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1. 发明申请

WO2007070534A3 ULTRA-HIGH DENSITY CONNECTOR 审中-公开
公开(公告)号：WO2007070534A3
公开(公告)日：2007-06-21
申请号：PCT/US2006/047434
申请日：2006-12-12
申请人： SARCOS INVESTMENTS LC , JACOBSEN, Stephen, C. , MARCEAU, David, P. , ZURN, Shayne
发明人： JACOBSEN, Stephen, C. , MARCEAU, David, P. , ZURN, Shayne
IPC分类号： H01R13/648
摘要： Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector (10) includes a bundle of substantially parallel elongate cylindrical elements (12), where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends (14) of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface (16). At least one of the elongate cylindrical elements has an electrically conductive contact (18) positioned to tangentially engage a corresponding electrical contact of a mating connector.

2. 发明申请

WO2007070534A2 ULTRA-HIGH DENSITY CONNECTOR 审中-公开
标题翻译：超高密度连接器
公开(公告)号：WO2007070534A2
公开(公告)日：2007-06-21
申请号：PCT/US2006047434
申请日：2006-12-12
申请人： SARCOS INVEST LC , JACOBSEN STEPHEN C , MARCEAU DAVID P , ZURN SHAYNE
发明人： JACOBSEN STEPHEN C , MARCEAU DAVID P , ZURN SHAYNE
IPC分类号： H01R13/648
CPC分类号： H01R13/22 , H01R13/005 , H01R13/025 , H01R13/26
摘要： Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector (10) includes a bundle of substantially parallel elongate cylindrical elements (12), where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends (14) of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface (16). At least one of the elongate cylindrical elements has an electrically conductive contact (18) positioned to tangentially engage a corresponding electrical contact of a mating connector.
摘要翻译：公开了用于超高密度连接的技术。在一个实施例中，超高密度连接器（10）包括一束基本平行的细长圆柱形元件（12），其中每个圆柱形元件基本上与至少一个相邻的圆柱形元件接触。细长圆柱形元件的端部（14）相对于彼此差异地设置以限定三维交错配合表面（16）。细长圆柱形元件中的至少一个具有导电接触件（18），其被定位成切向地接合配合连接器的相应电接触件。

3. 发明申请

WO2009089538A2 GRIN LENS MICROSCOPE SYSTEM 审中-公开
标题翻译： GRIN镜头显微系统
公开(公告)号：WO2009089538A2
公开(公告)日：2009-07-16
申请号：PCT/US2009/030758
申请日：2009-01-12
申请人： STERLING LC , JACOBSEN, Stephen, C. , MARCEAU, David, P.
发明人： JACOBSEN, Stephen, C. , MARCEAU, David, P.
IPC分类号： G02B21/00 , G02B25/00 , G02B21/02 , G02B3/00 , G02B13/00 , G02B9/00
CPC分类号： G02B21/0008 , A61B1/00188 , G02B3/0087 , G02B6/08 , G02B6/32 , G02B21/36 , G02B23/2407
摘要： A device for magnifying an object comprising an SSID (15) having at least one imaging array disposed on a distal end (16) thereof. The device further comprises a first optical element (20) disposed on the distal end (16) of the SSID (15) wherein the first optical element (20) has a distal end (21) and a proximal end (22) defining a first longitudinal length. A GRIN lens (25) is disposed on the distal end (21) of the first optical element (20) and a second optical element (30) is disposed on the distal end (21) of the GRIN lens (25) defining a second longitudinal length. The first longitudinal length and the second longitudinal length are configured such that when viewing the object at a predetermined wavelength of light, the object is magnified at a predetermined level of magnification and the focal plane of the magnified object is aligned at the proximal end (22) of the first optical element (20).
摘要翻译：一种用于放大包括具有布置在其远端（16）上的至少一个成像阵列的SSID（15）的对象的设备。该装置还包括设置在SSID（15）的远端（16）上的第一光学元件（20），其中第一光学元件（20）具有远端（21）和近端（22），限定第一光学元件纵向长度。 GRIN透镜（25）设置在第一光学元件（20）的远端（21）上，并且第二光学元件（30）设置在GRIN透镜（25）的远端（21）上，限定第二光学元件纵向长度。第一纵向长度和第二纵向长度被配置成使得当以预定波长的光观察物体时，物体以预定的放大倍数放大并且放大物体的焦平面在近端（22 ）的第一光学元件（20）。

