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1. 发明申请

WO2012038843A1 ELECTROCHEMICALLY POWERED INTEGRATED CIRCUIT PACKAGE 审中-公开
标题翻译：电化学集成电路封装
公开(公告)号：WO2012038843A1
公开(公告)日：2012-03-29
申请号：PCT/IB2011/053477
申请日：2011-08-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BRUNSCHWILER, Thomas, J. , MICHEL, Bruno , RUCH, Patrick
发明人： BRUNSCHWILER, Thomas, J. , MICHEL, Bruno , RUCH, Patrick
IPC分类号： H01L23/58
CPC分类号： H01L23/58 , H01L23/34 , H01L23/44 , H01L23/473 , H01L2224/16145 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01M8/04029 , H01M8/04276 , H01M8/1097 , H01M8/188 , Y02E60/528 , H01L2924/00
摘要： The invention is notably directed to an integrated circuit package (10c). Said package has a layer structure with ICs and electrodes (17) arranged in electrical connection with a layer (16) of the layer structure. The package further comprises one or more fluid circuit sections (19), each meant to receive a respective electrolyte solution (or two distinct solutions, see the dual flow redox mode described below). Each solution involved has soluble electroactive species. A fluid section is designed to receive and allow an electrolyte solution to contact corresponding electrodes, such as to supply power to the ICs, in operation. As electrodes are integrated to the package, electrical power can be supplied close to the ICs, thereby improving efficiency of the power supply. Finally, as a liquid is involved in-situ, suitable heat removal can be contemplated, it being noted that electrical power delivery and heat removal needs are congruent.
摘要翻译：本发明特别涉及一种集成电路封装（10c）。所述封装具有层状结构，其中IC和电极（17）布置成与层结构的层（16）电连接。包装还包括一个或多个流体回路段（19），每个流体回路段（19）各自意图接收相应的电解质溶液（或两个不同的溶液，参见下面描述的双流氧化还原模式）。涉及的每个溶液都具有可溶性电活性物质。流体部分设计成在操作中接收和允许电解质溶液接触相应的电极，例如为IC供电。当电极集成到封装中时，可以在IC附近提供电力，从而提高电源的效率。最后，当液体原位参与时，可以考虑合适的除热，应注意的是电力输送和散热需求是一致的。

2. 发明申请

WO2010086806A2 REFRIGERATION SYSTEM AND METHOD FOR CONTROLLING A REFRIGERATION SYSTEM 审中-公开
标题翻译：制冷系统和控制制冷系统的方法
公开(公告)号：WO2010086806A2
公开(公告)日：2010-08-05
申请号：PCT/IB2010/050371
申请日：2010-01-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , MICHEL, Bruno , SMITH, Brian
发明人： MICHEL, Bruno , SMITH, Brian
IPC分类号： F25B5/04 , F25B49/02
CPC分类号： F25B5/04 , F25B2600/21 , H05K7/20809 , H05K7/20836
摘要： A refrigeration system comprises a compressor (COMP), a condenser (COND) and at least one multi-stage evaporator (MSE) with at least one first evaporator (FBE) as a first stage and at least one expansion device evaporator (EDE) as at least one further stage downstream the corresponding first stage. Each first evaporator (FBE) is arranged at a respective first compo¬ nent (Cl) for absorbing heat dissipated by the respective first component (Cl). Each expan¬ sion device evaporator (EDE) is arranged at a respective at least one further component (FC) for absorbing heat dissipated by the respective further component (FC). A flow of a working fluid (WF) of the refrigeration system is controlled such that the working fluid (WF) is in a liquid state when entering the first stage and is in a vapor state when leaving a last stage of the respective multi-stage evaporator (MSE).
摘要翻译：制冷系统包括压缩机（COMP），冷凝器（COND）和至少一个多级蒸发器（MSE），其具有至少一个作为第一级的第一蒸发器（FBE）和至少一个膨胀装置蒸发器（EDE），作为在相应的第一阶段下游的至少一个另外的阶段。每个第一蒸发器（FBE）布置在相应的第一组分（Cl）处，用于吸收由相应的第一组分（C1）消散的热量。每个膨胀装置蒸发器（EDE）被布置在相应的至少一个另外的部件（FC）上，用于吸收由相应的另一部件（FC）消散的热量。控制制冷系统的工作流体（WF）的流动，使得工作流体（WF）在进入第一阶段时处于液体状态，并且当离开相应多级的最后阶段时处于蒸气状态蒸发器（MSE）。

