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1. 发明申请

WO2007022249A2 PACKAGED MICROPHONE WITH ELECTRICALLY COUPLED LID 审中-公开
标题翻译：包装麦克风电动联轴器
公开(公告)号：WO2007022249A2
公开(公告)日：2007-02-22
申请号：PCT/US2006/031958
申请日：2006-08-16
申请人： ANALOG DEVICES, INC. , HARNEY, Kieran, P. , MARTIN, John, R. , FELTON, Lawrence, E.
发明人： HARNEY, Kieran, P. , MARTIN, John, R. , FELTON, Lawrence, E.
IPC分类号： B81B7/00
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An apparatus has a leadframe based package base having a leadframe and a lid coupled with the package base. The lid and package base form a chamber for at least partially containing a microphone. The lid is electrically coupled with a given portion of the leadframe in the package base.
摘要翻译：一种装置具有基于引线框的封装基座，其具有引线框架和与封装基座耦合的盖子。盖和包装底座形成用于至少部分地包含麦克风的室。盖子与封装基座中的引线框架的给定部分电耦合。

2. 发明申请

WO2007022249A3 PACKAGED MICROPHONE WITH ELECTRICALLY COUPLED LID 审中-公开
标题翻译：带电子连接盖的包装式麦克风
公开(公告)号：WO2007022249A3
公开(公告)日：2007-05-18
申请号：PCT/US2006031958
申请日：2006-08-16
申请人： ANALOG DEVICES INC , HARNEY KIERAN P , MARTIN JOHN R , FELTON LAWRENCE E
发明人： HARNEY KIERAN P , MARTIN JOHN R , FELTON LAWRENCE E
IPC分类号： B81B7/00
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An apparatus has a leadframe based package base having a leadframe and a lid coupled with the package base. The lid and package base form a chamber for at least partially containing a microphone. The lid is electrically coupled with a given portion of the leadframe in the package base.
摘要翻译：一种装置具有基于引线框架的封装基座，其具有引线框架和与封装基座耦合的盖子。盖子和包装底座形成用于至少部分地容纳麦克风的腔室。盖子与封装基座中的引线框架的给定部分电耦合。

3. 发明申请

WO2007022179A3 PARTIALLY ETCHED LEADFRAME PACKAGES HAVING DIFFERENT TOP AND BOTTOM TOPOLOGIES 审中-公开
标题翻译：具有不同顶层和底层拓扑的部分蚀刻铅笔包
公开(公告)号：WO2007022179A3
公开(公告)日：2007-05-18
申请号：PCT/US2006031825
申请日：2006-08-16
申请人： ANALOG DEVICES INC , HARNEY KIERAN P , MARTIN JOHN R , FELTON LAWRENCE E
发明人： HARNEY KIERAN P , MARTIN JOHN R , FELTON LAWRENCE E
IPC分类号： B81B7/00
CPC分类号： B81B7/007 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
摘要翻译：描述了用于微机电（MEMS）装置的封装。预制的引线框架底座具有相对的顶部和底部表面。每个表面由具有至少一个导电部分和至少一个非导电部分的拓扑结构限定，并且顶表面的拓扑与底表面的拓扑不同。

4. 发明申请

WO2006084028A3 INTERDIFFUSION BONDED STACKED DIE DEVICE 审中-公开
标题翻译：介面贴合堆叠式DIE设备
公开(公告)号：WO2006084028A3
公开(公告)日：2007-01-04
申请号：PCT/US2006003673
申请日：2006-02-02
申请人： ANALOG DEVICES INC , ALIE SUSAN A , WACHTMANN BRUCE K , FELTON LAWRENCE E , YUN CHANGHAN
发明人： ALIE SUSAN A , WACHTMANN BRUCE K , FELTON LAWRENCE E , YUN CHANGHAN
IPC分类号： B81B7/00 , H01L21/60 , H01L21/768 , H01L21/98 , H01L23/48
CPC分类号： B81C1/00301 , B81B7/0006 , B81B2203/0353 , B81B2207/093 , B81B2207/095 , B81C2203/019 , H01L21/76898 , H01L24/81 , H01L25/50 , H01L2224/05001 , H01L2224/05009 , H01L2224/05023 , H01L2224/05166 , H01L2224/05184 , H01L2224/05568 , H01L2224/05624 , H01L2224/05647 , H01L2224/13025 , H01L2224/8182 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/00014
摘要： A conductive bond for through-wafer interconnect is produced by forming an electrode (108) through a first wafer from a component on a front side of the first wafer(102) to a back side of the first wafer(102), forming a first electrically conductive interface (110) in contact with an exposed portion of the electrode (108) on the back side of the first wafer (102), and conductively bonding the first electrically conductive interface (110) with a second electrically conductive interface (114) on a second wafer under pressure at a temperature below the thermal budget of the stacked wafer device. The process temperature is generally well below the melting points of the electrically conductive interfaces. In .some embodiments, the conductive bonding may be facilitated or enabled by performing the conductive bonding in a vacuum.
摘要翻译：通过从第一晶片（102）的前侧的部件到第一晶片（102）的后侧形成通过第一晶片的电极（108），形成用于晶片间互连的导电接合，形成第一晶片导电接口（110），与第一晶片（102）的背侧上的电极（108）的暴露部分接触，并且将第一导电接口（110）与第二导电接口（114）导电地接合，在低于堆叠晶片装置的热预算的温度的压力下在第二晶片上。工艺温度通常远低于导电界面的熔点。在一些实施例中，可以通过在真空中执行导电接合来促进或实现导电接合。

