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1. 发明申请

WO2007148836A2 ELECTRODE BONDING METHOD AND PART MOUNTING APPARATUS 审中-公开
标题翻译：电极接合方法和部分安装设备
公开(公告)号：WO2007148836A2
公开(公告)日：2007-12-27
申请号：PCT/JP2007/063063
申请日：2007-06-22
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , INAMOTO, Yoshimasa , NAKATSUJI, Hachiro , INOUE, Kazuhiro , TSUJI, Hiroyuki
发明人： INAMOTO, Yoshimasa , NAKATSUJI, Hachiro , INOUE, Kazuhiro , TSUJI, Hiroyuki
CPC分类号： H05H1/24 , B23K11/0006 , B23K20/10 , B23K35/38 , B23K35/383 , H01L24/75 , H01L24/81 , H01L2221/68313 , H01L2224/75 , H01L2224/75302 , H01L2224/75743 , H01L2224/81009 , H01L2224/81013 , H01L2224/81054 , H01L2224/81075 , H01L2224/81203 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H05K3/3489 , H05K2203/0195 , H05K2203/082 , H05K2203/086 , H05K2203/095
摘要： An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface (3) to be cleaned of at least either one of a part (1), such as a semiconductor device, and a substrate (10) with atmospheric pressure plasma (8) for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface (3) to be cleaned and its vicinity with a first inert gas (4) before the irradiation of the atmospheric pressure plasma (8) is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part (1) and an electrode on the substrate (10) before the inert gas atmosphere maintaining step is ended. The electrode surface (3) is thereby plasma-cleaned without the possibility of damaging the part (1) to be bonded to the substrate (10), and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.
摘要翻译：根据本发明的电极接合方法包括：等离子体清洗步骤，对诸如半导体器件的部分（1）和衬底（10）中的至少任一个照射待清洁的电极表面（3）用大气压等离子体（8）清洗; 在大气压等离子体（8）的照射之前，用第一惰性气体（4）覆盖待清洁电极面（3）及其附近的惰性气体气氛保持步骤结束，此后保持该状态; 以及在惰性气体保持步骤结束之前将部分（1）的电极和基板（10）上的电极接合的接合步骤。电极表面（3）由此进行等离子体清洁，而不会损坏要与基板（10）接合的部分（1），并且在粘合电极的同时保持清洁状态以提供高接合的电极接合状态强力和高可靠性。

2. 发明申请

WO2006132428A1 LIQUID SUBSTANCE SUPPLYING DEVICE 审中-公开
标题翻译：液体物质供应装置
公开(公告)号：WO2006132428A1
公开(公告)日：2006-12-14
申请号：PCT/JP2006/311967
申请日：2006-06-08
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , NAKATSUJI, Hachiro , IIZUKA, Akira , KABESHITA, Akira
发明人： NAKATSUJI, Hachiro , IIZUKA, Akira , KABESHITA, Akira
IPC分类号： B05B15/06
CPC分类号： B05C5/0216 , B05C11/10 , B05C17/015
摘要： It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated container 30 has a configuration in which a bottom part of a container holder 15 for holding the container inserted through an insertion hole provided on a top side of a holder main body 16 is pivoted on a base bracket 14 with a hinge portion 19 to support the container holder 15 such that it can assume either upright attitude or tilted attitude and in which the container holder 15 is fixed in the upright attitude by a holder fixing mechanism 20. As a result, the container holder 15 can be mounted and removed to and from the holder main body 16 in the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.
摘要翻译：本发明的目的是提供一种在具有大容量的容器的处理中具有高可操作性的液体物质供给装置。用于供应保留在垂直细长容器30中的液体物质的液体物质供给装置具有这样的结构，其中用于保持容器的底部部分通过设置在保持器主体16的顶侧上的插入孔插入通过铰链部分19枢转在基座支架14上，以支撑容器支架15，使得它可以采取直立姿态或倾斜姿势，并且容器保持器15通过保持器固定机构20以直立姿态固定在其中。结果，容器保持器15能够在容器更换操作时以倾斜状态安装和拆卸保持器本体16，这使得即使在处理具有伟大的高度尺寸。

3. 发明申请

WO2007148836A3 ELECTRODE BONDING METHOD AND PART MOUNTING APPARATUS 审中-公开
标题翻译：电极接合方法和部分安装设备
公开(公告)号：WO2007148836A3
公开(公告)日：2008-04-17
申请号：PCT/JP2007063063
申请日：2007-06-22
申请人： MATSUSHITA ELECTRIC IND CO LTD , INAMOTO YOSHIMASA , NAKATSUJI HACHIRO , INOUE KAZUHIRO , TSUJI HIROYUKI
发明人： INAMOTO YOSHIMASA , NAKATSUJI HACHIRO , INOUE KAZUHIRO , TSUJI HIROYUKI
IPC分类号： H05K3/26 , H01L21/60
CPC分类号： H05H1/24 , B23K11/0006 , B23K20/10 , B23K35/38 , B23K35/383 , H01L24/75 , H01L24/81 , H01L2221/68313 , H01L2224/75 , H01L2224/75302 , H01L2224/75743 , H01L2224/81009 , H01L2224/81013 , H01L2224/81054 , H01L2224/81075 , H01L2224/81203 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H05K3/3489 , H05K2203/0195 , H05K2203/082 , H05K2203/086 , H05K2203/095
摘要： An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface (3) to be cleaned of at least either one of a part (1), such as a semiconductor device, and a substrate (10) with atmospheric pressure plasma (8) for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface (3) to be cleaned and its vicinity with a first inert gas (4) before the irradiation of the atmospheric pressure plasma (8) is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part (1) and an electrode on the substrate (10) before the inert gas atmosphere maintaining step is ended. The electrode surface (3) is thereby plasma-cleaned without the possibility of damaging the part (1) to be bonded to the substrate (10), and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.
摘要翻译：根据本发明的电极接合方法包括：等离子体清洗步骤，对诸如半导体器件的部分（1）和衬底（10）中的至少任一个照射待清洁的电极表面（3）用大气压等离子体（8）清洗; 在大气压等离子体（8）的照射之前，用第一惰性气体（4）覆盖待清洁电极面（3）及其附近的惰性气体气氛保持步骤结束，此后保持该状态; 以及在惰性气体保持步骤结束之前将部分（1）的电极和基板（10）上的电极接合的接合步骤。电极表面（3）由此进行等离子体清洁，而不会损坏要与基板（10）接合的部分（1），并且在粘合电极的同时保持清洁状态以提供高接合的电极接合状态强力和高可靠性。

4. 发明申请

WO1990006041A1 METHOD OF AND APPARATUS FOR DRAWING THICK-FILM 审中-公开
标题翻译：用于绘制薄膜的方法和装置
公开(公告)号：WO1990006041A1
公开(公告)日：1990-05-31
申请号：PCT/JP1985000198
申请日：1985-04-15
申请人： SAEKI, Keiji , KUDO, Shinichi , NAKATSUJI, Hachiro
IPC分类号： H05K03/12
CPC分类号： H05K3/1241 , H01L21/705 , H05K2203/0126
摘要： A method of and an apparatus for drawing a thick-film circuit on a substrate (2) by discharging paste from a nozzle (1), which has a discharge port, onto the substrate (2). Every time a predetermined length of drawing interruption time has elapsed, the paste is discharged from the tank (6) to make waste drawing on a waste drawing element (11). Thus, the clogging of the discharge port of the tank (6) with the paste is prevented, and the operation efficiency and productivity can thereby be improved.

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