专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2019006763A1 RGB LED PACKAGE WITH BSY EMITTER 审中-公开
公开(公告)号：WO2019006763A1
公开(公告)日：2019-01-10
申请号：PCT/CN2017/092289
申请日：2017-07-07
申请人： CREE HONG KONG LIMITED
发明人： PANG, Charles Chak Hau , LAU, Victor Yue Kwong , SU, Tiancai
IPC分类号： H01L25/075 , H01L33/50 , G09F9/33
摘要： LED packages (50) are disclosed capable of emitting a range of colors including white light, while still emitting that can have a high color rendering index (CRI). The LED packages (50) can have a simplified reflective cup (54) arrangement and improved lead frame (56) design. The LED packages (50) comprise one or more LED with phosphors for high CRI lighting applications, along with multiple narrowband emitters (e.g. RGB LEDs), but do not have a dam or partition to segregate the LED with phosphors from the multiple emitters. This results in a LED package (50) that is less complex and easier to manufacture, while still providing the desired flexibility in LED package (50) emissions.

2. 发明申请

WO2012059063A1 WHITE CERAMIC LED PACKAGE 审中-公开
标题翻译：白色陶瓷LED包装
公开(公告)号：WO2012059063A1
公开(公告)日：2012-05-10
申请号：PCT/CN2011/081752
申请日：2011-11-03
申请人： CREE HONG KONG LIMITED , CHAN, Alex Chi Keung , PANG, Charles Chak Hau , LAU, Victor Yue Kwong
发明人： CHAN, Alex Chi Keung , PANG, Charles Chak Hau , LAU, Victor Yue Kwong
IPC分类号： H01L33/48
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/09701 , H01L2924/00014 , H01L2924/00
摘要： The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes. In some embodiments, the structural integrity of the package can also be attributed to indentations along its sides, which do not enable as much plating material to accumulate at the sides and helps package cutting processes during manufacture. The indentations can also contribute to displays having more tightly and densely packed LED arrays.
摘要翻译：本发明涉及使用白色陶瓷壳体和具有改进的颜色混合和结构完整性的薄/薄型封装的无引线LED封装和LED显示器。在一些实施例中，改进的颜色混合部分地由白色陶瓷封装壳体提供，其可以帮助将来自每个LED的光从许多方向反射离开该装置。 LED的非线性布置也可以有助于改进色混合。改进的结构完整性可以通过与壳体配合以用于更强的封装结构的接合焊盘中的各种特征来提供。此外，在一些实施例中，每个封装的薄度/薄度归因于其无引线结构，其中焊盘和电极通过通孔电连接。在一些实施例中，包装的结构完整性也可以归因于其侧面的凹痕，其不能使得电镀材料能够在侧面积聚并且有助于在制造期间封装切割工艺。压痕还可以有助于具有更紧密和密集的LED阵列的显示器。

3. 发明申请

WO2012026966A1 EMITTER PACKAGE WITH ANGLED OR VERTICAL LED 审中-公开
标题翻译：带有直角或垂直LED的发光二极管
公开(公告)号：WO2012026966A1
公开(公告)日：2012-03-01
申请号：PCT/US2011/001457
申请日：2011-08-18
申请人： CREE, INC. , CREE HONG KONG LIMITED , EMERSON, David, Todd , CHAN, Alex Chi, Keung
发明人： EMERSON, David, Todd , CHAN, Alex Chi, Keung
IPC分类号： H01L33/48
CPC分类号： H01L33/48 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/50 , H01L33/52 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention is directed to LED packages and LED displays utilizing the LED packages, wherein the LED chips within the packages are arranged in unique orientations to provide the desired package or display FFP. One LED package according to the present invention comprises a reflective cup and an LED chip mounted in the reflective cup. The reflective cup has a first axis and a second axis orthogonal to the first axis, wherein the LED chip is rotated within the reflective cup so that the LED chip is out of alignment with said first axis. Some of the LED packages can comprise a rectangular LED chip having a chip longitudinal axis and an oval shaped reflective cup having a cup longitudinal axis. The LED chip is mounted within the reflective cup with the chip longitudinal axis angled from the cup longitudinal axis. LED displays according to the present invention comprise a plurality of LED packages, at least some of which have an LED chip mounted in a reflective cup at different angles to achieve the desired display FFP.
摘要翻译：本发明涉及使用LED封装的LED封装和LED显示器，其中封装内的LED芯片以独特的取向布置以提供所需的封装或显示器FFP。根据本发明的一个LED封装包括安装在反射杯中的反射杯和LED芯片。反射杯具有与第一轴正交的第一轴和第二轴，其中LED芯片在反射杯内旋转，使得LED芯片与所述第一轴线不对准。一些LED封装可以包括具有芯片纵向轴线的矩形LED芯片和具有杯纵向轴线的椭圆形反射杯。 LED芯片安装在反射杯内，其芯片纵向轴线从杯纵向轴线成角度。根据本发明的LED显示器包括多个LED封装，其至少其中一些具有以不同角度安装在反射杯中的LED芯片以实现期望的显示器FFP。