5. 发明申请

WO2006036250A1 PACKAGED MICROCHIP WITH PREMOLDED-TYPE PACKAGE 审中-公开
标题翻译：包装型微型包装
公开(公告)号：WO2006036250A1
公开(公告)日：2006-04-06
申请号：PCT/US2005/023872
申请日：2005-07-05
申请人： ANALOG DEVICES, INC. , KARPMAN, Maurice, S. , HABLUTZEL, Nicole , FARRELL, Peter, W. , JUDY, Michael, W. , FELTON, Lawrence, E. , LONG, Lewis
发明人： KARPMAN, Maurice, S. , HABLUTZEL, Nicole , FARRELL, Peter, W. , JUDY, Michael, W. , FELTON, Lawrence, E. , LONG, Lewis
IPC分类号： B81B7/00
CPC分类号： B81B7/0048 , H01L2224/32014 , H01L2924/1461 , H01L2924/16195 , H01L2924/00
摘要： A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.
摘要翻译： MEMS惯性传感器固定在至少部分由低透湿成型材料形成的预成型包装中。因此，这种运动检测器应该能够比使用陶瓷封装的那些更经济地生产。为了达到这些目的，包装件具有从引线框架延伸以形成空腔的至少一个壁（具有低的透湿性），并且在该空腔内具有隔离器（具有顶部表面）。 MEMS惯性传感器具有悬挂在具有底表面的基底上方的可移动结构。衬底底表面在接触区域处固定到隔离器顶表面。在说明性实施例中，接触面积小于衬底的底表面的表面积。因此，隔离器在底部基板表面的至少一部分和封装之间形成空间。因此，这个空间没有隔离器。此外，由于封装的透湿性低，可以避免进一步的生产步骤，同时确保水分不会对空腔内的MEMS惯性传感器产生不利影响。

6. 发明申请

WO2005026040A3 WAFER LEVEL CAPPED SENSOR 审中-公开
公开(公告)号：WO2005026040A3
公开(公告)日：2005-07-07
申请号：PCT/US2004029133
申请日：2004-09-08
申请人： ANALOG DEVICES INC , FELTON LAWRENCE E , HARNEY KIERAN P , ROBERTS CARL M
发明人： FELTON LAWRENCE E , HARNEY KIERAN P , ROBERTS CARL M
IPC分类号： B81B7/00 , G01P1/02 , G01P15/08
CPC分类号： B81B7/007 , B81B2201/0235 , G01P1/023 , G01P15/0802 , Y10T29/49007
摘要： A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.
摘要翻译：传感器具有模具（具有工作部分），与模具耦合以至少部分地覆盖工作部分的帽以及延伸穿过帽部到工作部分的导电通路。该通道为工作部分提供电接口。

7. 发明申请

WO2006084028A2 CONDUCTIVE BOND FOR THROUGH-WAFER INTERCONNECT 审中-公开
标题翻译：通过波形互连的导电键
公开(公告)号：WO2006084028A2
公开(公告)日：2006-08-10
申请号：PCT/US2006/003673
申请日：2006-02-02
申请人： ANALOG DEVICES, INC. , ALIE, Susan, A. , WACHTMANN, Bruce, K. , FELTON, Lawrence, E. , YUN, Changhan
发明人： ALIE, Susan, A. , WACHTMANN, Bruce, K. , FELTON, Lawrence, E. , YUN, Changhan
IPC分类号： B81B7/00 , H01L21/98 , H01L21/768 , H01L23/48 , H01L21/60
CPC分类号： B81C1/00301 , B81B7/0006 , B81B2203/0353 , B81B2207/093 , B81B2207/095 , B81C2203/019 , H01L21/76898 , H01L24/81 , H01L25/50 , H01L2224/05001 , H01L2224/05009 , H01L2224/05023 , H01L2224/05166 , H01L2224/05184 , H01L2224/05568 , H01L2224/05624 , H01L2224/05647 , H01L2224/13025 , H01L2224/8182 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H01L2924/00014
摘要： A conductive bond for through-wafer interconnect is produced by forming an electrode through a first wafer from a component on a front side of the first wafer to a back side of the first wafer, forming a first electrically conductive interface in contact with an exposed portion of the electrode on the back side of the first wafer, and conductively bonding the first electrically conductive interface with a second electrically conductive interface on a second wafer under pressure at a temperature below the thermal budget of the stacked wafer device. The process temperature is generally well below the melting points of the electrically conductive interfaces. In some embodiments, the conductive bonding may be facilitated or enabled by performing the conductive bonding in a vacuum.
摘要翻译：通过从第一晶片的前侧的部件到第一晶片的后侧形成电极通过第一晶片形成电极，形成用于晶片间互连的导电接合，形成与暴露部分接触的第一导电界面并且在低于所述堆叠晶片装置的热量预算的温度的压力下，在第二晶片上将所述第一导电界面与第二导电界面导电地接合。工艺温度通常远低于导电界面的熔点。在一些实施例中，可以通过在真空中执行导电接合来促进或实现导电接合。

8. 发明申请

WO2006022957A1 METHOD OF PRODUCING A MEMS DEVICE 审中-公开
标题翻译：制造MEMS器件的方法
公开(公告)号：WO2006022957A1
公开(公告)日：2006-03-02
申请号：PCT/US2005/018898
申请日：2005-05-31
申请人： ANALOG DEVICES, INC. , MARTIN, John, R. , MENA, Manolo, G. , LACSAMANA, Elmer, S. , DUFFY, Michael, P. , WEBSTER, William, A. , FELTON, Lawrence, E. , KARPMAN, Maurice, S.
发明人： MARTIN, John, R. , MENA, Manolo, G. , LACSAMANA, Elmer, S. , DUFFY, Michael, P. , WEBSTER, William, A. , FELTON, Lawrence, E. , KARPMAN, Maurice, S.
IPC分类号： B81C1/00
CPC分类号： B81C1/00896
摘要： A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
摘要翻译：制造MEMS器件的方法在其可移动结构形成之后移除器件晶片的底侧。为此，该方法提供了具有初始底侧的器件晶片。接下来，该方法在器件晶片上形成可移动结构，然后基本上去除器件晶片的整个初始底侧。整个初始底部的移除有效地形成最终底部。

9. 发明申请

WO2006101689A1 WAFER LEVEL CAPPED SENSOR 审中-公开
公开(公告)号：WO2006101689A1
公开(公告)日：2006-09-28
申请号：PCT/US2006/007576
申请日：2006-03-03
申请人： ANALOG DEVICES, INC. , FELTON, Lawrence, E. , HARNEY, Kieran, P. , ROBERTS, Carl, M.
发明人： FELTON, Lawrence, E. , HARNEY, Kieran, P. , ROBERTS, Carl, M.
IPC分类号： G01P1/02 , G01P15/08 , B81B7/00 , B81C5/00
CPC分类号： G01P15/0802 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2207/095 , B81C1/0023 , B81C1/00301 , B81C2203/0118 , G01P1/023 , G01P15/125 , Y10T29/49007 , Y10T29/49117 , Y10T29/49204 , Y10T29/49213
摘要： A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.
摘要翻译：传感器具有模具（具有工作部分），与模具耦合以至少部分地覆盖工作部分的帽以及延伸穿过帽部到工作部分的导电通路。该通道为工作部分提供电接口。

10. 发明申请

WO2006022956A1 MEMS DEVICE WITH NON-STANDARD PROFILE 审中-公开
标题翻译：具有非标准配置文件的MEMS器件
公开(公告)号：WO2006022956A1
公开(公告)日：2006-03-02
申请号：PCT/US2005/018897
申请日：2005-05-31
申请人： ANALOG DEVICES, INC. , MARTIN, John, R. , FELTON, Lawrence, E.
发明人： MARTIN, John, R. , FELTON, Lawrence, E.
IPC分类号： B81C1/00
CPC分类号： B81C1/00896
摘要： A method of producing a MEMS device forms structure on a non-standard device wafer. To that end, the method provides the noted non-standard device wafer, which has a wafer outer diameter and a non-standard thickness. As known by those in the art, a standard device wafer has a standard thickness when its outer diameter equals the wafer outer diameter. In illustrative embodiments, however, the non-standard thickness is smaller than the standard thickness. The method then forms structure on the non-standard device wafer.
摘要翻译： MEMS器件的制造方法在非标准器件晶片上形成结构。为此，该方法提供了所述非标准器件晶片，其具有晶片外径和非标准厚度。如本领域技术人员已知的，当其外径等于晶片外径时，标准器件晶片具有标准厚度。然而，在说明性实施例中，非标准厚度小于标准厚度。该方法然后在非标准器件晶片上形成结构。

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