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1. 发明申请

WO2006093378A1 MARKING METHOD OF FIBER LASER MARKER 审中-公开
标题翻译：光纤激光标记标记方法
公开(公告)号：WO2006093378A1
公开(公告)日：2006-09-08
申请号：PCT/KR2006/000443
申请日：2006-02-07
申请人： EO TECHNICS CO., LTD. , LEE, Sang-kil , PARK, Ko-dong , KANG, Sung-chul , HYUN, Byung-hun , GWON, Goo-cheol , KIM, Tae-jung , LEE, Byong-gyu , SHO, Jae-hyuk
发明人： LEE, Sang-kil , PARK, Ko-dong , KANG, Sung-chul , HYUN, Byung-hun , GWON, Goo-cheol , KIM, Tae-jung , LEE, Byong-gyu , SHO, Jae-hyuk
IPC分类号： H01L23/544
CPC分类号： B41J2/471
摘要： Provided is a marking method of a fiber laser marker, the fiber laser marker including an optical pump outputting an optical signal to a resonator, and a Galvano scanner scanning at a predetermined location with a laser beam emitted from the resonator. The marking method includes: measuring a delay time for which the output of the laser beam is delayed, the delay time depending on a jump time between when the optical signal is output to the resonator and when the laser beam is emitted from the resonator; moving a mirror of the Galvano scanner to a starting point of a next marking; calculating the jump time for which the mirror of the Galvano scanner is moved to the starting point of the next marking; calculating the delay time depending on the jump time; driving the optical pump to apply the optical signal to the resonator, and making the mirror of the Galvano scanner stand by for the delay time; and driving the mirror of the Galvano scanner and performing the marking.
摘要翻译：提供了一种光纤激光标记器的标记方法，该光纤激光标记器包括将光信号输出到谐振器的光泵，以及使用从谐振器发射的激光束在预定位置扫描的Galvano扫描仪。标记方法包括：测量激光束的输出延迟的延迟时间，延迟时间取决于当光信号输出到谐振器之间的跳跃时间和当从谐振器发射激光束时的跳跃时间; 将Galvano扫描仪的镜子移动到下一个标记的起点; 计算Galvano扫描仪的镜子移动到下一个标记起点的跳跃时间; 根据跳跃时间计算延迟时间; 驱动光泵将光信号施加到谐振器，并使Galvano扫描仪的反射镜处于延迟时间; 并驱动Galvano扫描仪的镜子并执行标记。

2. 发明申请

WO2006075830A1 METHOD OF PROCESSING AN OBJECT HAVING A PASSIVATION LAYER 审中-公开
标题翻译：处理钝化层物体的方法
公开(公告)号：WO2006075830A1
公开(公告)日：2006-07-20
申请号：PCT/KR2005/001094
申请日：2005-04-15
申请人： EO TECHNICS CO., LTD. , HAN, You-Hie , HONG, Eun Jeong , SUH, Jong Hyun , JUNG, Won Chul , LEE, Hak Yong , LEE, Dong Jun
发明人： HAN, You-Hie , HONG, Eun Jeong , SUH, Jong Hyun , JUNG, Won Chul , LEE, Hak Yong , LEE, Dong Jun
IPC分类号： H01L21/3065
CPC分类号： H01L21/31105 , B23K26/18 , B23K26/40 , B23K2203/172 , B23K2203/50 , H01L21/3086
摘要： Disclosed is a method of processing an object having a passivation layer, in which the passivation layer is effectively removed in the course of processing the object having the passivation layer, thereby improving the reliability of the processed object. The method comprises moving the object into a process chamber and conveying the object in a processing direction; generating a plasma on the portion of the passivation layer to be processed using a reaction between a laser beam and an inactive substance contained in the object by radiating the laser beam onto the portion of the object, so as to remove the passivation layer by the plasma; and processing the silicon substrate using the laser beam. It is possible to effectively remove the passivation layer without changing an optical instrument or a laser source for processing the object.
摘要翻译：公开了一种处理具有钝化层的物体的方法，其中在处理具有钝化层的物体的过程中钝化层被有效地去除，从而提高被处理物体的可靠性。该方法包括将物体移动到处理室中并在处理方向上传送物体; 通过将激光束照射到物体的该部分上，利用激光束和物体中所含的非活性物质之间的反应，在要处理的钝化层部分上产生等离子体，以便通过等离子体去除钝化层 ; 以及使用激光束处理硅衬底。可以在不改变用于处理物体的光学仪器或激光源的情况下有效地去除钝化层。

