会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • METHOD AND DEVICE FOR WRITING PHOTOMASKS WITH REDUCED MURA ERRORS
    • 用减少MURA错误写入光子的方法和装置
    • WO2014140047A2
    • 2014-09-18
    • PCT/EP2014054750
    • 2014-03-11
    • MICRONIC MYDATA AB
    • SANDSTRÖM TORBJÖRN
    • G03F1/42
    • G03F1/42G03F1/76G03F7/70358G03F7/70383G03F7/704G03F7/70425G03F7/70466G03F7/70583G03F7/70775G03F9/7011G03F9/708
    • The problem of mura in large area photomasks is solved or at least reduced by setting up a writing system to write a pattern with high accuracy and with the optical axes essentially parallel to the movement axes of the stage, then writing photomasks in two passes with the substrate rotated to different angles on the stage. The angle between the orientation of the first and second pass is larger than about 10 degrees, larger than about 20 degrees or larger than about 35 degrees and it can be approximately 10 degrees, approximately 50 degrees, approximately 60 degrees or approximately 90 degrees. The substrate is physically rotated on the stage and aligned with high accuracy after the rotation and the data driving the first and second exposure passes are derived from the first input data specification but processed according to the known oblique angles, so that the second pass is accurately overlaid on the first pass.
    • 通过设置写入系统以高精度写入图案并且光轴基本上平行于平台的移动轴来解决或至少减少了大面积光掩模中的mura的问题,然后将光掩模写入两次通过中 衬底在舞台上旋转到不同的角度。 第一和第二通过的取向之间的角度大于约10度,大于约20度或大于约35度,并且其可以为大约10度,大约50度,大约60度或大约90度。 衬底物理地在舞台上旋转并且在旋转之后以高精度对准并且数据驱动第一和第二曝光通过从第一输入数据规范导出,但是根据已知的倾斜角度进行处理,使得第二遍准确 重叠在第一遍。
    • 5. 发明申请
    • METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT
    • 用于执行图案对齐的方法和装置
    • WO2011104374A1
    • 2011-09-01
    • PCT/EP2011/052866
    • 2011-02-25
    • MICRONIC MYDATA ABWAHLSTEN, MikaelGUSTAFSSON, Per-Erik
    • WAHLSTEN, MikaelGUSTAFSSON, Per-Erik
    • G03F7/20G03F9/00
    • G03F9/7003G03F7/70383H05K3/4679
    • A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern (1304) comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern (1306) and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).
    • 一种用于在制造多层堆叠中的直接写入机器中对工件进行图案化的方法,其中包括用于连接点的图案的第一电路图案(1304)根据确定的配合公差被变换以适合于第二电路图案的连接点 1306)以及在工件上或工件中的特定特征(例如随机放置的模具或一组模具)的电路图案。 第二层可以是预先形成的层或要形成在相同工件上的层或者用于堆叠的不同工件上的层。 与所选择的管芯相关联的模式数据使用由变换的位置定义的变换被转换成调整的电路图案数据,使得电路图案被安装到所选择的管芯。
    • 6. 发明申请
    • MECHANICALLY PRODUCED ALIGNMENT FIDUCIAL METHOD AND ALIGNMENT SYSTEM
    • 机械制备校准方法和对准系统
    • WO2014140046A3
    • 2014-12-11
    • PCT/EP2014054748
    • 2014-03-11
    • MICRONIC MYDATA AB
    • SANDSTRÖM TORBJÖRN
    • G03F9/00G03F1/42
    • G03F7/70775G03F1/42G03F9/708G03F9/7088
    • The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.
    • 所公开的技术涉及可用于减少知道的可见伪像的方法和系统。 特别地,它涉及通过在工件上物理地改变曝光或辐射敏感材料层的外观来产生对准标记,然后使用那些对准标记或这些标记的传送的直接或反转图像来重新排列曝光写入通过之间的书写坐标系 ,在书写系统内的工件物理移动之后。 所描述的物理修改包括使用激光将标记机械地压入层中,以将灰分或烧蚀层,或将油墨或其它物质施加到激光表面。
    • 9. 发明申请
    • MECHANICALLY PRODUCED ALIGNMENT FIDUCIAL METHOD AND DEVICE
    • 机械制造对准的方法和装置
    • WO2014140046A2
    • 2014-09-18
    • PCT/EP2014/054748
    • 2014-03-11
    • MICRONIC MYDATA AB
    • SANDSTRÖM, Torbjörn
    • G03F1/42
    • G03F7/70775G03F1/42G03F9/708G03F9/7088
    • The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.
    • 所公开的技术涉及可用于减少知道的可见伪像的方法和系统。 特别地,它涉及通过在工件上物理地改变曝光或辐射敏感材料层的外观来产生对准标记,然后使用那些对准标记或这些标记的传送的直接或反转图像来重新排列曝光写入通过之间的书写坐标系 ,在书写系统内的工件物理移动之后。 所描述的物理修改包括使用激光将标记机械地压入层中,以将灰分或烧蚀层,或将油墨或其它物质施加到激光表面。