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1. 发明申请

WO2013130580A3 SEMICONDUCTOR LASER CHIP PACKAGE WITH ENCAPSULATED RECESS MOLDED ON SUBSTRATE AND METHOD FOR FORMING SAME 审中-公开
标题翻译：半导体激光芯片封装在基片上的成型凹陷和形成相同的方法
公开(公告)号：WO2013130580A3
公开(公告)日：2013-11-14
申请号：PCT/US2013027987
申请日：2013-02-27
申请人： EXCELITAS CANADA INC
发明人： JU JIN HAN , BURMAN ROBERT , DELEON JERRY
IPC分类号： H01S5/02 , H01S5/022
CPC分类号： H01S5/02236 , H01L24/97 , H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/3011 , H01S5/02208 , H01S5/02228 , H01S5/02252 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric layers, a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate. An encapsulation covers the laser chip, the wire bond, and at least a portion of the top surface of the substrate including the recess region. The encapsulation is an optically transparent molding compound. The package is arranged to be mounted as a side-looker and/or a top-looker.
摘要翻译：一种叠层无引线载体封装，其具有安装在支撑芯片的基板中的凹陷区域的边缘处的半导体芯片，该基板具有多个导电层和介电层，耦合到光电芯片的引线键合和位于衬底的顶部表面。封装覆盖激光芯片，引线接合以及包括凹陷区域的衬底的至少一部分顶表面。封装是光学透明的模制化合物。该包装被安排成侧视镜和/或顶视镜。

2. 发明申请

WO2020092290A8 LOW INDUCTANCE LASER DRIVER PACKAGING USING LEAD-FRAME AND THIN DIELECTRIC LAYER MASK PAD DEFINITION 审中-公开
公开(公告)号：WO2020092290A8
公开(公告)日：2020-05-07
申请号：PCT/US2019/058436
申请日：2019-10-29
申请人： EXCELITAS CANADA, INC. , EXCELITAS TECHNOLOGIES CORP.
发明人： CHARLEBOIS, Gabriel , JU, JinHan , GODFREY, Lawrence
IPC分类号： H03K17/687 , H05K1/02 , H05K1/18 , H03K17/0416 , H03K17/16
摘要： A surface mountable laser driver circuit package (405) is configured to mount on a host printed circuit board, PCB, (402). A surface mount circuit package includes a lead-frame (445). A plurality of laser driver circuit components (310, 320, 330) is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer (440) is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection (441, 442) between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.

3. 发明申请

WO2012000079A1 MULTIPLEXED SENSOR ARRAY 审中-公开
标题翻译：多路传感器阵列
公开(公告)号：WO2012000079A1
公开(公告)日：2012-01-05
申请号：PCT/CA2011/000589
申请日：2011-05-19
申请人： EXCELITAS CANADA INC. , HOOD, Sheldon, James
发明人： HOOD, Sheldon, James
IPC分类号： G08C15/00 , G01J5/12
CPC分类号： H04N5/3765 , G01J5/14 , G01J5/22 , H04N5/33 , H04N5/355 , H04N5/357 , H04N5/378
摘要： A sensor array, comprising: a plurality of sensors electrically connected in series or in parallel, each of the plurality of sensors operable to generate an individual electrical signal; a multiplexing scheme generator operable to generate a multiplexing scheme; a modulation system connected to the multiplexing scheme generator and operable to selectively reverse the polarity of each of the plurality of sensors for each of a plurality of samples; a readout device operable to sequentially read a plurality of output signals of the plurality of electrically connected sensors, wherein the number of samples is greater than or equal to the number of sensors and wherein one or more electrical signals of the plurality of sensors are readout as one electrical signal; and a demultiplexer operable to receive the output electrical signals and to determine the individual electrical signals of each of the plurality of sensors based on the multiplexing scheme.
摘要翻译：一种传感器阵列，包括：串联或并联电连接的多个传感器，所述多个传感器中的每一个可操作以产生单独的电信号; 可操作以产生复用方案的复用方案发生器; 连接到所述多路复用方案生成器的调制系统，用于选择性地反转所述多个传感器中的每一个的多个样本中的每一个的极性; 读出装置，其可操作以顺序地读取多个电连接的传感器的多个输出信号，其中样本的数量大于或等于传感器的数量，并且其中多个传感器中的一个或多个电信号被读出为一个电信号; 以及解复用器，其可操作以基于所述复用方案来接收所述输出电信号并确定所述多个传感器中的每一个的各个电信号。

4. 发明申请

WO2022125641A1 SYSTEM AND METHOD FOR SAFELY AND EFFICIENTLY DISINFECTING AIR IN A ROOM 审中-公开
公开(公告)号：WO2022125641A1
公开(公告)日：2022-06-16
申请号：PCT/US2021/062374
申请日：2021-12-08
申请人： EXCELITAS CANADA, INC. [CA]/[CA] , EXCELITAS TECHNOLOGIES CORP. [US]/[US] (BZ)
发明人： KUN, Jessica , LEE, Hsin-Chin , RUFFIN, Marvin
IPC分类号： A61L2/00 , A61L2/10 , A61L9/20
摘要： An ultraviolet C (UVC) unit, comprises a Light Emitting Diode (LED) module containing a series of UVC LEDs that provide UVC emission, a lens that linearly focuses the UVC emission of the LED module and a controllable baffle that directs UVC light that passes from the LED module through the lens. The UVC light emitted from the LED module is directed toward the lens for linearly focusing the emission of the LED module in order to propagate the light throughout a top portion of a room in which the UVC unit is positioned, when the baffle is in a first position, and wherein the light is propagated downward from the UVC unit when the baffle is in a second position.

5. 发明申请

WO2019147763A2 MAINTAINING STABLE OPTICAL OUTPUT OF SOLID STATE ILLUMINATION SYSTEM 审中-公开
公开(公告)号：WO2019147763A2
公开(公告)日：2019-08-01
申请号：PCT/US2019/014890
申请日：2019-01-24
申请人： EXCELITAS CANADA, INC. , EXCELITAS TECHNOLOGIES CORP.
发明人： SORENSEN, Erik , MACDONALD, Douglas , CONSTANTINOU, Paul , WANG, Yong
IPC分类号： G01R31/26
摘要： A method is disclosed for maintaining a desired optical output in a solid state illumination device, where the device is configured to accommodate multiple light emitting diodes (LEDs) and to combine light from the LEDs to produce a single optical output. The method includes testing the LEDs before adding them into the device. The testing produces characterizing information that describes how one or more optical properties (e.g., optical power and/or peak wavelength) of the tested LED change with temperature. This characterizing information is stored in a computer-based memory of the device, and the tested LED is added (connected) into the device. Then, during operation, temperature sensors measure a temperature associated with each respective LED in the device, and electrical current to one or more of the LEDs can be adjusted based on the measured temperatures associated with each LED and its stored characterizing information.

6. 发明申请

WO2016172074A1 INTEGRATING CONE FOR AN ILLUMINATION DEVICE 审中-公开
标题翻译：用于照明装置的集成锥体
公开(公告)号：WO2016172074A1
公开(公告)日：2016-10-27
申请号：PCT/US2016/028235
申请日：2016-04-19
申请人： EXCELITAS CANADA, INC. , EXCELITAS TECHNOLOGIES CORP.
发明人： WANG, Yong , CONSTANTINOU, Paul , KUK, Sola, Anne
IPC分类号： G02B17/00 , G02B27/09 , G02B19/00
CPC分类号： G02B21/08 , F21V5/04 , F21V7/22 , F21V9/30 , F21V13/08 , F21V13/14 , F21Y2113/13 , F21Y2115/10 , G01N21/6458 , G01N2021/6471 , G01N2021/6478 , G02B6/0001 , G02B17/004 , G02B19/0019 , G02B19/0061 , G02B19/0095 , G02B21/16 , G02B27/0994 , G02B27/1006 , G02B27/141
摘要： A device for increasing the optical power of a solid state light source in the green and/or yellow bands, is disclosed. The device has an integral body having an ingress surface configured to receive light from an emitting portion of the solid state light source, an egress surface substantially opposite the ingress surface, and a recess formed within the body. The recess has an input opening in the ingress surface, an output opening in the egress surface, and a recess surface within the body extending between the input opening and the output opening. The recess surface is configured to reflect visible light with Lambertian scatter characteristics.
摘要翻译：公开了一种用于增加绿色和/或黄色带中的固态光源的光功率的装置。该装置具有整体，其具有被构造成从固态光源的发射部分接收光的进入表面，基本上与进入表面相对的出口表面，以及形成在主体内的凹部。所述凹部在所述入口表面具有输入开口，所述出口表面中的输出开口，以及在所述主体内在所述输入开口和所述输出开口之间延伸的凹陷表面。凹陷表面被配置为用朗伯散射特性来反射可见光。

7. 发明申请

WO2011127556A1 VERTICALLY STACKED THERMOPILE 审中-公开
标题翻译：垂直堆叠热电偶
公开(公告)号：WO2011127556A1
公开(公告)日：2011-10-20
申请号：PCT/CA2011/000289
申请日：2011-03-17
申请人： EXCELITAS CANADA INC. , QUAD, Reiner , BARLOW, Arthur , CHAN, Yuan, Hsi , ERSONI, Michael , KARAGÖZOGLU, Hermann , MARINESCU, Radu, M.
发明人： QUAD, Reiner , BARLOW, Arthur , CHAN, Yuan, Hsi , ERSONI, Michael , KARAGÖZOGLU, Hermann , MARINESCU, Radu, M.
IPC分类号： G01J5/14
CPC分类号： H01L27/16 , G01J5/0225 , G01J5/12 , G01J5/14 , H01L35/32
摘要： A vertically stacked thermopile and an IR sensor using said stacked thermopiles are provided. The vertically stacked thermopile may include multiple thermocouples stacked vertically on one another. The thermocouples may be connected in series, parallel, or a combination of series and parallel. One or more vertically stacked thermopiles may be included in an IR sensor and the thermopiles may be connected in series, parallel, or a combination of series and parallel.
摘要翻译：提供了使用所述堆叠的热电堆的垂直堆叠的热电堆和IR传感器。垂直堆叠的热电堆可以包括彼此垂直堆叠的多个热电偶。热电偶可以串联，并联或串联和并联组合。一个或多个垂直堆叠的热电堆可以包括在IR传感器中，并且热电堆可以串联，并联或串联和并联的组合连接。

8. 发明申请

WO2022098694A1 SEMICONDUCTOR SIDE EMITTING LASER ON BOARD PACKAGE AND METHOD FORMING SAME 审中-公开
公开(公告)号：WO2022098694A1
公开(公告)日：2022-05-12
申请号：PCT/US2021/057816
申请日：2021-11-03
申请人： EXCELITAS CANADA, INC. , EXCELITAS TECHNOLOGIES CORP.
发明人： JU, Jinhan , KIG-I, Ralph , LAFORCE, Frederic , PALONPON, Almar
IPC分类号： H01S5/02257 , H01S5/02326 , H01S5/00 , H01S5/40 , H01S5/02208
摘要： A chip-onboard assembly for a side-looking optical component is mounted on a mounting surface of a printed circuit board (PCB) and includes a window assembly mounted to the PCB. The window assembly includes a glass window and a window holding bracket. The bracket has a first walled portion, a second walled portion attached to the first walled portion, and a third walled portion opposite the second wall portion. The first walled portion further has a cutaway section configured to accommodate the glass window. An optical encapsulant covers the covering the side-looking optical component. The glass window is attached to the side-looking optical component CoB assembly.

9. 发明申请

WO2021211778A1 HERMETIC SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR SIDE EMITTING LASER AND METHOD FORMING SAME 审中-公开
公开(公告)号：WO2021211778A1
公开(公告)日：2021-10-21
申请号：PCT/US2021/027378
申请日：2021-04-15
申请人： EXCELITAS CANADA, INC. , EXCELITAS TECHNOLOGIES CORP.
发明人： JU, Jin Han , CHARLEBOIS, Gabriel
IPC分类号： H01S5/02208 , H01S5/02218 , H01S5/02345 , H01S5/40 , H01S5/02257 , H01S5/0239 , H01S5/024 , H01S5/026
摘要： A method for manufacturing a hermetic side looking laser surface-mount device (SMD) package includes forming a glass cap. An array of pockets is formed in the first glass wafer. The array of pockets is sealed by bonding a second glass wafer to the first glass wafer. The glass cap is released by singulating the sealed array of pockets.

10. 发明申请

WO2020092296A1 HIGH SPEED SWITCHING CIRCUIT CONFIGURATION 审中-公开
公开(公告)号：WO2020092296A1
公开(公告)日：2020-05-07
申请号：PCT/US2019/058445
申请日：2019-10-29
申请人： EXCELITAS CANADA, INC. , EXCELITAS TECHNOLOGIES CORP.
发明人： GODFREY, Lawrence
IPC分类号： H03K17/687 , H05K1/02 , H05K1/18 , H03K17/0416
摘要： A low inductance electrical switching circuit arrangement (200), includes a two sided substrate (202) with a plurality of through-substrate electrical vias (220, 222). A capacitor (212) is arranged on the substrate first side above a first via (220), and an electrical sink (214) is arranged on the first side above a second via (222). A switching component (216) configured to produce a plurality of current pulses is arranged on the substrate second side below the first and second via.

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