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1. 发明申请

WO2003024172A3 A METHOD OF ETCHING COPPER ON CARDS 审中-公开
公开(公告)号：WO2003024172A3
公开(公告)日：2003-03-20
申请号：PCT/SE2002/001602
申请日：2002-09-09
申请人： OBDUCAT AKTIEBOLAG , FRENNESSON, Göran , BIERINGS, Gust , BJARNASON, Bjarni , SJÖBERG, Jenny
发明人： FRENNESSON, Göran , BIERINGS, Gust , BJARNASON, Bjarni , SJÖBERG, Jenny
IPC分类号： H05K3/07
摘要： Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte comprising a first component, which may be reduced from a first state in the form of an ion having a metal atom with a first positive oxidation number to a second state in the form of an ion having said metal atom with a second positive oxidation number, which is less than said first positive oxidation number. A first redox potential in the electrolyte for reduction from the first to the second state is larger than a second redox potential in the electrolyte for reduction of divalent copper ions to metallic copper. During the etching metallic copper on the card is oxidised and transferred into positively charged copper ions while the first component is reduced from its first state to its second state. The quality of the etched structures on the card is improved since no metallic copper is precipitated on the cathode.

2. 发明申请

WO2003024172A2 A METHOD OF ETCHING COPPER ON CARDS 审中-公开
标题翻译：一种在卡片上蚀刻铜的方法
公开(公告)号：WO2003024172A2
公开(公告)日：2003-03-20
申请号：PCT/SE2002/001602
申请日：2002-09-09
申请人： OBDUCAT AKTIEBOLAG , FRENNESSON, Göran , BIERINGS, Gust , BJARNASON, Bjarni , SJÖBERG, Jenny
发明人： FRENNESSON, Göran , BIERINGS, Gust , BJARNASON, Bjarni , SJÖBERG, Jenny
IPC分类号： H05K3/07
CPC分类号： H05K3/07 , C25F3/02 , C25F7/00
摘要： Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte comprising a first component, which may be reduced from a first state in the form of an ion having a metal atom with a first positive oxidation number to a second state in the form of an ion having said metal atom with a second positive oxidation number, which is less than said first positive oxidation number. A first redox potential in the electrolyte for reduction from the first to the second state is larger than a second redox potential in the electrolyte for reduction of divalent copper ions to metallic copper. During the etching metallic copper on the card is oxidised and transferred into positively charged copper ions while the first component is reduced from its first state to its second state. The quality of the etched structures on the card is improved since no metallic copper is precipitated on the cathode.
摘要翻译：通过在阴极（102）和卡（42），卡（42）之间施加电压从而形成阳极来实现在卡上蚀刻铜。将阴极（102）和卡（42）浸入包含第一组分的电解质中，该第一组分可以从具有第一正氧化数的金属原子的离子形式的第一状态降低到具有所述金属原子的具有小于所述第一正氧化数的第二正氧化数的离子形式。用于从第一状态降低到第二状态的电解质中的第一氧化还原电位大于电解液中用于将二价铜离子还原成金属铜的第二氧化还原电位。在蚀刻期间，卡上的金属铜被氧化并转移成带正电荷的铜离子，而第一组分从第一状态减少到第二状态。由于没有金属铜沉积在阴极上，卡上蚀刻结构的质量得到了改善。

3. 发明申请

WO2005119360A1 MODIFIED METAL MOLD FOR USE IN IMPRINTING PROCESSES 审中-公开
标题翻译：改进的金属模具用于加工工艺
公开(公告)号：WO2005119360A1
公开(公告)日：2005-12-15
申请号：PCT/EP2005/052423
申请日：2005-05-27
申请人： OBDUCAT AB , KEIL, Matthias , FRENNESSON, Göran , BECK, Marc , HEIDARI, Babak
发明人： KEIL, Matthias , FRENNESSON, Göran , BECK, Marc , HEIDARI, Babak
IPC分类号： G03F7/00
CPC分类号： B05D1/60 , B05D1/185 , B29C33/56 , B82Y10/00 , B82Y30/00 , B82Y40/00 , G03F7/0002 , G03F7/0017 , Y10T428/31678
摘要： The invention relates to a novel metal mold having anti-adhesive properties comprising a base metal mold and an anti-adhesive layer comprising a fluorinated alkyl phosphoric acid derivative or a fluorinated alkyl poly-phosphoric acid derivative, including a phosphorous atom and an alkyl chain. The anti-adhesive layer is bonded directly onto a surface of the base metal mold. The base metal mold may be e.g. Nickel, and said fluorinated alkyl phosphoric acid derivative or said fluorinated alkyl poly-phosphoric acid derivative may be selected from the group consisting of phosphonic acids, phosphinic acids, phosphonates and phosphonate salts, phosphinates and phosphinate salts, or their respective oligomers, such that the phosphorous atom is coupled directly to the alkyl chain, such that the phosphorous atom is coupled directly to the alkyl chain.
摘要翻译：本发明涉及一种具有抗粘性的新型金属模具，其特征在于包括贱金属模和包含磷原子和烷基链的氟化烷基磷酸衍生物或氟化烷基聚磷酸衍生物的防粘层。抗粘剂层直接粘结在母模金属模的表面上。贱金属模可以是例如。镍和所述氟化烷基磷酸衍生物或所述氟化烷基聚磷酸衍生物可以选自膦酸，次膦酸，膦酸盐和膦酸盐，次膦酸盐和次膦酸盐或它们各自的低聚物，使得磷原子直接与烷基链结合，使得磷原子直接与烷基链结合。

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