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1. 发明申请

WO2011059470A1 COLD CHASSIS FOR ELECTRONIC MODULES AND METHOD OF MAKING SAME 审中-公开
标题翻译：电子模块的冷库及其制造方法
公开(公告)号：WO2011059470A1
公开(公告)日：2011-05-19
申请号：PCT/US2010/002742
申请日：2010-10-14
申请人： RAYTHEON COMPANY , ALTMAN, David, H. , CHEYNE, Scott, R. , GUPTA, Anurag
发明人： ALTMAN, David, H. , CHEYNE, Scott, R. , GUPTA, Anurag
IPC分类号： F28D5/00
CPC分类号： H05K7/20418 , F28D15/0266 , F28D2021/0029 , F28F3/02 , F28F3/12 , F28F9/02 , F28F2260/02 , F28F2275/04 , F28F2275/062 , H01L23/473 , H01L2924/0002 , H05K7/2029 , H05K7/20636 , H05K7/20645 , Y10T29/4935 , Y10T29/49359 , Y10T29/49366 , Y10T29/49369 , Y10T29/49373 , H01L2924/00
摘要： A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a frame member. The rib flanges are sealed (e.g., friction stir welded) with respect to the frame member.
摘要翻译：一种冷底盘和制造用于电子模块的冷底盘的方法，其特征在于制造各自包括沿其长度的微通道的单独的钎焊冷却肋和周边凸缘。一组相邻的肋固定在一起并组装到框架构件的至少一个面上。肋凸缘相对于框架构件被密封（例如摩擦搅拌焊接）。

2. 发明申请

WO2010110997A1 AN ELECTRICAL CONNECTOR TO CONNECT CIRCUIT CARDS 审中-公开
标题翻译：连接电路卡的电气连接器
公开(公告)号：WO2010110997A1
公开(公告)日：2010-09-30
申请号：PCT/US2010/025860
申请日：2010-03-02
申请人： RAYTHEON COMPANY , PAQUETTE, Jeffrey , CHEYNE, Scott, R.
发明人： PAQUETTE, Jeffrey , CHEYNE, Scott, R.
IPC分类号： H01R13/631
CPC分类号： H01R12/52 , H01Q21/061
摘要： In one aspect, an electrical connector to connect circuit cards includes a compliant member that includes a first end portion and a second end portion, a first rigid member attached to the first end portion of the compliant member and including a first bore extending along an axis, a second rigid member attached to the second end portion of the compliant member and including a second bore extending along the axis and a pin secured in the first bore and configured to move within the second bore. The compliant member is configured to translate along the axis from a first position corresponding to the first and second rigid members being separated to a second position corresponding to the first and second rigid members being in direct contact.
摘要翻译：一方面，用于连接电路卡的电连接器包括包括第一端部和第二端部的顺应性构件，附接到顺应构件的第一端部的第一刚性构件，并且包括沿轴线延伸的第一孔附接到所述柔顺构件的第二端部的第二刚性构件，并且包括沿所述轴线延伸的第二孔和固定在所述第一孔中并构造成在所述第二孔内移动的销。柔性构件被构造成沿着轴线从对应于第一和第二刚性构件的第一位置平移到相对于直接接触的第一和第二刚性构件的第二位置。

3. 发明申请

WO2011046707A1 COOLING ACTIVE CIRCUITS 审中-公开
标题翻译：冷却有源电路
公开(公告)号：WO2011046707A1
公开(公告)日：2011-04-21
申请号：PCT/US2010/049261
申请日：2010-09-17
申请人： RAYTHEON COMPANY , DANELLO, Paul, A. , CHEYNE, Scott, R. , ELLSWORTH, Joseph, R. , TELLINGHUISEN, Thomas, J.
发明人： DANELLO, Paul, A. , CHEYNE, Scott, R. , ELLSWORTH, Joseph, R. , TELLINGHUISEN, Thomas, J.
IPC分类号： H05K7/20 , H01Q21/00
CPC分类号： H05K7/20509 , H01Q21/0087
摘要： In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.
摘要翻译：在一个方面，组件包括包括第一表面的面板。面板还包括耦合到面板的第一表面的第一有源电路和具有第一孔的冷板。冷板包括由第一孔露出的第一内表面。面板还包括与冷板的第一内表面和第一有源电路接触的第一导热材料。

