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1. 发明申请

WO2007016003A1 BONDING SURFACES TOGETHER VIA PLASMA TREATMENT ON BOTH SURFACES WITH WET TREATMENT ON ONLY ONE SURFACE 审中-公开
标题翻译：通过仅在一个表面上进行湿处理的两个表面上的等离子体处理来结合表面
公开(公告)号：WO2007016003A1
公开(公告)日：2007-02-08
申请号：PCT/US2006/028561
申请日：2006-07-21
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , CHEN, Chien-Hura , HALUZAK, Charles C. , FORREST, Tracy
发明人： CHEN, Chien-Hura , HALUZAK, Charles C. , FORREST, Tracy
IPC分类号： H01L21/18
CPC分类号： H01L21/187
摘要： A first surface is bonded to a second surface (110). The first surface and the second surface are plasma treated (102). Only the first surface is wet treated (104). The first surface and the second surface are joined together to bond the first surface to the second surface (110).
摘要翻译：第一表面结合到第二表面（110）。第一表面和第二表面是等离子体处理（102）。只有第一个表面被湿处理（104）。第一表面和第二表面被接合在一起以将第一表面结合到第二表面（110）。

2. 发明申请

WO2006020439A3 A SYSTEM AND METHOD FOR LOW TEMPERATURE PLASMA-ENHANCED BONDING 审中-公开
标题翻译：低温等离子体增强键合的系统和方法
公开(公告)号：WO2006020439A3
公开(公告)日：2006-08-31
申请号：PCT/US2005027139
申请日：2005-07-29
申请人： HEWLETT PACKARD DEVELOPMENT CO , CHIEN-HUA CHEN , REBOA PAUL F , FORREST TRACY
发明人： CHIEN-HUA CHEN , REBOA PAUL F , FORREST TRACY
IPC分类号： H01L21/58
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01033 , H01L2924/01049 , H01L2924/01067 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/3011 , H01L2924/00
摘要： A method for bonding a plurality of substrates (145, 440, 450) includes performing a gas plasma treatment on the plurality of substrates (145, 440, 450), and performing a water plasma treatment on the plurality of substrates (145, 440, 450). Additionally, a system for performing low temperature plasma enhanced bonding includes a substrate housing structure having a substrate (145, 440, 450) receiving volume, a gas source fluidly coupled to the substrate housing structure, a water vapor source (230) fluidly coupled to the substrate housing structure, and a radio-frequency (RF) generator (260) coupled to the substrate housing structure, wherein the system is configured to perform both a gas plasma treatment and a water plasma treatment on a substrate (145, 440, 450).
摘要翻译：一种用于接合多个基板（145,440,450）的方法包括：在多个基板（145,440,450）上执行气体等离子体处理，并且在多个基板（145,440,450）上执行水等离子体处理， 450）。另外，用于执行低温等离子体增强接合的系统包括具有接收体积的基板（145,440,450）的基板壳体结构，流体耦合到基板壳体结构的气体源，流体耦合到所述衬底外壳结构以及耦合到所述衬底外壳结构的射频（RF）发生器（260），其中所述系统被配置为在衬底（145,440,450）上执行气体等离子体处理和水等离子体处理）。

3. 发明申请

WO2008157168A1 FLUID MANIFOLD FOR FLUID EJECTION DEVICE 审中-公开
标题翻译：用于流体喷射装置的流体歧管
公开(公告)号：WO2008157168A1
公开(公告)日：2008-12-24
申请号：PCT/US2008/066536
申请日：2008-06-11
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , NIKKEL, Eric L. , CHEN, Chien-Hua , FORREST, Tracy S.
发明人： NIKKEL, Eric L. , CHEN, Chien-Hua , FORREST, Tracy S.
IPC分类号： B41J2/175 , B41J2/135
CPC分类号： B41J2/1603 , B41J2/14145 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1639
摘要： A fluid manifold (120) for a fluid ejection device (130) including a plurality of fluid feed slots (132) includes a first layer (140) and a second layer (150) adjacent the first layer, and a first fluid routing (160) and a second fluid routing (170) each provided through the first layer and the second layer. The fluid ejection device is supported by the second layer, and the first fluid routing is communicated with one of the fluid feed slots, and the second fluid routing is communicated with an adjacent one of the fluid feed slots. A pitch (D3) of the first fluid routing and the second fluid routing through the first layer is greater than a pitch (D1) of the fluid feed slots, and the first fluid routing and the second fluid routing each include a first channel (162/172) oriented substantially parallel with the fluid feed slots and a second channel (166/176) oriented substantially perpendicular to the fluid feed slots.
摘要翻译：用于包括多个流体供给槽（132）的流体喷射装置（130）的流体歧管（120）包括邻近第一层的第一层（140）和第二层（150），以及第一流体路线（160 ）和每个通过第一层和第二层提供的第二流体路线（170）。流体喷射装置由第二层支撑，并且第一流体路线与流体供给槽中的一个连通，并且第二流体路线与相邻的一个流体供给槽连通。第一流体路线的间距（D3）和穿过第一层的第二流体路线大于流体供给槽的间距（D1），并且第一流体路线和第二流体路径各自包括第一通道（162） / 172）基本上平行于流体供给槽和基本上垂直于流体供给槽定向的第二通道（166/176）。

4. 发明申请

WO2006020439A2 A SYSTEM AND METHOD FOR LOW TEMPERATURE PLASMA-ENHANCED BONDING 审中-公开
标题翻译：一种用于低温等离子体增强粘结的系统和方法
公开(公告)号：WO2006020439A2
公开(公告)日：2006-02-23
申请号：PCT/US2005/027139
申请日：2005-07-29
申请人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. , CHIEN-HUA, Chen , REBOA, Paul, F. , FORREST, Tracy
发明人： CHIEN-HUA, Chen , REBOA, Paul, F. , FORREST, Tracy
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/2919 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01033 , H01L2924/01049 , H01L2924/01067 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/3011 , H01L2924/00
摘要： A method for bonding a plurality of substrates (145, 440, 450) includes performing a gas plasma treatment on the plurality of substrates (145, 440, 450), and performing a water plasma treatment on the plurality of substrates (145, 440, 450). Additionally, a system for performing low temperature plasma enhanced bonding includes a substrate housing structure having a substrate (145, 440, 450) receiving volume, a gas source fluidly coupled to the substrate housing structure, a water vapor source (230) fluidly coupled to the substrate housing structure, and a radio-frequency (RF) generator (260) coupled to the substrate housing structure, wherein the system is configured to perform both a gas plasma treatment and a water plasma treatment on a substrate (145, 440, 450).
摘要翻译：一种用于接合多个基板（145,440,450）的方法包括对所述多个基板（145,440,450）进行气体等离子体处理，并对所述多个基板（145,440,450）进行水等离子体处理， 450）。另外，用于执行低温等离子体增强接合的系统包括具有接收体积的衬底（145,440,450）的衬底壳体结构，与衬底壳体结构流体耦合的气体源，流体耦合到所述基板壳体结构以及耦合到所述基板壳体结构的射频（RF）发生器（260），其中所述系统被配置为在基板（145,440,450）上执行气体等离子体处理和水等离子体处理）。

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