4. 发明申请

WO2007070533A3 ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE 审中-公开
标题翻译：电路微电路到电路接口
公开(公告)号：WO2007070533A3
公开(公告)日：2008-06-05
申请号：PCT/US2006047432
申请日：2006-12-12
申请人： SARCOS INVEST LC , JACOBSEN STEPHEN C , MARCEAU DAVID P , ZURN SHAYNE
发明人： JACOBSEN STEPHEN C , MARCEAU DAVID P , ZURN SHAYNE
IPC分类号： H01L23/52
CPC分类号： H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要： Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection (90) includes forming (92) a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding (94) the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. One microelectronic circuit (10) can include a bundle (16) of microfilaments (18) bonded to corresponding bond pads (14) to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译：公开了用于微电子电路的电互连的装置和方法。电互连（90）的一种方法包括形成（92）一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。该方法还可以包括将微丝结合（94）到微电子电路基板的相应接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。一个微电子电路（10）可以包括结合到对应的接合焊盘（14）的微丝束（16），以在对应的接合焊盘和微丝的导电部分之间进行电连接。

5. 发明申请

WO2006060777A2 MINIATURIZED UTILITY DEVICE HAVING INTEGRATED OPTICAL CAPABILITIES 审中-公开
标题翻译：具有集成光学能力的微型实用设备
公开(公告)号：WO2006060777A2
公开(公告)日：2006-06-08
申请号：PCT/US2005/043944
申请日：2005-12-02
申请人： SARCOS INVESTMENTS LC , JACOBSEN, Stephen, C. , MARKUS, David, T. , MARCEAU, David, P. , PENSEL, Ralph, W. , ZURN, Shayne, M.
发明人： JACOBSEN, Stephen, C. , MARKUS, David, T. , MARCEAU, David, P. , PENSEL, Ralph, W. , ZURN, Shayne, M.
IPC分类号： H04N5/225
CPC分类号： A61B1/05 , A61B1/018 , A61B1/051 , A61B1/053 , A61B1/12 , H04N5/2251 , H04N5/2252 , H04N5/2256 , H04N2005/2255
摘要： A miniaturized utility device 10 having integrated optical capabilities for use on a high aspect ratio system, wherein the miniaturized utility device 10 comprises: (a) a micro camera 14 comprising a solid state micro imaging device 84 including, as an integral structure, an imaging array 110 electrically coupled to a conductive pad 88, wherein the solid state imaging device 84 further includes at least one utility aperture 102 passing therethrough, and a lens 92 optically coupled to the imaging array 110; and (b) a micro utility instrument 18 configured for coordinated operation with the micro camera 14 at a common local site, wherein the micro utility instrument 18 is configured to perform a designated function viewable, preferably in real-time, via a camera image generated by the micro camera 14.
摘要翻译：具有用于高宽比系统的集成光学能力的小型化实用设备10，其中小型化实用设备10包括：（a）微型照相机14，其包括固体微型成像设备84，其包括作为整体结构的成像阵列110电耦合到导电焊盘88，其中固态成像装置84还包括通过其中的至少一个应用孔102和与成像阵列110光耦合的透镜92; 和（b）微型实用仪器18，其被配置为在公共的局部位置处与微型摄像机14协调操作，其中微型实用仪器18被配置为经由相机图像生成，优选实时地执行指定的功能通过微型相机14。