3. 发明申请

WO2002093991A1 METHOD FOR ELECTROLESS DEPOSITION AND PATTERNING OF A METAL ON A SUBSTRATE 审中-公开
标题翻译：用于电镀沉积和在基材上形成金属的方法
公开(公告)号：WO2002093991A1
公开(公告)日：2002-11-21
申请号：PCT/IB2002/001225
申请日：2002-04-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
发明人： DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
IPC分类号： H05K3/06
CPC分类号： B82Y30/00 , C23C18/1605 , C23C18/1607 , C23C18/1893 , C23F1/02 , C23F1/34 , H01L21/4846 , H05K3/0079 , H05K3/061 , H05K3/181 , H05K3/389 , H05K2203/0108 , H05K2203/0537 , H05K2203/0585 , H05K2203/1168
摘要： A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be overplated with another metal, which can be microcontact printed to serve as an etch mask.
摘要翻译：提供了一种用于在基板上制造图案化金属层的方法，其包括将金属的覆盖金属膜无电沉积到基板上的步骤，随后通过微接触印刷对所述金属层进行图案化。沉积的金属可以用另一种金属进行过电镀，其可以被微接触印制以用作蚀刻掩模。

4. 发明申请

WO2012085716A1 SOLID SORPTION REFRIGERATION 审中-公开
标题翻译：固体制冷
公开(公告)号：WO2012085716A1
公开(公告)日：2012-06-28
申请号：PCT/IB2011/055370
申请日：2011-11-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , MICHEL, Bruno , RUCH, Patrick
发明人： MICHEL, Bruno , RUCH, Patrick
IPC分类号： F25B17/08 , F28F13/18 , F25B35/04
CPC分类号： B21D53/02 , F25B15/00 , F25B17/08 , F25B35/04 , F28F13/185 , Y02A30/276 , Y02A30/278 , Y02B30/64 , Y10T29/4935 , Y10T29/49359
摘要： Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).
摘要翻译：为固体吸附制冷系统（1）提供集成吸附和热交换器装置，以及制造这种装置的方法。集成的吸附和热交换器装置（20,30,45,52）包括其中形成有可渗透所述系统（1）的被吸附物的多孔吸附结构（21,31,44,53）的固体材料，，以及在所述系统（1）的操作中不渗透所述被吸附物的热交换器结构（22,32），用于与所述多孔吸附结构进行热交换。

5. 发明申请

WO2009037648A3 INTEGRATED CIRCUIT STACK AND ITS THERMAL MANAGEMENT 审中-公开
标题翻译：集成电路堆栈及其热管理
公开(公告)号：WO2009037648A3
公开(公告)日：2009-07-23
申请号：PCT/IB2008053768
申请日：2008-09-17
申请人： IBM , BRUNSCHWILER THOMAS J , LINDERMAN RYAN JOSEPH , MICHEL BRUNO , ROTHUIZEN HUGO E
发明人： BRUNSCHWILER THOMAS J , LINDERMAN RYAN JOSEPH , MICHEL BRUNO , ROTHUIZEN HUGO E
IPC分类号： H01L25/065 , H01L23/473
CPC分类号： H01L25/0657 , H01L23/473 , H01L2224/16 , H01L2225/06513 , H01L2225/06589
摘要： The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).
摘要翻译：本发明涉及包括多个集成电路层（2）和布置在两个电路层（2）之间的空间中的至少一个冷却层（3）的集成电路堆叠（1）。使用泵送通过冷却层（3）的冷却流体（10）来冷却集成电路堆（1）。本发明还涉及一种用于优化这种集成电路堆叠（1）的配置的方法。

6. 发明申请

WO2009037648A2 INTEGRATED CIRCUIT STACK 审中-公开
标题翻译：集成电路堆栈
公开(公告)号：WO2009037648A2
公开(公告)日：2009-03-26
申请号：PCT/IB2008/053768
申请日：2008-09-17
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BRUNSCHWILER, Thomas J. , LINDERMAN, Ryan Joseph , MICHEL, Bruno , ROTHUIZEN, Hugo E.
发明人： BRUNSCHWILER, Thomas J. , LINDERMAN, Ryan Joseph , MICHEL, Bruno , ROTHUIZEN, Hugo E.
CPC分类号： H01L25/0657 , H01L23/473 , H01L2224/16 , H01L2225/06513 , H01L2225/06589
摘要： The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).
摘要翻译：本发明涉及包括多个集成电路层（2）和布置在两个电路层（2）之间的空间中的至少一个冷却层（3）的集成电路堆叠（1）。使用泵送通过冷却层（3）的冷却流体（10）来冷却集成电路堆叠（1）。本发明还涉及一种用于优化这种集成电路堆叠（1）的配置的方法。

7. 发明申请

WO2004053777A3 RECEIVER CASE FOR A SMART CARD ALLOWING TWO DIRECTIONS OF INSERTION 审中-公开
标题翻译：接收器的智能卡允许两种插入方向
公开(公告)号：WO2004053777A3
公开(公告)日：2004-08-05
申请号：PCT/EP0350952
申请日：2003-12-05
申请人： ITT MFG ENTERPRISES INC , MICHEL BRUNO , ROCHON SYLVAIN , VALCHER FABRICE
发明人： MICHEL BRUNO , ROCHON SYLVAIN , VALCHER FABRICE
IPC分类号： G06K7/00
CPC分类号： G06K7/0021
摘要： The invention provides a case (10), for a card having conducting pads on one face, of the type comprising a lower crosspiece (20) which carries a lower connector (36), characterized in that it includes an upper crosspiece (70), parallel to the lower crosspiece (20), which carries an upper connector (92), so that the case (10) has two connectors, namely a lower one (36) and an upper one (92), allowing electrical connection to the conducting pads on the card irrespective of the orientation - face down or face up - of the main face of the card.
摘要翻译：本发明提供了一种用于在一面上具有导电垫的卡的外壳（10），其类型包括承载下连接器（36）的下横档（20），其特征在于，它包括上横档（70）平行于承载上部连接器（92）的下部横梁（20），从而壳体（10）具有两个连接器，即下部连接器（36）和上部连接器（92），允许电连接到导电体无论卡的主面朝向如何 - 面朝下或面朝上 - 卡上的衬垫。

