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    • 2. 发明申请
    • GAS DISTRIBUTION SHOWERHEAD WITH COATING MATERIAL FOR SEMICONDUCTOR PROCESSING
    • 具有涂层材料的气体分布式淋浴器用于半导体加工
    • WO2011100109A3
    • 2011-10-27
    • PCT/US2011022418
    • 2011-01-25
    • APPLIED MATERIALS INCSUN JENNIFERTHACH SENHDUAN RENGUANGRAVES THOMAS
    • SUN JENNIFERTHACH SENHDUAN RENGUANGRAVES THOMAS
    • H01L21/316H01L21/205
    • H01J37/3244C23C4/02C23C4/11C23C4/18
    • Described herein are exemplary methods and apparatuses for fabricating a gas distribution showerhead assembly in accordance with one embodiment. In one embodiment, a method includes providing a gas distribution plate having a first set of through-holes for delivering processing gases into a semiconductor processing chamber. The first set of through-holes is located on a backside of the plate (e.g., Aluminum substrate). The method includes spraying (e.g., plasma spraying) a coating material (e.g., Ytrria based material) onto a cleaned surface of the gas distribution plate. The method includes removing (e.g., surface grinding) a portion of the coating material from the surface to reduce a thickness of the coating material. The method includes forming (e.g., UV laser drilling, machining) a second set of through-holes in the coating material such that the through-holes are aligned with the first-set of through-holes.
    • 这里描述了根据一个实施例的用于制造气体分配喷头组件的示例性方法和装置。 在一个实施例中,一种方法包括提供具有第一组通孔的气体分配板,用于将处理气体输送到半导体处理室中。 第一组通孔位于板的背面(例如铝基板)上。 该方法包括将涂料(例如,基于Ytrria的材料)喷雾(例如,等离子体喷涂)到气体分配板的清洁表面上。 该方法包括从表面去除(例如,表面研磨)涂层材料的一部分以减少涂层材料的厚度。 该方法包括在涂层材料中形成(例如UV激光钻孔,加工)第二组通孔,使得通孔与第一组通孔对齐。
    • 3. 发明申请
    • GAS DISTRIBUTION SHOWERHEAD WITH COATING MATERIAL FOR SEMICONDUCTOR PROCESSING
    • 用于半导体加工的带涂层材料的气体分配喷头
    • WO2011100109A2
    • 2011-08-18
    • PCT/US2011/022418
    • 2011-01-25
    • APPLIED MATERIALS, INC.SUN, JenniferTHACH, SenhDUAN, RenguanGRAVES, Thomas
    • SUN, JenniferTHACH, SenhDUAN, RenguanGRAVES, Thomas
    • H01L21/316H01L21/205
    • H01J37/3244C23C4/02C23C4/11C23C4/18
    • Described herein are exemplary methods and apparatuses for fabricating a gas distribution showerhead assembly in accordance with one embodiment. In one embodiment, a method includes providing a gas distribution plate having a first set of through-holes for delivering processing gases into a semiconductor processing chamber. The first set of through-holes is located on a backside of the plate (e.g., Aluminum substrate). The method includes spraying (e.g., plasma spraying) a coating material (e.g., Ytrria based material) onto a cleaned surface of the gas distribution plate. The method includes removing (e.g., surface grinding) a portion of the coating material from the surface to reduce a thickness of the coating material. The method includes forming (e.g., UV laser drilling, machining) a second set of through-holes in the coating material such that the through-holes are aligned with the first-set of through-holes.
    • 这里描述了根据一个实施例的用于制造气体分配喷头组件的示例性方法和设备。 在一个实施例中,一种方法包括提供具有用于将处理气体输送到半导体处理室中的第一组通孔的气体分配板。 第一组通孔位于板的背面(例如,铝基板)上。 该方法包括将涂层材料(例如,基于Ytrria的材料)喷射(例如等离子喷涂)到气体分配板的清洁表面上。 该方法包括从表面去除(例如,表面研磨)一部分涂层材料以减小涂层材料的厚度。 该方法包括在涂层材料中形成(例如UV激光钻孔,加工)第二组通孔,使得通孔与第一组通孔对准。