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    • 3. 发明申请
    • AGENT FOR INCREASING SELECTION RATIO OF POLISHING RATES
    • 增加抛光率选择比例的代理
    • WO2004078410A3
    • 2004-11-04
    • PCT/JP2004002680
    • 2004-03-03
    • KAO CORPEBARA CORPHAGIHARA TOSHIYAWADA YUTAKAAKATSUKA TOMOHIKOSASAKI TATSUYA
    • HAGIHARA TOSHIYAWADA YUTAKAAKATSUKA TOMOHIKOSASAKI TATSUYA
    • B24B7/22B24B37/00B24B57/00C09G1/00C09K3/14H01L21/304H01L21/3105
    • C09G1/04B24B7/228B24B57/00H01L21/31053
    • An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the agent is provided as a component of a polishing composition used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; a polishing composition which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the polishing composition comprises the above agent, and wherein the polishing composition is used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; and a process for increasing a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, comprising the step of applying the polishing composition to a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin.
    • 一种用于提高抛光速率选择率的试剂,其中所述试剂包括有机阳离子化合物,其增加了氮化硅膜的研磨速率与氧化硅膜的研磨速率的比率,其中所述试剂被提供为 与固定研磨抛光工具一起使用的抛光组合物的组分,其包括包含磨料颗粒和树脂的抛光构件; 抛光组合物,其将氮化硅膜的研磨速度与氧化硅膜的研磨速度的比率增加,其中所述抛光组合物包含上述试剂,并且其中所述抛光组合物与固定的研磨抛光工具一起使用,所述固定研磨抛光工具包括 包括磨粒和树脂的抛光构件; 以及提高氮化硅膜的研磨速度与氧化硅膜的研磨速度的比例的方法,其特征在于,包括将研磨用组合物涂布在固定研磨用抛光工具上的工序,所述研磨抛光工具包括研磨材料,所述研磨部件包括磨粒和树脂 。
    • 5. 发明申请
    • AGENT FOR INCREASING SELECTION RATIO OF POLISHING RATES
    • 代理商提高抛光率的选择比例
    • WO2004078410A2
    • 2004-09-16
    • PCT/JP2004/002680
    • 2004-03-03
    • KAO CORPORATIONEBARA CORPORATIONHAGIHARA, ToshiyaWADA, YutakaAKATSUKA, TomohikoSASAKI, Tatsuya
    • HAGIHARA, ToshiyaWADA, YutakaAKATSUKA, TomohikoSASAKI, Tatsuya
    • B24B
    • C09G1/04B24B7/228B24B57/00H01L21/31053
    • An agent for increasing a selection ratio of polishing rates, wherein the agent comprises an organic cationic compound, which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the agent is provided as a component of a polishing composition used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; a polishing composition which increases a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, wherein the polishing composition comprises the above agent, and wherein the polishing composition is used together with a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin; and a process for increasing a ratio of a polishing rate of a silicon nitride film to a polishing rate of a silicon oxide film, comprising the step of applying the polishing composition to a fixed abrasive polishing tool comprising a polishing member comprising abrasive grains and a resin.
    • 用于增加抛光速率的选择比的试剂,其中所述试剂包含有机阳离子化合物,其增加氮化硅膜的抛光速率与氧化硅膜的抛光速率的比率 其中,所述试剂作为与固定磨料抛光工具一起使用的抛光组合物的组分提供,所述固定磨料抛光工具包括含有磨料颗粒和树脂的抛光部件; 提供一种抛光组合物,其增加氮化硅膜的抛光速率与氧化硅膜的抛光速率的比率,其中所述抛光组合物包含上述试剂,并且其中所述抛光组合物与固定磨料抛光工具一起使用,所述固定磨料抛光工具包括 包含磨粒和树脂的抛光部件; 以及提高氮化硅膜的研磨速度相对于氧化硅膜的研磨速度的比率的方法,其特征在于,包括将研磨用组合物涂布于由研磨材料和树脂构成的研磨材料