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1. 发明申请

WO2009030611A2 ENERGY STORAGE SYSTEM 审中-公开
标题翻译：能量存储系统
公开(公告)号：WO2009030611A2
公开(公告)日：2009-03-12
申请号：PCT/EP2008061178
申请日：2008-08-27
申请人： CONTINENTAL AUTOMOTIVE GMBH , BAUR FRANK , GOETTE CARSTEN
发明人： BAUR FRANK , GOETTE CARSTEN
IPC分类号： H01M10/52
CPC分类号： H01G9/155 , H01G9/08 , H01M10/4235 , H01M10/52 , Y02E60/13 , Y02T10/7022
摘要： The invention relates to an energy storage system with an electric component (10), a solvent (20) and a protective device which chemically binds the decomposition products (25) of the solvent. According to the invention, any damage to the surroundings, which could be caused by the decomposition products of the solvent, can be prevented using this energy storage system.
摘要翻译：本发明涉及一种能量存储系统的电气部件（10），溶剂（20）和以化学结合的溶剂的分解产物（25）的保护装置。伤害由溶剂的降解产物的环境可以与该能量存储系统来避免。

2. 发明申请

WO2009053255A3 INTERCONNECT DEVICE HAVING HIGH COMPONENT DENSITY 审中-公开
标题翻译：具有高密度组分电路载体
公开(公告)号：WO2009053255A3
公开(公告)日：2009-06-11
申请号：PCT/EP2008063602
申请日：2008-10-10
申请人： CONTINENTAL AUTOMOTIVE GMBH , BAUR FRANK , GOETTE CARSTEN
发明人： BAUR FRANK , GOETTE CARSTEN
IPC分类号： H05K1/16 , H01C7/00 , H05K3/40 , H05K3/46
CPC分类号： H05K1/167 , H05K1/0298 , H05K1/095 , H05K1/162 , H05K3/4069 , H05K2201/0187 , H05K2201/096
摘要： The invention relates to a interconnect device (1) comprising a circuit board (2), preferably a multi-layer circuit board (2), having an upper circuit board side (5) and a lower circuit board side (6) preferably parallel thereto, wherein electrical components (7; 8; 9) and conductors (10) are disposed on the upper circuit board side (5) and/or the lower circuit board side (6) and/or preferably on upper or lower inner layer sides (11; 12) of the multi-layer circuit board (2), electrically conductively connecting the components (7; 8; 9) to each other, and wherein the circuit board (2) comprises at least one through, interior, or blind recess (13; 15), wherein the recess (13; 15) comprises at least one fill (16) of at least one electrically conductive substance, wherein the recess (13; 15) is filled and the fill (16) has an electrically conductive connection to the conductors (10) opening into the recess (13; 15) such that an ohmic or capacitative resistance is formed in the recess (13; 15).
摘要翻译：本发明涉及一种电路载体（1），包括：印刷电路板（2），优选的多层印刷电路板（2）与印刷电路板的上侧（5）和一个最好平行于此电路板底座（6），其特征在于，在所述印刷电路板的上侧（5）和/或在印刷电路板下侧（6）和/或优选上Innenlagenober-和/或底部表面（11; 12）的多层印刷电路板（2）的电气元件（7; 8; 9）和导体（10）布置，所述元件（7; 8; 9）导电地相互连接，并且其中，所述电路板（2）的至少一个连续的内部或盲孔状的凹部（13;包括15），所述凹部（13; 15）至少一个填充（16）与至少一种导电性物质，其中，所述凹部（13; 15）是这样的填充和填充（16）连接在所述凹部（13; 15）打开导体轨迹（10）矗立在导电连接，电子在凹部（欧姆和/或电容性阻抗13; 15）形成。

3. 发明申请

WO2008071576A2 CIRCUIT ARRANGEMENT AND METHOD FOR PRODUCING A CIRCUIT ARRANGEMENT 审中-公开
标题翻译：电路布置和制造电路布置的方法
公开(公告)号：WO2008071576A2
公开(公告)日：2008-06-19
申请号：PCT/EP2007063165
申请日：2007-12-03
申请人： CONTINENTAL AUTOMOTIVE GMBH , BAUR FRANK , BERNHARDT ANDREAS , BREY ROLAND , GOETTE CARSTEN , GOETZENBERGER MARTIN , REKOFSKY ANDREAS , SCHINGALE ANGELIKA
发明人： BAUR FRANK , BERNHARDT ANDREAS , BREY ROLAND , GOETTE CARSTEN , GOETZENBERGER MARTIN , REKOFSKY ANDREAS , SCHINGALE ANGELIKA
IPC分类号： H05K3/30 , H05K3/36
CPC分类号： H05K1/111 , H01L23/10 , H01L24/27 , H01L24/28 , H01L24/32 , H01L24/83 , H01L2224/0401 , H01L2224/05557 , H01L2224/48091 , H01L2224/48472 , H01L2224/81894 , H01L2224/83141 , H01L2224/83205 , H01L2224/83365 , H01L2224/83385 , H01L2224/83801 , H01L2224/83894 , H01L2224/85205 , H01L2224/85365 , H01L2224/85895 , H01L2924/01005 , H01L2924/01019 , H01L2924/01075 , H01L2924/07811 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H05K3/325 , H05K3/36 , H05K2201/0373 , H05K2201/10628 , H05K2201/10636 , H05K2201/10969 , H05K2201/209 , H05K2203/0307 , Y02P70/611 , H01L2924/00014 , H01L2924/00
摘要： A problem addressed by the present invention is that of connecting at least two components (10) together mechanically and/or electrically. According to the invention, this problem is solved in a circuit arrangement with at least two components (10), each having a contact surface (12), by the fact that at least one of the contact surfaces (12) is roughened and the components (10) are connected galvanically and/or mechanically using a press connection of the contact surfaces (12). An advantage of the invention consists of the fact that for creating the connection it is not mandatory for an auxiliary agent (e. g., solder, adhesive, screws, rivets, etc.) to be required. The invention is particularly suited to an automated fixing function and, if applicable, also to a sealing function. Advantageously, soldering processes of known type, e.g., can be replaced or improved. In addition, the invention can be used to advantage in the construction and thermal attachment of heat sinks.
摘要翻译：本发明的目的是机械地和/或电气地互连至少两个部件（10）。根据本发明，该目的的电路装置实现了具有至少两种组分（10）由所述接触面的挤压连接具有接触表面（12），在接触表面中的至少一个（12）实现粗糙化和部件（10）（12 ）电连接和/或机械连接。本发明的优点在于，对于需要助剂（例如焊料，粘合剂，螺钉，铆钉等）的化合物的产生来说不是绝对必要的。本发明特别适用于自动化固定以及可能还用于密封功能。有利地，因为。 B.已知类型的焊接工艺被替换或改进。此外，本发明可以有利地用于散热器的设计和热连接。

4. 发明申请

WO2009043649A3 THREE-DIMENSIONAL ELECTRONIC CIRCUIT BOARD STRUCTURE, AND CIRCUIT BOARD BASE COMPRISING SAID CIRCUIT BOARD STRUCTURE AS A FUNCTIONAL COMPONENT AND THREE-DIMENSIONAL CIRCUIT ASSEMBLY CONSISTING OF AT LEAST TWO SUCH THREE-DIMENSIONAL CIRCUIT BOARD STRU 审中-公开
标题翻译：三维电子电路载体建设和电路基本载体，包括电路载体结构作为功能成分和三维电路，包括至少两个这样的三维SCHALTU
公开(公告)号：WO2009043649A3
公开(公告)日：2009-10-29
申请号：PCT/EP2008061346
申请日：2008-08-28
申请人： CONTINENTAL AUTOMOTIVE GMBH , BERNHARDT ANDREAS , DEML ULRICH , GOETTE CARSTEN , SCHINGALE ANGELIKA
发明人： BERNHARDT ANDREAS , DEML ULRICH , GOETTE CARSTEN , SCHINGALE ANGELIKA
IPC分类号： H05K1/14
CPC分类号： H05K1/14 , H05K1/0203 , H05K1/0278 , H05K1/141 , H05K1/181 , H05K1/183 , H05K1/184 , H05K3/301 , H05K3/366 , H05K3/403 , H05K2201/046 , H05K2201/047 , H05K2201/048 , H05K2201/09145 , H05K2201/09172 , H05K2201/09181 , H05K2201/10189 , H05K2201/10287 , H05K2201/10401 , H05K2201/10409 , H05K2201/10446 , H05K2201/1059
摘要： The invention relates to a three-dimensional electrical circuit board structure comprising at least two interconnected planar, two-dimensional substrates that have contact elements and that are preferably equipped on both sides with electronic components, the substrates forming substrate walls that are arranged at an angle of
摘要翻译：本发明涉及一种具有至少两个相互连接的平面的，其具有触点接通二维基底板的三维电路支撑结构，并且在两侧上具有电子元件优选地装备，其特征在于，其被布置成一个角度<180°彼此衬底板形式的基底板墙壁，有利地设置，导致具有基底板的壁，并且其中电导体装置之间产生的开放空间的三维空间形本体，其进行从基板板壁电流到相邻基底板壁，以及具有这样的电路支撑结构的电路基体支承和三维电路装置，由至少两个这种三维电路载体组件组成。

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