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1. 发明申请

WO2012010395A2 ALIGNMENT OF GRAPHITE NANOFIBERS IN THERMAL INTERFACE MATERIAL 审中-公开
标题翻译：石墨纳米纤维在热界面材料中的对准
公开(公告)号：WO2012010395A2
公开(公告)日：2012-01-26
申请号：PCT/EP2011/061063
申请日：2011-06-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , SINHA, Arvind, Kumar , KUCZYNSKI, Joseph , TOFIL, Timothy , SPLITTSTOESSER, Kevin
发明人： SINHA, Arvind, Kumar , KUCZYNSKI, Joseph , TOFIL, Timothy , SPLITTSTOESSER, Kevin
IPC分类号： C01B31/02
CPC分类号： B82Y40/00 , B82Y30/00 , C01B32/15 , C01B32/20 , H01L23/373 , H01L23/3733 , H01L2924/0002 , H01L2924/00
摘要： A method for aligning graphite nanofibers in a thermal interface material includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.
摘要翻译：用于将石墨纳米纤维对准在热界面材料中的方法包括以人字形配置制备石墨纳米纤维，并将石英纳米纤维分散在人字形构型中进入热界面材料。该方法还包括施加足够强度的磁场以使石墨纳米纤维在热界面材料中对准。

2. 发明申请

WO2011154316A1 FLEXIBLE HEAT EXCHANGER 审中-公开
标题翻译：柔性热交换器
公开(公告)号：WO2011154316A1
公开(公告)日：2011-12-15
申请号：PCT/EP2011/059175
申请日：2011-06-02
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , KLINE, Eric, Vance , HOLAHAN, Maurice, Francis , RASMUSSEN, Michael, Robert , KRYSTEK, Paul , ZINS, Stephen , SINHA, Arvind, Kumar
发明人： KLINE, Eric, Vance , HOLAHAN, Maurice, Francis , RASMUSSEN, Michael, Robert , KRYSTEK, Paul , ZINS, Stephen , SINHA, Arvind, Kumar
IPC分类号： H01L23/433 , H01L23/473
CPC分类号： H01L23/4332 , F28F3/12 , F28F2255/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method for constructing a heat exchanger for cooling one or more semiconductor components comprises the step of providing first and second planar sheets of specified thermally conductive metal foil, wherein each of the sheets has and exterior side and an interior side. The method further comprises forming one or more thermal contact nodes (TCNs) in the first sheet, wherein each TCN extends outward from the exterior side of the first sheet, and comprises a planar contact member and one or more side sections, the side sections respectively including resilient components that enable the contact member of the TCN to move toward and away from the exterior side of the first sheet, and the side sections and contact member of a TCN collectively forming a coolant chamber. Channel segments are configured along the interior side of the first sheet, wherein each channel extends between the coolant chambers and two TCNs, or between the coolant chamber of a TCN and an input port or output port, selectively. The method further comprises joining the interior side of the second sheet to the interior side of the first sheet, in order to form a sealed flow path that includes each channel segment, and enables liquid coolant to flow into and out of the coolant chamber of each TCN.
摘要翻译：用于构造用于冷却一个或多个半导体部件的热交换器的方法包括提供具有特定导热金属箔的第一和第二平面片材的步骤，其中每个片材具有外侧和内侧。该方法还包括在第一片材中形成一个或多个热接触节点（TCN），其中每个TCN从第一片材的外侧向外延伸，并且包括平面接触构件和一个或多个侧面部分，侧面部分包括能够使TCN的接触构件朝向和远离第一板的外侧移动的弹性部件，以及TCN的侧部和接触部件共同形成冷却剂室。通道段沿着第一片材的内侧配置，其中每个通道选择性地在冷却剂室和两个TCN之间或TCN的冷却剂室与输入端口或输出端口之间延伸。该方法还包括将第二片材的内侧连接到第一片材的内侧，以便形成包括每个通道段的密封流动路径，并且使得液体冷却剂能够流入和流出每个通道段的冷却剂室 TCN。

3. 发明申请

WO2008012209A2 INTEGRATED CIRCUIT HEAT DISSIPATION DEVICE 审中-公开
标题翻译：集成电路散热装置
公开(公告)号：WO2008012209A2
公开(公告)日：2008-01-31
申请号：PCT/EP2007/057198
申请日：2007-07-12
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , IBM UNITED KINGDOM LIMITED , COLBERT, John, Lee , CORBIN JR, John, Saunders , EAGLE, Jason, Rodney , HAMILTON, Roger, Duane , MIKHAIL, Amanda, Elisa , SINHA, Arvind, Kumar , SOBOTTA, Terry, Leo
发明人： COLBERT, John, Lee , CORBIN JR, John, Saunders , EAGLE, Jason, Rodney , HAMILTON, Roger, Duane , MIKHAIL, Amanda, Elisa , SINHA, Arvind, Kumar , SOBOTTA, Terry, Leo
IPC分类号： H01L23/40
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a 10 portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or 15 equal to a maximum pressure which may be exerted on the integrated circuit device.
摘要翻译：给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。该方法包括将弹簧板中的致动螺钉紧固在散热装置的10个部分上。可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且最小接触界面压力。另外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。

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