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1. 发明申请

WO2006017583A2 METHODS FOR PROCESSING HOLES BY MOVING PRECISELY TIMED LASER PULSES IN CIRCULAR AND SPIRAL TRAJECTORIES 审中-公开
标题翻译：通过在圆形和螺旋轨道中移动精确时间激光脉冲来处理孔的方法
公开(公告)号：WO2006017583A2
公开(公告)日：2006-02-16
申请号：PCT/US2005/027584
申请日：2005-08-01
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC , PAILTHORP, Robert M. , LEI, Weisheng , MATSUMOTO, Hisashi , SIMENSON, Glenn , WATT, David A. , UNRATH, Mark A. , JORDENS, William J.
发明人： PAILTHORP, Robert M. , LEI, Weisheng , MATSUMOTO, Hisashi , SIMENSON, Glenn , WATT, David A. , UNRATH, Mark A. , JORDENS, William J.
IPC分类号： B23K26/38
CPC分类号： H05K3/0026 , B23K26/389 , H05K2201/09063
摘要： High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular (50) and spiral (70, 90, 110) laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory (18, 52) to an entry position (16, 54) within the specimen at which laser beam pulse emissions (58) are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment (40) of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.
摘要翻译：材料从样品的高速移除采用了光束定位器，用于沿着各种圆形（50）和螺旋（70,90,110）激光工具图案引导激光束轴。材料移除的优选方法需要引起梁的轴线和样本之间的相对移动，将梁轴线以入口段加速度并且沿着入口轨迹（18,52）引导到入口位置（16,54）内的入口位置激光束脉冲发射（58）开始的样本，在样本内以圆周周边加速度移动射束轴以沿着样本的圆形节段（40）去除材料，并且将入口节段加速度设置为小于圆周加速度。

2. 发明申请

WO1997034206A1 MULTI-TOOL POSITIONING SYSTEM 审中-公开
标题翻译：多工具定位系统
公开(公告)号：WO1997034206A1
公开(公告)日：1997-09-18
申请号：PCT/US1997003385
申请日：1997-03-04
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , CUTLER, Donald, R. , PAILTHORP, Robert, M. , UNRATH, Mark, A. , RICHARDSON, Thomas, W. , CABLE, Alan, J.
发明人： ELECTRO SCIENTIFIC INDUSTRIES, INC.
IPC分类号： G05B19/39
CPC分类号： B23K26/08 , B23K26/082 , B23K26/083 , B23K26/0853 , G05B19/39 , G05B2219/34047 , G05B2219/34391 , G05B2219/36029 , G05B2219/41331 , G05B2219/42209 , G05B2219/42219 , G05B2219/45041 , G05B2219/45139 , H05K3/0008 , H05K3/0017 , H05K3/0038 , H05K2203/0165 , H05K2203/108
摘要： A multi-rate, multi-head positioner (150) receives and processes unpanelized positioning commands to actuate slow stages (56, 58) and multiple fast stages (154) that are mounted on one of the slow stages to simultaneously position multiple tools (156) relative to target locations (162) on multiple associated workpieces (152). Each of the fast stages is coupled to a fast stage signal processor (172) that provides corrected position data to each fast stage positioner to compensate for fast stage nonlinearities and workpiece placement, offset, rotation, and dimensional variations among the multiple workpieces. When cutting blind via holes in etched circuit boards (ECBs), improved throughput and process yield are achieved by making half of the tools ultraviolet ("UV") lasers, which readily cut conductor and dielectric layers, and making the other half of the tools are infrared ("IR") lasers, which readily cut only dielectric layers. The UV lasers are controlled to cut an upper conductor layer and a portion of an underlying dielectric layer, and the IR lasers are controlled to cut the remaining dielectric layer without cutting through or damaging a second underlying conductor layer. The throughput is increased by cutting conductor layers in unprocessed ECBs while concurrently cutting dielectric layers in ECBs that have already had their conductor layer cut. The process yield is increased by performing a workpiece calibration prior to each cutting step to account for any ECB placement, offset, rotation, and dimensional variations.
摘要翻译：多速率多头定位器（150）接收和处理未通用的定位命令以致动缓慢级（56,58）和多个快速级（154），所述缓慢级（56,58）和多级快速级（154）安装在所述慢速级中的一级以同时定位多个工具）相对于多个相关工件（152）上的目标位置（162）。每个快速级耦合到快速级信号处理器（172），其向每个快速定位器提供校正的位置数据，以补偿多个工件之间的快速阶段非线性和工件放置，偏移，旋转和尺寸变化。在蚀刻电路板（ECB）中通过盲孔切割盲孔时，通过制造一半的工具紫外线（“UV”）激光器可以实现提高的产量和工艺产量，这些激光器易于切割导体和电介质层，并使另一半的工具是红外线（“IR”）激光器，其易于切割电介质层。控制UV激光器以切割上导体层和底层电介质层的一部分，并且IR激光器被控制以切割剩余的电介质层而不切割或损坏第二下面的导体层。通过在未加工的ECB中切割导体层，同时切割已经具有导体层切割的ECB中的电介质层，从而提高了生产量。通过在每个切割步骤之前执行工件校准以考虑任何ECB放置，偏移，旋转和尺寸变化来增加工艺屈服。