3. 发明申请

WO2006036038A1 LASER PROCESSING APPARATUS AND METHOD USING TEC MODULE 审中-公开
标题翻译：激光加工设备和使用TEC模块的方法
公开(公告)号：WO2006036038A1
公开(公告)日：2006-04-06
申请号：PCT/KR2004/003064
申请日：2004-11-25
申请人： EO TECHNICS CO., LTD. , HAN, You-Hie
发明人： HAN, You-Hie
IPC分类号： B23K26/42
CPC分类号： B23K26/0853 , B23K26/38 , B23K26/40 , B23K26/703 , B23K2201/35 , B23K2201/40 , B23K2203/50 , B23K2203/52
摘要： The object of the present invention is to provide a laser processing apparatus and method, capable of minimizing incurred costs and produced pollutants when processing an object using a laser. The apparatus includes a chuck (30) to hold the object loaded into a chamber. A TEC module (40) is provided on a lower surface of the chuck to cool the object, thus forming a frozen layer on a surface of the object. An insulation means (50) is provided on a lower surface of the TEC module. A laser generating means (120) generates a laser beam. A reflecting means (130) reflects the laser beam onto the object. This invention can process the object with minimal expense, simplify the operation of processing an object, and allows particles produced during the laser process to be easily removed by a cleaning process, thus preventing environmental pollution.
摘要翻译：本发明的目的是提供一种激光加工装置和方法，其能够在使用激光加工物体时最小化所产生的成本和产生的污染物。该装置包括用于保持装载到室中的物体的卡盘（30）。在卡盘的下表面上设置TEC模块（40）以冷却物体，从而在物体的表面上形成冻结层。绝缘装置（50）设置在TEC模块的下表面上。激光发生装置（120）产生激光束。反射装置（130）将激光束反射到物体上。本发明可以以最小的成本处理物体，简化处理物体的操作，并且允许通过清洁过程容易地去除激光处理期间产生的粒子，从而防止环境污染。

4. 发明申请

WO2009035209A1 METHOD OF SORTING MARKING OBJECTS 审中-公开
标题翻译：标记对象的分类方法
公开(公告)号：WO2009035209A1
公开(公告)日：2009-03-19
申请号：PCT/KR2008/003702
申请日：2008-06-26
申请人： EO TECHNICS CO., LTD. , SUNG, Kyu-Dong , WOO, Byung-Duk , CHOI, Mi-Jin
发明人： SUNG, Kyu-Dong , WOO, Byung-Duk , CHOI, Mi-Jin
IPC分类号： B23K26/18
CPC分类号： B41J2/471 , G06K15/1228 , G06K15/128
摘要： Provided is a method of sorting marking objects that are to be marked on a substrate by changing set values of a marking parameter for controlling a laser system. The method includes: sorting the marking objects into a first marking group, which includes marking objects corresponding to the first set value, and a second marking group, which includes marking objects corresponding to the second set value; first marking all the marking objects constituting the first marking group; and second marking all the marking objects constituting the second marking group, wherein any one of the first marking and the second marking is first performed and then the other is performed.
摘要翻译：提供了通过改变用于控制激光系统的标记参数的设定值来对要标记在基板上的标记对象进行分类的方法。该方法包括：将标记对象分类为包括对应于第一设定值的标记对象的第一标记组，以及第二标记组，其包括对应于第二设定值的标记对象; 首先标记构成第一标记组的所有标记对象; 并且第二标记构成第二标记组的所有标记对象，其中首先执行第一标记和第二标记中的任一个，然后执行另一标记。

5. 发明申请

WO2007037564A1 APPARATUS FOR MANUFACTURING USING LASER 审中-公开
标题翻译：使用激光制造的装置
公开(公告)号：WO2007037564A1
公开(公告)日：2007-04-05
申请号：PCT/KR2005/003231
申请日：2005-09-29
申请人： EO TECHNICS CO., LTD. , HAN, You-Hie , PARK, Jung-Rae , SUH, Jong-Hyun
发明人： HAN, You-Hie , PARK, Jung-Rae , SUH, Jong-Hyun
IPC分类号： H01L21/78
CPC分类号： B23K26/0736 , B23K26/40 , B23K2201/40 , B23K2203/50
摘要： The apparatus for manufacturing an object using a laser according to the present invention includes: a light source that emits a laser beam; and a focus shaping unit that converts the laser beam emitted from the light source into an elliptical laser beam and radiates the elliptical laser beam onto the surface of the object
摘要翻译：根据本发明的用于制造使用激光的物体的设备包括：发射激光束的光源; 以及聚焦整形单元，其将从光源发射的激光束转换成椭圆形激光束并将椭圆激光束照射到物体的表面上

