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    • 5. 发明申请
    • PLANAR MAGNETIC TUNNEL JUNCTION SUBSTRATE HAVING RECESSED ALIGNMENT MARKS
    • 具有对准标记的平面磁铁隧道接头基板
    • WO2005010975A1
    • 2005-02-03
    • PCT/US2003/019773
    • 2003-06-24
    • INTERNATIONAL BUSINESS MACHINES CORPORATIONGAIDIS, Michael, C.
    • GAIDIS, Michael, C.
    • H01L21/46
    • H01L21/3212B82Y10/00H01L23/544H01L27/222H01L2223/54426H01L2223/54453H01L2924/0002H01L2924/00
    • A method for forming an alignment mark structure (148) for a semiconductor device includes forming an alignment recess (130) at a selected level of the semiconductor device substrate. A first metal layer (140) is formed over the selected substrate level and within the alignment recess (130), wherein the alignment recess (130) is formed at a depth such that the first metal layer (140) only partially fills the alignment recess (130). A second metal layer (142) is formed over the first metal layer (140) such that the alignment recess (130) is completely filled. The second metal layer (142) and the first metal layer (140) are then planarized down to the selected substrate level, thereby creating a sacrificial plug (144) of the second layer material within the alignment recess. The sacrificial plug (144) is removed in a manner so as not to substantially roughen the planarized surface at the selected substrate level.
    • 一种用于形成用于半导体器件的对准标记结构(148)的方法包括在半导体器件衬底的选定级别形成对准凹槽(130)。 第一金属层(140)形成在所选择的基底层上并且在对准凹槽(130)内,其中对准凹槽(130)形成在一定深度处,使得第一金属层(140)仅部分地填充对准凹槽 (130)。 在第一金属层(140)之上形成第二金属层(142),使得对准凹槽(130)被完全填充。 然后将第二金属层(142)和第一金属层(140)平坦化到所选择的衬底水平,从而在对准凹槽内形成第二层材料的牺牲插塞(144)。 以牺牲基板水平的平坦化表面粗糙化的方式去除牺牲塞(144)。
    • 8. 发明申请
    • MAGNETIC DEVICES AND TECHNIQUES FOR FORMATION THEREOF
    • 磁性装置及其形成技术
    • WO2007024300A2
    • 2007-03-01
    • PCT/US2006017418
    • 2006-05-04
    • IBMKANAKASABAPATHY SIVANANDA KGAIDIS MICHAEL C
    • KANAKASABAPATHY SIVANANDA KGAIDIS MICHAEL C
    • H01L21/336
    • H01L43/12H01L21/76897H01L27/222H01L43/08H01L2924/3011
    • Techniques for forming a magnetic device are provided. In one aspect, a method of forming a via hole self-aligned with a magnetic device comprises the following steps. A dielectric layer is formed over at least a portion of the magnetic device. The dielectric layer is configured to have an underlayer proximate to the magnetic device which comprises a first material, and an overlayer on a side of the underlayer opposite the magnetic device which comprises a second material. The first material is different from the second material. In a first etching phase, a first etchant is used to etch the dielectric layer, beginning with the overlayer, and through the overlayer. In a second etching phase, a second etchant which is selective for etching the underlayer is used to etch the dielectric layer through the underlayer.
    • 提供了用于形成磁性装置的技术。 一方面,形成与磁性装置自对准的通孔的方法包括以下步骤。 在磁性器件的至少一部分上形成电介质层。 电介质层被配置为具有靠近磁性装置的底层,其包括第一材料,并且在与包括第二材料的磁性装置相对的底层的一侧上的覆盖层。 第一种材料与第二种材料不同。 在第一蚀刻阶段中,使用第一蚀刻剂来从覆盖层开始并通过覆盖层来蚀刻介电层。 在第二蚀刻阶段中,使用用于蚀刻底层的第二蚀刻剂来蚀刻通过底层的介电层。