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1. 发明申请

WO2012087432A3 COOLING OF COPLANAR ACTIVE CIRCUITS 审中-公开
公开(公告)号：WO2012087432A3
公开(公告)日：2012-06-28
申请号：PCT/US2011/059071
申请日：2011-11-03
申请人： RAYTHEON COMPANY , CHEYNE, Scott, R. , PAQUETTE, Jeffrey , ACKERMAN, Mark
发明人： CHEYNE, Scott, R. , PAQUETTE, Jeffrey , ACKERMAN, Mark
IPC分类号： H01Q1/02 , H01Q21/00 , H01Q21/06 , H01L23/40
摘要： In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.

2. 发明申请

WO2011059470A1 COLD CHASSIS FOR ELECTRONIC MODULES AND METHOD OF MAKING SAME 审中-公开
标题翻译：电子模块的冷库及其制造方法
公开(公告)号：WO2011059470A1
公开(公告)日：2011-05-19
申请号：PCT/US2010/002742
申请日：2010-10-14
申请人： RAYTHEON COMPANY , ALTMAN, David, H. , CHEYNE, Scott, R. , GUPTA, Anurag
发明人： ALTMAN, David, H. , CHEYNE, Scott, R. , GUPTA, Anurag
IPC分类号： F28D5/00
CPC分类号： H05K7/20418 , F28D15/0266 , F28D2021/0029 , F28F3/02 , F28F3/12 , F28F9/02 , F28F2260/02 , F28F2275/04 , F28F2275/062 , H01L23/473 , H01L2924/0002 , H05K7/2029 , H05K7/20636 , H05K7/20645 , Y10T29/4935 , Y10T29/49359 , Y10T29/49366 , Y10T29/49369 , Y10T29/49373 , H01L2924/00
摘要： A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.
摘要翻译：一种冷底盘和制造用于电子模块的冷底盘的方法，其特征在于制造各自包括沿其长度的微通道的单独的钎焊冷却肋和周边凸缘。一组相邻的肋固定在一起并组装到框架构件的至少一个面上。肋凸缘相对于框架构件被密封（例如摩擦搅拌焊接）。

3. 发明申请

WO2010111004A1 A BUSBAR CONNECTOR 审中-公开
标题翻译：母线连接器
公开(公告)号：WO2010111004A1
公开(公告)日：2010-09-30
申请号：PCT/US2010/026014
申请日：2010-03-03
申请人： RAYTHEON COMPANY , CHEYNE, Scott R. , PAQUETTE, Jeffrey , WALKER, John D. , ZARKH, Dimitry
发明人： CHEYNE, Scott R. , PAQUETTE, Jeffrey , WALKER, John D. , ZARKH, Dimitry
IPC分类号： H01R25/16 , H02G5/00 , H02G5/08
CPC分类号： H01R25/162 , H01R4/38
摘要： In one aspect, a busbar connector includes first and second portions. Each portion includes a rigid member forming an exterior portion of the busbar connector, a conduction member forming an interior portion of the busbar connector and a compliant member having a stiffness less than the rigid member and including a first surface attached to the rigid member and a second surface opposite the first surface attached to the conduction member. The busbar connector also includes a fastener structure configured to secure a first busbar and a second busbar between and in contact with the conduction members of the first and second portions to allow current to flow between the first and second busbars.
摘要翻译：一方面，母线连接器包括第一和第二部分。每个部分包括形成母线连接器的外部部分的刚性构件，形成母线连接器的内部的导电构件和具有小于刚性构件的刚度的顺应构件，并且包括附接到刚性构件的第一表面和与连接到导电构件的第一表面相对的第二表面。母线连接器还包括紧固件结构，其被配置为将第一母线和第二母线固定在第一和第二部分的导电部件之间并与之接触，以允许电流在第一和第二母线之间流动。

4. 发明申请

WO2010110997A1 AN ELECTRICAL CONNECTOR TO CONNECT CIRCUIT CARDS 审中-公开
标题翻译：连接电路卡的电气连接器
公开(公告)号：WO2010110997A1
公开(公告)日：2010-09-30
申请号：PCT/US2010/025860
申请日：2010-03-02
申请人： RAYTHEON COMPANY , PAQUETTE, Jeffrey , CHEYNE, Scott, R.
发明人： PAQUETTE, Jeffrey , CHEYNE, Scott, R.
IPC分类号： H01R13/631
CPC分类号： H01R12/52 , H01Q21/061
摘要： In one aspect, an electrical connector to connect circuit cards includes a compliant member that includes a first end portion and a second end portion, a first rigid member attached to the first end portion of the compliant member and including a first bore extending along an axis, a second rigid member attached to the second end portion of the compliant member and including a second bore extending along the axis and a pin secured in the first bore and configured to move within the second bore. The compliant member is configured to translate along the axis from a first position corresponding to the first and second rigid members being separated to a second position corresponding to the first and second rigid members being in direct contact.
摘要翻译：一方面，用于连接电路卡的电连接器包括包括第一端部和第二端部的顺应性构件，附接到顺应构件的第一端部的第一刚性构件，并且包括沿轴线延伸的第一孔附接到所述柔顺构件的第二端部的第二刚性构件，并且包括沿所述轴线延伸的第二孔和固定在所述第一孔中并构造成在所述第二孔内移动的销。柔性构件被构造成沿着轴线从对应于第一和第二刚性构件的第一位置平移到相对于直接接触的第一和第二刚性构件的第二位置。