6. 发明申请

WO2006036037A1 DEFLASHING APPARATUS AND METHOD FOR SEMICONDUCTOR PACKAGES 审中-公开
标题翻译：半导体封装的设备和方法
公开(公告)号：WO2006036037A1
公开(公告)日：2006-04-06
申请号：PCT/KR2004/003063
申请日：2004-11-25
申请人： EO TECHNICS CO., LTD. , HAN, You-Hie
发明人： HAN, You-Hie
IPC分类号： H01L21/56
CPC分类号： H01L35/00 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： The object of the present invention is to provide a deflashing apparatus and method to remove mold flash from a semiconductor package using a laser. The present invention forms a frozen layer on a surface of a semiconductor package using water vapor in the atmosphere, after a molding process is completed, and a CO2 laser is irradiated onto the frozen layer formed on mold flash. As the CO2 laser is absorbed by the frozen layer, a large quantity of water vapor is generated. As the vapor rapidly expands, an impulse wave is generated in a direction opposite to a vapor generating direction, thus removing the mold flash using the impulse wave. Therefore, the present invention allows the mold flash to be easily removed, and because the laser beam is not directly irradiated to the mold flash, a semiconductor package with high reliability and superior packaging can be manufactured.
摘要翻译：本发明的目的是提供一种使用激光从半导体封装去除模具闪光的去屑装置和方法。本发明在模塑工艺完成之后，在大气中使用水蒸汽在半导体封装的表面上形成冷冻层，并且将CO 2激光照射到形成在模具闪光体上的冷冻层上。当CO2激光被冷冻层吸收时，产生大量的水蒸气。当蒸汽快速膨胀时，在与蒸汽产生方向相反的方向上产生脉冲波，从而使用脉冲波去除模具闪光。因此，本发明能够容易地除去模具闪光，并且由于激光束不直接照射到模具闪光灯，因此可以制造具有高可靠性和优异的封装的半导体封装。

7. 发明申请

WO2014193134A1 HIGH SPEED LASER PROCESSING METHOD AND APPARATUS 审中-公开
标题翻译：高速激光加工方法和装置
公开(公告)号：WO2014193134A1
公开(公告)日：2014-12-04
申请号：PCT/KR2014/004699
申请日：2014-05-27
申请人： EO TECHNICS CO., LTD.
发明人： HUR, Jeen
IPC分类号： B23K26/06 , B23K26/08 , B23K26/04 , B23K26/00
CPC分类号： B23K26/0869 , B23K26/043 , B23K26/083
摘要： Provided are a high speed laser processing method and apparatus. The laser processing method includes: mounting a processing target on a stage; irradiating a processing laser beam emitted from a laser beam source unit to the processing target by condensing the processing laser beam by using a condensing unit; and processing the processing target while moving the stage and the condensing unit in opposite directions.
摘要翻译：提供了一种高速激光加工方法和装置。激光加工方法包括：将加工对象安装在台面上; 通过使用冷凝单元来聚焦处理激光束，将从激光束源单元发射的处理激光束照射到处理对象; 并且在相反方向移动台和冷凝单元的同时处理处理目标。

8. 发明申请

WO2010019003A2 REGULAR LITHOGRAPHY METHOD 审中-公开
标题翻译：常规光刻法
公开(公告)号：WO2010019003A2
公开(公告)日：2010-02-18
申请号：PCT/KR2009004518
申请日：2009-08-13
申请人： EO TECHNICS CO LTD , SEO MAN SEUNG , KIM HAE RYUNG
发明人： SEO MAN SEUNG , KIM HAE RYUNG
IPC分类号： H01L21/027
CPC分类号： G03F7/70358 , G03F7/70291 , G03F7/705 , G03F7/70525
摘要： The present invention relates to a regular lithography method in digital lithography using a spatial light modulator, wherein the regular lithography method adjusts a focus to a scan pitch and spacing between beams so that the projection structure formed on a substrate by beams projected onto the substrate can be mathematically defined on the basis of a projection configuration angle, to thereby form a regular projection structure of a regular triangle configuration and a right-angle isosceles triangle configuration of super resolution, to increase a scan ratio while maintaining the super resolution and the regular projection structure, to increase a projection length ratio while maintaining the super resolution, the regular projection structure, and the number of micro-mirrors, and to ensure, at the same time, the regularity, accuracy, economical advantages, efficiency and rapidity of the digital lithography which makes the high-speed generation and transmission of a digital mask by the structural compression based on a projection structure.
摘要翻译：本发明涉及一种在使用空间光调制器的数字光刻中的常规光刻方法，其中常规光刻方法将焦点调节为光束之间的扫描节距和间距，使得通过投射到基板上的光束在基板上形成的投影结构基于投影配置角度在数学上限定，从而形成规则三角形配置和超分辨率的直角等腰三角形配置的规则投影结构，以在保持超分辨率的同时增加扫描比，并且规则投影结构，在保持超分辨率，规则投影结构和微镜数量的同时增加投影长度比，并且同时确保数字化的规律性，准确性，经济优势，效率和快速性通过t使得数字掩模的高速生成和传输的光刻他基于投影结构进行结构压缩。