4. 发明申请

WO2012013161A1 WATER RESISTANT SURFACE MOUNT DEVICE PACKAGE 审中-公开
标题翻译：防水表面安装设备包装
公开(公告)号：WO2012013161A1
公开(公告)日：2012-02-02
申请号：PCT/CN2011/077823
申请日：2011-07-29
申请人： CREE HONG KONG LIMITED , CHAN, Alex Chi Keung , PANG, Charles Chak Hau
发明人： CHAN, Alex Chi Keung , PANG, Charles Chak Hau
IPC分类号： H01L33/62 , H01L33/48 , H01L23/495
CPC分类号： H01L33/486 , H01L24/73 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/09701 , H01L2924/1815 , H01L2933/0033 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： LED packages (10) and LED displays utilize water resistant packages with improved structural integrity and customizable attributes. The improved structural integrity is provided by various features in the lead frame (14) that the casing (12) material encompasses to improve the adhesion between the lead frame (14) and the casing (12) for a stronger, water resistant package (10). Moreover, the improved structural integrity and water resistance is further provided by cavity (40) features that improve adhesion between the cavity (40) and a protective encapsulant. Packages (10) with a greater overall height than the length of their side-exposed solder pins are provided, which improves gel coverage of the side-exposed solder pins between adjacent packages (10).
摘要翻译： LED封装（10）和LED显示屏使用防水包装，具有改进的结构完整性和可定制的属性。改进的结构完整性由引线框架（14）中的各种特征提供，壳体（12）材料包围以改善引线框架（14）和壳体（12）之间的粘合性，用于更强的防水封装（10 ）。此外，通过改善空腔（40）和保护性密封剂之间的粘附性的腔（40）特征进一步提供改进的结构完整性和耐水性。提供了具有比其侧面暴露的焊接引脚的长度更大的总体高度的封装（10），其改善了相邻封装（10）之间的侧面暴露的焊接引脚的凝胶覆盖。

5. 发明申请

WO2010051758A1 MULTI-CHIP LIGHT EMITTING DIODE MODULES 审中-公开
标题翻译：多芯片发光二极管模块
公开(公告)号：WO2010051758A1
公开(公告)日：2010-05-14
申请号：PCT/CN2009/074800
申请日：2009-11-05
申请人： CREE HONG KONG LIMITED , LEUNG, Jacob Chi Wing
发明人： LEUNG, Jacob Chi Wing
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/483 , H01L33/60 , H01L33/62 , H01L2224/48091 , H05K1/056 , H05K2201/0112 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： A multi-chip lighting module (10) is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device (10) comprises a substantially thermally dissipative substrate (12) with a dark insulating layer (14) deposited on a surface of the substrate (12). A plurality of light emitting devices (34) is also provided. An electrically conductive layer is applied to a surface of the substrate (12), with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices (34). Each light emitting device (34) has a first and a second electrical terminal. A reflective layer (44) is also provided that at least partially covers the conductive layer.
摘要翻译：公开了一种用于最大化光通量输出和热管理的多芯片照明模块（10）。在一个实施例中，多芯片模块装置（10）包括具有沉积在基板（12）的表面上的暗绝缘层（14）的基本上散热的基板（12）。还提供了多个发光器件（34）。导电层被施加到衬底（12）的表面，导电层包括多个芯片载体部件，每个芯片载体部件具有用于承载至少一个发光器件（34）的表面。每个发光器件（34）具有第一和第二电端子。还提供了至少部分地覆盖导电层的反射层（44）。

6. 发明申请

WO2008101433A1 SURFACE MOUNT DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：表面安装装置及其制造方法
公开(公告)号：WO2008101433A1
公开(公告)日：2008-08-28
申请号：PCT/CN2008/070298
申请日：2008-02-13
申请人： CREE HONG KONG LIMITED , XIE, Jian Hui , LEUNG, Chi Wing , WANG, Xuan
发明人： XIE, Jian Hui , LEUNG, Chi Wing , WANG, Xuan
IPC分类号： H01L23/04
CPC分类号： H01L33/644 , F21V29/503 , F21V29/507 , F21V29/70 , H01L23/057 , H01L33/642 , H01L2224/32245 , H05K7/2039
摘要： A surface mount device and manufacturing method thereof are provided. The surface mount device comprises: a casing (12) with a first surface (26), a second surface(28), and at least one lateral side surface (30,32,34,36); a recess formed in the first surface and extending into the casing; a plurality of leads (16,18,20,22) partially encased by the casing; and one or more electronic devices coupled with at least one of the plurality of leads and at least partially exposed through the recess. A heat sink (24) may be included for heat dissipation.
摘要翻译：提供表面安装器件及其制造方法。该表面安装装置包括：具有第一表面（26），第二表面（28）和至少一个横向侧表面（30,32,34,36）的壳体（12）; 形成在所述第一表面中并延伸到所述壳体中的凹部; 多个引线（16,18,20,22），部分地被外壳包围; 以及一个或多个电子装置，所述电子装置与所述多个引线中的至少一个引线耦合并且至少部分地通过所述凹部暴露。散热器（24）可以包括散热。