5. 发明申请

WO2011046707A1 COOLING ACTIVE CIRCUITS 审中-公开
标题翻译：冷却有源电路
公开(公告)号：WO2011046707A1
公开(公告)日：2011-04-21
申请号：PCT/US2010/049261
申请日：2010-09-17
申请人： RAYTHEON COMPANY , DANELLO, Paul, A. , CHEYNE, Scott, R. , ELLSWORTH, Joseph, R. , TELLINGHUISEN, Thomas, J.
发明人： DANELLO, Paul, A. , CHEYNE, Scott, R. , ELLSWORTH, Joseph, R. , TELLINGHUISEN, Thomas, J.
IPC分类号： H05K7/20 , H01Q21/00
CPC分类号： H05K7/20509 , H01Q21/0087
摘要： In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.
摘要翻译：在一个方面，组件包括包括第一表面的面板。面板还包括耦合到面板的第一表面的第一有源电路和具有第一孔的冷板。冷板包括由第一孔露出的第一内表面。面板还包括与冷板的第一内表面和第一有源电路接触的第一导热材料。

6. 发明申请

WO2012087432A2 COOLING OF COPLANAR ACTIVE CIRCUITS 审中-公开
标题翻译：共振有源电路的冷却
公开(公告)号：WO2012087432A2
公开(公告)日：2012-06-28
申请号：PCT/US2011059071
申请日：2011-11-03
申请人： RAYTHEON CO , CHEYNE SCOTT R , PAQUETTE JEFFREY , ACKERMAN MARK
发明人： CHEYNE SCOTT R , PAQUETTE JEFFREY , ACKERMAN MARK
IPC分类号： A63C10/02
CPC分类号： H01Q1/02 , H01L23/4006 , H01L2924/0002 , H01Q21/0025 , H01Q21/065 , H05K1/141 , H01L2924/00
摘要： In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.
摘要翻译：一方面，一种系统包括：第一电路板，其包括集成电路;第一散热器，耦合到第一电路板的集成电路;耦合到第一电路板的第一柔性板;包括集成电路的第二电路板; 以及耦合到第二电路板的集成电路的第二散热器。第一电路板和第一散热器具有第一厚度。第二子板和第二散热器具有第二厚度。该系统包括耦合到第二电路板的第二柔性板，耦合到第一和第二柔性板的板组件和与第一和第二散热器接触的冷板组件。第一或第二兼容板中的任一个被配置为扩展或收缩以考虑第一和第二厚度之间的差异。

7. 发明申请

WO2011106094A1 CIRCUIT CARD ASSEMBLY CONNECTOR AND INTERCONNECTION SYSTEM 审中-公开
标题翻译：电路卡组件连接器和互连系统
公开(公告)号：WO2011106094A1
公开(公告)日：2011-09-01
申请号：PCT/US2011/000343
申请日：2011-02-25
申请人： RAYTHEON COMPANY , PAQUETTE, Jeffrey , CHEYNE, Scott, R. , LEMMLER, Craig, C.
发明人： PAQUETTE, Jeffrey , CHEYNE, Scott, R. , LEMMLER, Craig, C.
IPC分类号： G06K7/00
CPC分类号： H01R12/721 , H05K1/117 , H05K1/141 , H05K1/142 , H05K3/366 , H05K3/403 , H05K2201/0311 , H05K2201/1034
摘要： A circuit card assembly connector system includes a circuit card assembly and an edge connector including a set of resilient, spaced, conductive contacts electrically isolated from each other and extending from a surface of and over an edge of the circuit card assembly; an interconnection system for circuit card assemblies may include at least first and second circuit card assemblies, at least one having such an edge connector for interconnecting with a set of contacts of the other circuit card assembly.
摘要翻译：电路卡组件连接器系统包括电路卡组件和边缘连接器，所述边缘连接器包括彼此电隔离并从电路卡组件的边缘的表面延伸的一组弹性隔开的导电触点; 用于电路卡组件的互连系统可以包括至少第一和第二电路卡组件，至少一个电路卡组件具有这样的边缘连接器，用于与另一电路卡组件的一组触点相互连接。

8. 发明申请

WO2010111012A3 TRANSLATING HINGE 审中-公开
公开(公告)号：WO2010111012A3
公开(公告)日：2010-09-30
申请号：PCT/US2010/026324
申请日：2010-03-05
申请人： RAYTHEON COMPANY , PAQUETTE, Jeffrey , CHEYNE, Scott, R.
发明人： PAQUETTE, Jeffrey , CHEYNE, Scott, R.
IPC分类号： E05D3/02 , H01Q21/00
摘要： A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.

9. 发明申请

WO2010111012A2 TRANSLATING HINGE 审中-公开
标题翻译：翻译铰链
公开(公告)号：WO2010111012A2
公开(公告)日：2010-09-30
申请号：PCT/US2010026324
申请日：2010-03-05
申请人： RAYTHEON CO , PAQUETTE JEFFREY , CHEYNE SCOTT R
发明人： PAQUETTE JEFFREY , CHEYNE SCOTT R
IPC分类号： E05D3/02
CPC分类号： E05D3/022 , H01Q1/02 , H01Q21/0025 , H01Q21/061 , H05K7/16 , Y10T16/532 , Y10T16/5324 , Y10T16/53257 , Y10T16/5327 , Y10T16/5353 , Y10T16/53834 , Y10T16/557
摘要： A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.
摘要翻译：平移铰链包括平移元件和旋转组件，所述平移元件在由平移铰链连接的两个物体之间提供平移运动，所述平移元件连接到平移元件。

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