基本信息:
- 专利标题: IMPROVED SINGULATION SYSTEM AND METHOD
- 专利标题(中):改进的模拟系统和方法
- 申请号:PCT/SG2006000399 申请日:2006-12-20
- 公开(公告)号:WO2007073356A3 公开(公告)日:2007-08-16
- 发明人: LIM CHONG CHEN GARY , BAEK SEUNG HO , JUNG JONG JAE , SHIN YUN SUK , SHEN XUE FANG , LING NEE SENG , ANG SOO LOO
- 申请人: ROKKO SYSTEMS PTE LTD , LIM CHONG CHEN GARY , BAEK SEUNG HO , JUNG JONG JAE , SHIN YUN SUK , SHEN XUE FANG , LING NEE SENG , ANG SOO LOO
- 专利权人: ROKKO SYSTEMS PTE LTD,LIM CHONG CHEN GARY,BAEK SEUNG HO,JUNG JONG JAE,SHIN YUN SUK,SHEN XUE FANG,LING NEE SENG,ANG SOO LOO
- 当前专利权人: ROKKO SYSTEMS PTE LTD,LIM CHONG CHEN GARY,BAEK SEUNG HO,JUNG JONG JAE,SHIN YUN SUK,SHEN XUE FANG,LING NEE SENG,ANG SOO LOO
- 优先权: SG2005082631 2005-12-20; SG2006013130 2006-03-03; SG2006075345 2006-11-03
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; B28D5/00 ; B81C1/00 ; H01L21/304 ; H01L21/67 ; H01L21/784
摘要:
A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a longitudinal cutting device for cutting the linear portions of the IC unit, said cutting means located within a singulation zone.
摘要(中):
一种用于从衬底分离IC单元的系统,所述IC单元具有线性和非线性外围边缘的组合,所述系统包括用于切割IC单元的非线性部分的轮廓切割装置; 用于切割IC单元的线性部分的纵向切割装置,所述切割装置位于分割区内。
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |