发明申请
WO2020092290A8 LOW INDUCTANCE LASER DRIVER PACKAGING USING LEAD-FRAME AND THIN DIELECTRIC LAYER MASK PAD DEFINITION
审中-公开
基本信息:
- 专利标题： LOW INDUCTANCE LASER DRIVER PACKAGING USING LEAD-FRAME AND THIN DIELECTRIC LAYER MASK PAD DEFINITION
- 申请号：PCT/US2019/058436 申请日：2019-10-29
- 公开(公告)号：WO2020092290A8 公开(公告)日：2020-05-07
- 发明人： CHARLEBOIS, Gabriel , JU, JinHan , GODFREY, Lawrence
- 申请人： EXCELITAS CANADA, INC. , EXCELITAS TECHNOLOGIES CORP.
- 申请人地址： 22001 Dumberry Road Vaudreuil-Dorion, QC J7V 8P7 CA
- 专利权人： EXCELITAS CANADA, INC.,EXCELITAS TECHNOLOGIES CORP.
- 当前专利权人： EXCELITAS CANADA, INC.,EXCELITAS TECHNOLOGIES CORP.
- 当前专利权人地址： 22001 Dumberry Road Vaudreuil-Dorion, QC J7V 8P7 CA
- 代理机构： WHITCOMB, Jonathan, B.
- 优先权： US62/752,460 20181030
- 主分类号： H03K17/687
- IPC分类号： H03K17/687 ; H05K1/02 ; H05K1/18 ; H03K17/0416 ; H03K17/16
摘要：
A surface mountable laser driver circuit package (405) is configured to mount on a host printed circuit board, PCB, (402). A surface mount circuit package includes a lead-frame (445). A plurality of laser driver circuit components (310, 320, 330) is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer (440) is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection (441, 442) between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.
公开/授权文献:
IPC结构图谱:
| H | 电学 |
| --H03 | 基本电子电路 |
| ----H03K | 脉冲技术 |
| ------H03K17/00 | 电子开关或选通，即不通过通断接触的 |
| --------H03K17/51 | .按使用特殊元件区分的 |
| ----------H03K17/56 | ..应用半导体器件作为有源元件的 |
| ------------H03K17/687 | ...应用场效应晶体管的 |