6. 发明申请

WO2009089538A3 GRIN LENS MICROSCOPE SYSTEM 审中-公开
标题翻译： GRIN LENS MICROSCOPE系统
公开(公告)号：WO2009089538A3
公开(公告)日：2009-11-19
申请号：PCT/US2009030758
申请日：2009-01-12
申请人： STERLING LC , JACOBSEN STEPHEN C , MARCEAU DAVID P
发明人： JACOBSEN STEPHEN C , MARCEAU DAVID P
IPC分类号： G02B21/00 , G02B3/00 , G02B9/00 , G02B13/00 , G02B21/02 , G02B25/00
CPC分类号： G02B21/0008 , A61B1/00188 , G02B3/0087 , G02B6/08 , G02B6/32 , G02B21/36 , G02B23/2407
摘要： A device for magnifying an object comprising an SSID (15) having at least one imaging array disposed on a distal end (16) thereof. The device further comprises a first optical element (20) disposed on the distal end (16) of the SSID (15) wherein the first optical element (20) has a distal end (21) and a proximal end (22) defining a first longitudinal length. A GRIN lens (25) is disposed on the distal end (21) of the first optical element (20) and a second optical element (30) is disposed on the distal end (21) of the GRIN lens (25) defining a second longitudinal length. The first longitudinal length and the second longitudinal length are configured such that when viewing the object at a predetermined wavelength of light, the object is magnified at a predetermined level of magnification and the focal plane of the magnified object is aligned at the proximal end (22) of the first optical element (20).
摘要翻译：一种用于放大对象的装置，包括具有设置在其远端（16）上的至少一个成像阵列的SSID（15）。该装置还包括设置在SSID（15）的远端（16）上的第一光学元件（20），其中第一光学元件（20）具有远端（21）和近端（22），其限定第一纵长。 GRIN透镜（25）设置在第一光学元件（20）的远端（21）上，并且第二光学元件（30）设置在GRIN透镜（25）的远端（21）上，限定第二光学元件纵长。第一纵向长度和第二纵向长度被构造成使得当以预定波长的光线观察物体时，物体以预定的放大倍率放大，并且放大对象的焦平面在近端（22）处对准）的第一光学元件（20）。

7. 发明申请

WO2007114846A3 MULTI-ELEMENT PROBE ARRAY 审中-公开
标题翻译：多元素探索阵列
公开(公告)号：WO2007114846A3
公开(公告)日：2008-09-25
申请号：PCT/US2006047433
申请日：2006-12-12
申请人： SARCOS INVEST LC , JACOBSEN STEPHEN C , MARCEAU DAVID P , ZURN SHAYNE
发明人： JACOBSEN STEPHEN C , MARCEAU DAVID P , ZURN SHAYNE
IPC分类号： A61B5/04
CPC分类号： H01R11/18 , A61B5/04001 , A61B5/6868 , A61B5/6877 , A61N1/0529 , A61N1/0551 , H01R2201/12 , Y10T29/49117
摘要： A multi-element probe array suitable for sensing or stimulating is disclosed. On one embodiment, the multi-element probe array (10) includes a plurality of microfibers (12) extending longitudinally and oriented substantially parallel to form a bundle. Prob elements (14) are defined by a first subset of the microfibers displaced in a forward direction along the longitudinal axis relative to spacer elements defined by a second subset of the microfibers. Interface elements (20) and communication elements (22) are disposed on the probe elements.
摘要翻译：公开了一种适用于感测或刺激的多元件探针阵列。在一个实施例中，多元件探针阵列（10）包括多个微纤维（12），所述多个微纤维纵向延伸并且基本平行取向以形成束。探针元件（14）由相对于由微纤维的第二子集限定的间隔元件沿着纵向轴向前移位的微纤维的第一子集限定。接口元件（20）和通信元件（22）设置在探针元件上。

8. 发明申请

WO2006060777A3 MINIATURIZED UTILITY DEVICE HAVING INTEGRATED OPTICAL CAPABILITIES 审中-公开
标题翻译：具有集成光学能力的微型实用设备
公开(公告)号：WO2006060777A3
公开(公告)日：2008-01-24
申请号：PCT/US2005043944
申请日：2005-12-02
申请人： SARCOS INVEST LC , JACOBSEN STEPHEN C , MARKUS DAVID T , MARCEAU DAVID P , PENSEL RALPH W , ZURN SHAYNE M
发明人： JACOBSEN STEPHEN C , MARKUS DAVID T , MARCEAU DAVID P , PENSEL RALPH W , ZURN SHAYNE M
IPC分类号： H04N7/14
CPC分类号： A61B1/05 , A61B1/018 , A61B1/051 , A61B1/053 , A61B1/12 , H04N5/2251 , H04N5/2252 , H04N5/2256 , H04N2005/2255
摘要： A miniaturized utility device 10 having integrated optical capabilities for use on a high aspect ratio system, wherein the miniaturized utility device 10 comprises: (a) a micro camera 14 comprising a solid state micro imaging device 84 including, as an integral structure, an imaging array 110 electrically coupled to a conductive pad 88, wherein the solid state imaging device 84 further includes at least one utility aperture 102 passing therethrough, and a lens 92 optically coupled to the imaging array 110; and (b) a micro utility instrument 18 configured for coordinated operation with the micro camera 14 at a common local site, wherein the micro utility instrument 18 is configured to perform a designated function viewable, preferably in real-time, via a camera image generated by the micro camera 14.
摘要翻译：具有用于高宽比系统的集成光学能力的小型化实用设备10，其中小型化实用设备10包括：（a）微型照相机14，其包括固体微型成像设备84，其包括作为整体结构的成像阵列110电耦合到导电焊盘88，其中固态成像装置84还包括通过其中的至少一个应用孔102和与成像阵列110光耦合的透镜92; 和（b）微型实用仪器18，其被配置为在公共的局部位置处与微型摄像机14协调操作，其中微型实用仪器18被配置为经由相机图像生成，优选实时地执行指定的功能通过微型相机14。