7. 发明申请

WO2014139183A1 MODULAR LENSED TROFFER FIXTURE 审中-公开
标题翻译：模块化透镜夹具
公开(公告)号：WO2014139183A1
公开(公告)日：2014-09-18
申请号：PCT/CN2013/072772
申请日：2013-03-15
申请人： CREE HONG KONG LIMITED , VAN DE VEN, Antony Paul , CHAN, Wai Kwan , HO, Chin Wah , SO, Gauss Ho Ching
发明人： VAN DE VEN, Antony Paul , CHAN, Wai Kwan , HO, Chin Wah , SO, Gauss Ho Ching
IPC分类号： F21V7/00
CPC分类号： F21V7/0083 , F21V7/0025 , F21Y2105/10 , F21Y2115/10
摘要： A modular lensed troffer fixture that is well-suited for use with solid state light sources. A housing provides the structural frame for a plurality of light modules arranged in an array (e.g., 2 x 2, 4 x 1). Each of the modules comprises an array of light emitters (e.g., LEDs) at the base of a reflection chamber that is defined by reflector panels. Primary optics are placed over the open end of the reflection chambers. The primary optics may comprise a diffuser and/or a polarized film. The light module array may be surrounded by a reflective pan structure. A secondary optic (e.g., a textured lens) is placed at the fixture opening to interact with the light as it is emitted from the fixture. The emitted light interacts with reflective surfaces, optics, and other components that work to diffuse and mix the light to provide a visually pleasing luminous output.
摘要翻译：模块化透镜套管夹具，非常适合用于固态光源。壳体为布置成阵列（例如，2×2,4×1）的多个光模块提供结构框架。每个模块包括由反射器面板限定的反射室底部的发光体（例如，LED）的阵列。主光学器件放置在反射室的开口端上。主要光学器件可以包括漫射器和/或偏振膜。光模块阵列可以被反射盘结构包围。辅助光学器件（例如，纹理化透镜）被放置在固定器开口处，以便在从灯具发射时与光相互作用。发射的光与反射表面，光学器件和其他部件相互作用，其功能是漫射和混合光线，以提供视觉上令人满意的发光输出。

8. 发明申请

WO2010081403A1 ALIGNED MULTIPLE EMITTER PACKAGE 审中-公开
标题翻译：对准多发射体包装
公开(公告)号：WO2010081403A1
公开(公告)日：2010-07-22
申请号：PCT/CN2010/070073
申请日：2010-01-08
申请人： CREE HONG KONG LIMITED , CHAN, Chi Keung Alex , LAU, Yue Kwong Victor , WANG, Xuan
发明人： CHAN, Chi Keung Alex , LAU, Yue Kwong Victor , WANG, Xuan
IPC分类号： H01L33/52 , H01L33/62 , H01L23/495
CPC分类号： H01L33/62 , H01L23/49861 , H01L24/73 , H01L25/0753 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/14 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A multiple element emitter package is disclosed for increasing color fidelity and heat dissipation, improving current control, increasing rigidity of the package assembly, In one embodiment, the package comprises a surface-mount device a casing with a cavity extending into the interior of the casing from a first main surface is provided. A lead frame is at least partially encased by the casing, the lead frame comprising a plurality of electrically conductive parts carrying a linear array of light emitting devices (LEDs). Electrically conductive parts, separate from parts carrying the LEDs have a connection pad, wherein the LEDs are electrically coupled to a connection pad, such as by a wire bond. This lead frame arrangement allows for a respective electrical signal can be applied to each of the LEDs. The emitter package may be substantially waterproof, and an array of the emitter packages may be used in an LED display such as an indoor and/or outdoor LED screen.
摘要翻译：公开了一种用于增加色彩保真度和散热，改善电流控制，提高封装组件的刚性的多元件发射器封装。在一个实施例中，封装包括表面安装器件，具有延伸到壳体内部的空腔的壳体从第一主表面提供。引线框架至少部分地被壳体包围，引线框架包括承载发光器件（LED）的线性阵列的多个导电部件。与携带LED的部件分开的导电部件具有连接焊盘，其中LED例如通过引线键合电耦合到连接焊盘。该引线框布置允许相应的电信号可以被施加到每个LED。发射器封装可以是基本上防水的，并且发射器封装的阵列可以用在诸如室内和/或室外LED屏的LED显示器中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式