热界面材料中水平对准的石墨纳米纤维的系统和方法
公开(公告)号：WO2013014542A1
公开(公告)日：2013-01-31
申请号：PCT/IB2012/052398
申请日：2012-05-14
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , IBM Japan Limited , KUCZYNSKI, Joseph , SINHA, Arvind , SPLITTSTOESSER, Kevin , TOFIL, Timothy
发明人： KUCZYNSKI, Joseph , SINHA, Arvind , SPLITTSTOESSER, Kevin , TOFIL, Timothy
IPC分类号： H01L25/065 , H01L21/3205 , H01L21/768 , H01L23/522 , H01L25/07 , H01L25/18
CPC分类号： H01L23/36 , H01L23/373 , H01L23/42 , H01L23/4275 , H01L23/481 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L2224/131 , H01L2224/14131 , H01L2224/16146 , H01L2224/17181 , H01L2224/17519 , H01L2224/29099 , H01L2224/32245 , H01L2224/73203 , H01L2224/73253 , H01L2224/81815 , H01L2924/01322 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip.
摘要翻译：具有增强的冷却装置的半导体芯片的芯片堆叠包括具有第一侧上的电路的第一芯片和通过连接器格栅电和机械地耦合到第一芯片的第二芯片。该装置还包括放置在第一芯片和第二芯片之间的热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维。该方法包括在第一侧上创建具有电路的第一芯片，并通过连接器网格将第二芯片电连接并机械耦合到第一芯片。该方法还包括在第一芯片和第二芯片之间放置热界面材料垫，其中热界面材料垫包括平行于第一芯片和第二芯片的配合表面排列的纳米纤维。

8. 发明申请

WO2012010395A2 ALIGNMENT OF GRAPHITE NANOFIBERS IN THERMAL INTERFACE MATERIAL 审中-公开
标题翻译：石墨纳米纤维在热界面材料中的对准
公开(公告)号：WO2012010395A2
公开(公告)日：2012-01-26
申请号：PCT/EP2011/061063
申请日：2011-06-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , SINHA, Arvind, Kumar , KUCZYNSKI, Joseph , TOFIL, Timothy , SPLITTSTOESSER, Kevin
发明人： SINHA, Arvind, Kumar , KUCZYNSKI, Joseph , TOFIL, Timothy , SPLITTSTOESSER, Kevin
IPC分类号： C01B31/02
CPC分类号： B82Y40/00 , B82Y30/00 , C01B32/15 , C01B32/20 , H01L23/373 , H01L23/3733 , H01L2924/0002 , H01L2924/00
摘要： A method for aligning graphite nanofibers in a thermal interface material includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.
摘要翻译：用于将石墨纳米纤维对准在热界面材料中的方法包括以人字形配置制备石墨纳米纤维，并将石英纳米纤维分散在人字形构型中进入热界面材料。该方法还包括施加足够强度的磁场以使石墨纳米纤维在热界面材料中对准。

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