9. 发明申请

WO2007114846A2 MULTI-ELEMENT PROBE ARRAY 审中-公开
标题翻译：多元素探索阵列
公开(公告)号：WO2007114846A2
公开(公告)日：2007-10-11
申请号：PCT/US2006/047433
申请日：2006-12-12
申请人： SARCOS INVESTMENTS LC , JACOBSEN, Stephen, C. , MARCEAU, David, P. , ZURN, Shayne
发明人： JACOBSEN, Stephen, C. , MARCEAU, David, P. , ZURN, Shayne
IPC分类号： F41A23/00 , B64D7/00
CPC分类号： H01R11/18 , A61B5/04001 , A61B5/6868 , A61B5/6877 , A61N1/0529 , A61N1/0551 , H01R2201/12 , Y10T29/49117
摘要： A multi-element probe array suitable for sensing or stimulating is disclosed. On one embodiment, the multi-element probe array (10) includes a plurality of microfibers (12) extending longitudinally and oriented substantially parallel to form a bundle. Prob elements (14) are defined by a first subset of the microfibers displaced in a forward direction along the longitudinal axis relative to spacer elements defined by a second subset of the microfibers. Interface elements (20) and communication elements (22) are disposed on the probe elements.
摘要翻译：公开了一种适用于感测或刺激的多元件探针阵列。在一个实施例中，多元件探针阵列（10）包括多个微纤维（12），所述多个微纤维纵向延伸并且基本平行取向以形成束。探针元件（14）由相对于由微纤维的第二子集限定的间隔元件沿着纵向轴向前移位的微纤维的第一子集限定。接口元件（20）和通信元件（22）设置在探针元件上。

10. 发明申请

WO2007070533A2 ELECTRICAL MICROFILAMENT TO CIRCUIT INTERFACE 审中-公开
标题翻译：电路微电路到电路接口
公开(公告)号：WO2007070533A2
公开(公告)日：2007-06-21
申请号：PCT/US2006/047432
申请日：2006-12-12
申请人： SARCOS INVESTMENTS LC , JACOBSEN, Stephen, C. , MARCEAU, David, P. , ZURN, Shayne
发明人： JACOBSEN, Stephen, C. , MARCEAU, David, P. , ZURN, Shayne
IPC分类号： H01L23/52
CPC分类号： H01L23/4952 , H01L24/43 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/43 , H01L2224/45012 , H01L2224/45013 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45188 , H01L2224/4554 , H01L2224/45578 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/49113 , H01L2224/4912 , H01L2224/49171 , H01L2224/85205 , H01L2224/85801 , H01L2224/8582 , H01L2224/8585 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H05K3/321 , H05K3/328 , H05K3/3421 , H05K2201/10287 , H05K2201/10356 , Y02P70/613 , H01L2924/20751 , H01L2924/00 , H01L2224/05599
摘要： Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection (90) includes forming (92) a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding (94) the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. One microelectronic circuit (10) can include a bundle (16) of microfilaments (18) bonded to corresponding bond pads (14) to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.
摘要翻译：公开了用于微电子电路的电互连的装置和方法。电互连（90）的一种方法包括形成（92）一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。该方法还可以包括将微丝结合（94）到微电子电路基板的相应接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。一个微电子电路（10）可以包括结合到对应的接合焊盘（14）的微丝束（16），以在对应的接合焊盘和微丝的导电部分之间进行电连接。

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