9. 发明申请

WO2008105631A1 LASER PROCESSING APPARATUS AND METHOD 审中-公开
标题翻译：激光加工设备和方法
公开(公告)号：WO2008105631A1
公开(公告)日：2008-09-04
申请号：PCT/KR2008/001135
申请日：2008-02-27
申请人： EO TECHNICS CO., LTD. , HONG, Eun Jeong , JUNG, Won Chul , KIM, Tae Hyun , LEE, Hak Yong , LEE, Dong Jun , RYOO, Tae Kyoung , LIM, Jae Kwan
发明人： HONG, Eun Jeong , JUNG, Won Chul , KIM, Tae Hyun , LEE, Hak Yong , LEE, Dong Jun , RYOO, Tae Kyoung , LIM, Jae Kwan
IPC分类号： B23K26/067
CPC分类号： B23K26/067 , B23K26/0652 , B23K26/066 , B23K26/0676 , B23K26/0736 , B23K26/082 , B23K26/0821 , B23K26/364 , B23K26/40 , B23K2201/40 , B23K2203/50
摘要： Disclosed are a laser processing apparatus and a method thereof that splits incident laser beam into at least two laser beams, transfers the stage in the direction opposing to the irradiation direction of the laser beam to process the object, thereby improving the processing quality of the object and the efficiency. A laser processing apparatus according to the invention includes; a beam splitting unit that splits a laser beam emitted from a laser generating unit into at least two laser beams; a beam scanner that receives the split laser beams from the beam splitting unit and reflects the beams so as to be repeatedly irradiated onto a processing position of the object; and a stage transfer unit that transfers at least once a stage on which the object is placed to the direction opposing to the irradiation direction of the laser beam during the processing of the object Therefore, since the same effect that the laser beam is irradiated plural times on the same processing surface with a low energy can be achieved, which secures the narrow beam width. Further, since the laser beam that is split into a plurality of laser beams is simultaneously irradiated onto the object, it is possible to secure the higher processing speed. Furthermore, it is possible to improve the processing speed by transferring the stage in a direction opposing to the irradiation direction of the laser beam.
摘要翻译：公开了一种激光加工装置及其方法，其将入射激光束分裂成至少两束激光束，在与激光束的照射方向相反的方向上传送舞台以处理物体，从而提高对象的处理质量和效率。根据本发明的激光加工装置包括：分束单元，其将从激光产生单元发射的激光束分成至少两个激光束; 束扫描器，其从分束单元接收分离的激光束并反射光束，以便反复照射到物体的处理位置; 以及舞台传送单元，在物体的处理期间至少传送一次放置物体的阶段到与激光束的照射方向相反的方向。因此，由于激光束被照射多次的效果相同可以实现在具有低能量的相同处理表面上，这确保了窄的波束宽度。此外，由于分割成多个激光束的激光束同时被照射到物体上，因此可以确保更高的处理速度。此外，可以通过在与激光束的照射方向相反的方向上转印台来提高处理速度。

10. 发明申请

WO2007055452A1 LASER PROCESSING APPARATUS USING LASER BEAM SPLITTING 审中-公开
标题翻译：激光加工设备使用激光束分割
公开(公告)号：WO2007055452A1
公开(公告)日：2007-05-18
申请号：PCT/KR2006/002517
申请日：2006-06-28
申请人： EO TECHNICS CO., LTD. , LEE, Dong Jun , PARK, Jung Rae , HONG, Eun Jeong , SEO, Gi Hong
发明人： LEE, Dong Jun , PARK, Jung Rae , HONG, Eun Jeong , SEO, Gi Hong
IPC分类号： B23K26/067
CPC分类号： B23K26/067 , B23K26/0736 , B23K26/083 , B23K26/38 , B23K26/40 , B23K2201/40 , B23K2203/42 , B23K2203/50
摘要： The present invention relates to a laser processing apparatus using laser beam splitting, which divides an incident laser beam into at least two beams and processes a workpiece using at least two beams, thereby improving processing quality and increasing processing efficiency. The laser processing apparatus includes a beam splitting means for dividing the laser beam emitted from the laser generation means into at least two beams and causing the resultant beams to be incident on the mirror. The beam splitting means comprises a prism, beam splitter or a combination of a prism and a beam splitter.
摘要翻译：本发明涉及使用激光束分割的激光加工装置，其将入射的激光束分成至少两个光束，并使用至少两个光束来处理工件，从而提高加工质量并提高加工效率。激光加工装置包括：分束装置，用于将从激光产生装置发射的激光束分成至少两个光束，并使所得到的光束入射到反射镜上。分束装置包括棱镜，分束器或棱镜和分束器的组合。

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