3. 发明申请

WO2006031577A2 RESOLVING THERMOELECTRIC POTENTIALS DURING LASER TRIMMING OF RESISTORS 审中-公开
标题翻译：在电阻激光切割期间解决热电势
公开(公告)号：WO2006031577A2
公开(公告)日：2006-03-23
申请号：PCT/US2005031909
申请日：2005-08-31
申请人： ELECTRO SCIENT IND INC , MCCURRY BRANDON , PAILTHORP ROBERT M
发明人： MCCURRY BRANDON , PAILTHORP ROBERT M
IPC分类号： H01C17/242 , B23K26/00
CPC分类号： H01C17/242 , B23K26/0006 , B23K26/0624 , B23K26/066 , B23K26/351 , B23K26/361 , B23K2203/50 , B23K2203/52
摘要： Thermoelectric effects that occur during laser trimming of resistors (20) are resolved by taking voltage measurements. The voltage attributed to laser heating on a resistor (20) during a low-power simulated trim (10) is used to determine a relatively thermal-neutral location (18) on the resistor (20). A trimming-to-value operation can then be performed on all like resistors (20). Voltage measurements can also be taken before and after every pulse in a trimming operation to establish thermal deviation information that can be used to offset the desired trim value against which resistor measurement values are compared. Spatially distant or nonadjacent resistors (20) in a row or column can also be trimmed sequentially to minimize heating effects that might otherwise distort resistance values on adjacent or nearby resistors (20).
摘要翻译：在电阻（20）的激光微调期间发生的热电效应通过采取电压测量来解决。用于在低功率模拟微调（10）期间归因于电阻器（20）上的激光加热的电压用于确定电阻器（20）上的相对热中性位置（18）。然后可以对所有类似的电阻器（20）执行修整到值的操作。也可以在修整操作中的每个脉冲之前和之后进行电压测量，以建立热偏差信息，该热偏差信息可用于抵消与哪个电阻测量值进行比较的期望的微调值。也可以顺序修剪行或列中的空间较远或不相邻的电阻器（20），以最小化否则可能在相邻或附近的电阻器（20）上扭曲电阻值的加热效应。

4. 发明申请

WO2006017583A3 METHODS FOR PROCESSING HOLES BY MOVING PRECISELY TIMED LASER PULSES IN CIRCULAR AND SPIRAL TRAJECTORIES 审中-公开
标题翻译：通过在圆形和螺旋状轨道中移动精密定时激光脉冲来处理孔的方法
公开(公告)号：WO2006017583A3
公开(公告)日：2006-03-30
申请号：PCT/US2005027584
申请日：2005-08-01
申请人： ELECTRO SCIENT IND INC , PAILTHORP ROBERT M , LEI WEISHENG , MATSUMOTO HISASHI , SIMENSON GLENN , WATT DAVID A , UNRATH MARK A , JORDENS WILLIAM J
发明人： PAILTHORP ROBERT M , LEI WEISHENG , MATSUMOTO HISASHI , SIMENSON GLENN , WATT DAVID A , UNRATH MARK A , JORDENS WILLIAM J
IPC分类号： B23K26/00 , A61K39/395
CPC分类号： H05K3/0026 , B23K26/389 , H05K2201/09063
摘要： High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular (50) and spiral (70, 90, 110) laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory (18, 52) to an entry position (16, 54) within the specimen at which laser beam pulse emissions (58) are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment (40) of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.
摘要翻译：从样品高速去除材料使用光束定位器，用于沿着各种圆形（50）和螺旋（70,90,110）激光工具图案引导激光束轴线。材料去除的优选方法必须导致梁的轴线和试样之间的相对运动，将梁轴线以入口段加速度并沿着入口轨迹（18,52）引导到入口位置（16,54）内激光束脉冲发射（58）开始的样本，沿着样品中的圆周边加速度移动光束轴线以沿着样品的圆形段（40）去除材料，并将入口段加速度设定为小于两倍圆周边加速度。

5. 发明申请

WO2006031577A3 REDUCTION OF THERMOELECTRIC EFFECTS DURING LASER TRIMMING OF RESISTORS 审中-公开
公开(公告)号：WO2006031577A3
公开(公告)日：2006-03-23
申请号：PCT/US2005/031909
申请日：2005-08-31
申请人： ELECTRO SCIENTIFIC INDUSTRIES, INC. , MCCURRY, Brandon , PAILTHORP, Robert M.
发明人： MCCURRY, Brandon , PAILTHORP, Robert M.
IPC分类号： H01C17/242 , B23K26/00
摘要： Thermoelectric effects that occur during laser trimming of resistors (20) are resolved by taking voltage measurements. The voltage attributed to laser heating on a resistor (20) during a low-power simulated trim (10) is used to determine a relatively thermal-neutral location (18) on the resistor (20). A trimming-to-value operation can then be performed on all like resistors (20). Voltage measurements can also be taken before and after every pulse in a trimming operation to establish thermal deviation information that can be used to offset the desired trim value against which resistor measurement values are compared. Spatially distant or nonadjacent resistors (20) in a row or column can also be trimmed sequentially to minimize heating effects that might otherwise distort resistance values on adjacent or nearby resistors (20).

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