4. 发明申请

WO2012087432A3 COOLING OF COPLANAR ACTIVE CIRCUITS 审中-公开
公开(公告)号：WO2012087432A3
公开(公告)日：2012-06-28
申请号：PCT/US2011/059071
申请日：2011-11-03
申请人： RAYTHEON COMPANY , CHEYNE, Scott, R. , PAQUETTE, Jeffrey , ACKERMAN, Mark
发明人： CHEYNE, Scott, R. , PAQUETTE, Jeffrey , ACKERMAN, Mark
IPC分类号： H01Q1/02 , H01Q21/00 , H01Q21/06 , H01L23/40
摘要： In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.

5. 发明申请

WO2010111012A3 TRANSLATING HINGE 审中-公开
公开(公告)号：WO2010111012A3
公开(公告)日：2010-09-30
申请号：PCT/US2010/026324
申请日：2010-03-05
申请人： RAYTHEON COMPANY , PAQUETTE, Jeffrey , CHEYNE, Scott, R.
发明人： PAQUETTE, Jeffrey , CHEYNE, Scott, R.
IPC分类号： E05D3/02 , H01Q21/00
摘要： A translating hinge includes a translation element which provides translational movement between two objects coupled by the translating hinge and a rotating assembly coupled to the translation element.

6. 发明申请

WO2011106094A1 CIRCUIT CARD ASSEMBLY CONNECTOR AND INTERCONNECTION SYSTEM 审中-公开
标题翻译：电路卡组件连接器和互连系统
公开(公告)号：WO2011106094A1
公开(公告)日：2011-09-01
申请号：PCT/US2011/000343
申请日：2011-02-25
申请人： RAYTHEON COMPANY , PAQUETTE, Jeffrey , CHEYNE, Scott, R. , LEMMLER, Craig, C.
发明人： PAQUETTE, Jeffrey , CHEYNE, Scott, R. , LEMMLER, Craig, C.
IPC分类号： G06K7/00
CPC分类号： H01R12/721 , H05K1/117 , H05K1/141 , H05K1/142 , H05K3/366 , H05K3/403 , H05K2201/0311 , H05K2201/1034
摘要： A circuit card assembly connector system includes a circuit card assembly and an edge connector including a set of resilient, spaced, conductive contacts electrically isolated from each other and extending from a surface of and over an edge of the circuit card assembly; an interconnection system for circuit card assemblies may include at least first and second circuit card assemblies, at least one having such an edge connector for interconnecting with a set of contacts of the other circuit card assembly.
摘要翻译：电路卡组件连接器系统包括电路卡组件和边缘连接器，所述边缘连接器包括彼此电隔离并从电路卡组件的边缘的表面延伸的一组弹性隔开的导电触点; 用于电路卡组件的互连系统可以包括至少第一和第二电路卡组件，至少一个电路卡组件具有这样的边缘连接器，用于与另一电路卡组件的一组触点相互连接。

7. 发明申请

WO2014176278A2 REVERSE WEDGELOCK DEVICE 审中-公开
标题翻译：反向楔形装置
公开(公告)号：WO2014176278A2
公开(公告)日：2014-10-30
申请号：PCT/US2014/035032
申请日：2014-04-22
申请人： RAYTHEON COMPANY
发明人： PAQUETTE, Jeffrey , CHEYNE, Scott, R. , MERCIER, Dennis, W.
IPC分类号： H05K7/14
CPC分类号： H05K7/1404 , H05K7/20545 , Y10T29/49826
摘要： A reverse wedgelock device with multiple draw blocks disposed about a lead screw passing through the draw blocks, wherein the draw blocks may be compressed together and caused to displace about respective wedge surfaces upon tightening of the screw. Compression and displacement of the draw blocks can function to draw anchors associated with the draw blocks inward, which, when engaged with opposing objects, functions to draw the objects together.
摘要翻译：具有多个牵引块的反向楔形装置，其布置在穿过牵引块的导螺杆周围，其中牵引块可以被压缩在一起，并且在拧紧螺钉时围绕相应的楔形表面移位。拉伸块的压缩和位移可以用于将与拉伸块相关联的锚定件向内拉，其在与相对的物体接合时用于将物体牵引在一起。

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