8. 发明申请

WO2004063969A1 FRAME FOR FITTING A SMART CARD CONNECTOR ONTO A PANEL 审中-公开
标题翻译：用于将智能卡连接器连接到面板上的框架
公开(公告)号：WO2004063969A1
公开(公告)日：2004-07-29
申请号：PCT/EP2004/050008
申请日：2004-01-09
申请人： ITT MANUFACTURING ENTERPRISES INC. , VALCHER, Fabrice , MICHEL, Bruno , ROCHON, Sylvain
发明人： VALCHER, Fabrice , MICHEL, Bruno , ROCHON, Sylvain
IPC分类号： G06K7/00
CPC分类号： G06K7/0021
摘要： The invention proposes a frame (14) intended to be fixed in a horizontal rectangular window and having a rear part (26) which carries a connector (12) and a front part (28) which has front lugs (42, 44) for positioning and catching in the window according to a bayonet-type fitting and two locking fingers (60) carried by an elastically deformable beam (62), which, at the end of the travel of the bayonet-type fitting, penetrate the window, characterized in that the beam (62) has a rear transverse branch (64) and two horizontal opposed front transverse branches (70), each of which extends forward and transversally outward, from the central part (68) of the rear branch (64), and carries a locking finger (60) at its front free end (74).
摘要翻译：本发明提出一种框架（14），其旨在被固定在水平矩形窗口中并具有一个后部（26），该后部（26）承载有连接器（12）和前部（28），前部具有用于定位的前凸耳（42,44）并且根据卡口式配件和由弹性可变形梁（62）承载的两个锁定指状物（60）捕捉在窗口中，在卡口式配件的行进结束时，该锁定指状物60穿透窗口，其特征在于梁（62）具有从后分支（64）的中心部分（68）向后并横向向外延伸的后横向分支（64）和两个水平相对的前横向分支（70），以及在其前自由端（74）处携带锁定指（60）。

9. 发明申请

WO2004056470A1 SURFACE TREATMENT 审中-公开
标题翻译：表面处理
公开(公告)号：WO2004056470A1
公开(公告)日：2004-07-08
申请号：PCT/IB2003/005129
申请日：2003-11-13
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , AMONTOV, Sergey , DELAMARCHE, Emmanuel , MICHEL, Bruno
发明人： AMONTOV, Sergey , DELAMARCHE, Emmanuel , MICHEL, Bruno
IPC分类号： B01J19/00
CPC分类号： G01N33/54366
摘要： A method for producing a monolayer of molecules on a surface comprises: loading a stamp with seed molecules; transferring seed molecules from the stamp to the surface; and, amplifying the seed molecules via an amplifying reaction to produce the monolayer. The method permit generation of complete monolayers from incomplete or sparse monolayers initially printed on the surface.
摘要翻译：在表面上产生单层分子的方法包括：用种子分子装载印模; 将种子分子从印模转移到表面; 并通过扩增反应扩增种子分子以产生单层。该方法允许从最初印刷在表面上的不完全或稀疏单层产生完整的单层。

10. 发明申请

WO2004022338A2 PRINTING IN A MEDIUM 审中-公开
标题翻译：在中文打印
公开(公告)号：WO2004022338A2
公开(公告)日：2004-03-18
申请号：PCT/IB2003/003834
申请日：2003-08-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , BIETSCH, Alexander , DELAMARCHE, Emmanuel , MICHEL, Bruno , SCHMID, Heinz , WOLF, Heiko
发明人： BIETSCH, Alexander , DELAMARCHE, Emmanuel , MICHEL, Bruno , SCHMID, Heinz , WOLF, Heiko
IPC分类号： B41F
CPC分类号： B01J19/0093 , B01J2219/00382 , B01J2219/00527 , B01J2219/0072 , B01J2219/0074 , B01J2219/00745 , B01J2219/00747 , B01J2219/00783 , B01J2219/00833 , B01L3/0293 , B01L2300/0819 , B41K1/30 , B41M3/006 , C40B30/08 , C40B40/18 , C40B60/14 , G01N35/1002 , G01N2035/1034 , H05K3/12 , Y10S977/887
摘要： A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.
摘要翻译：描述了在存在第三介质的情况下将图案从弹性印模转移到基板的方法。在印模和基板之间实现接近接触。将印模和基板之间的第三介质层控制到预定厚度。还描述了用于执行该方法的邮票。

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