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1. 发明申请

WO2010028006A3 ELECTRICALLY CONDUCTIVE ELEMENT, SYSTEM, AND METHOD OF MANUFACTURING 审中-公开
标题翻译：导电元件，系统和制造方法
公开(公告)号：WO2010028006A3
公开(公告)日：2010-07-01
申请号：PCT/US2009055678
申请日：2009-09-02
申请人： USG INTERIORS INC , BOSS DANIEL , QUALLS SCOTT , MCDONALD DAVID , KAISERMAN TERRANCE Z , MARGOLIN KEITH J , WASSIEF MICHAEL , CHAI LIANG
发明人： BOSS DANIEL , QUALLS SCOTT , MCDONALD DAVID , KAISERMAN TERRANCE Z , MARGOLIN KEITH J , WASSIEF MICHAEL , CHAI LIANG
IPC分类号： H01B3/00
CPC分类号： H01H59/00 , H01B5/02 , H01B13/165 , H01H49/00 , H01R4/2404 , H01R25/147 , H05K3/103 , H05K2201/09672 , H05K2201/09963 , Y10T29/49117 , Y10T29/49155 , Y10T307/74
摘要： An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.
摘要翻译：提供包括绝缘体和第一导体的导电元件，其可以固定到由导电结构元件组成的第二导体上，其中绝缘体位于第一和第二导体之间以将它们电隔离。电源可以连接在第一和第二导体之间以向其供电，并且电气设备可以连接在第一和第二导体的两端。

2. 发明申请

WO2012051176A3 CERAMIC CAPACITOR AND METHODS OF MANUFACTURE 审中-公开
标题翻译：陶瓷电容器及其制造方法
公开(公告)号：WO2012051176A3
公开(公告)日：2012-07-12
申请号：PCT/US2011055760
申请日：2011-10-11
申请人： APRICOT MATERIALS TECHNOLOGIES LLC , CHAI LIANG
发明人： CHAI LIANG
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/1227 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/1245 , H01G4/1263 , H01G4/248 , H01G4/30 , H01G4/33
摘要： A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750°C to about 950°C to transform the metal coatings into discrete, separated metal aggregates. Contrary to conventional techniques of separating electrodes by a dielectric tape, this inventive system and method demonstrates that a metalized dielectric layer may be formed in-situ during sintering.
摘要翻译：电容器包括一对电极和设置在该对电极之间的金属化介电层，其中金属化介电层具有分布在电介质材料内的多个金属聚集体。该分布使得金属化介电层中的金属的体积分数至少为约30％。同时，多个金属聚集体通过介电材料彼此分离。形成金属 - 电介质复合材料的方法可以包括用金属涂覆多个电介质颗粒以形成多个金属涂覆的电介质颗粒，并在至少约750℃的温度下烧结多个金属涂覆的电介质颗粒到约950℃，以将金属涂层转变成离散的分离的金属聚集体。与通过介电带分离电极的常规技术相反，本发明的系统和方法证明了可以在烧结期间原位形成金属化电介质层。

3. 发明申请

WO2010028009A2 ELECTRICALLY CONDUCTIVE MODULE 审中-公开
标题翻译：电导体模块
公开(公告)号：WO2010028009A2
公开(公告)日：2010-03-11
申请号：PCT/US2009055684
申请日：2009-09-02
申请人： USG INTERIORS INC , BOSS DANIEL , QUALLS SCOTT , KAISERMAN TERRANCE Z , MARGOLIN KEITH J , WASSIEF MICHAEL , CHAI LIANG
发明人： BOSS DANIEL , QUALLS SCOTT , KAISERMAN TERRANCE Z , MARGOLIN KEITH J , WASSIEF MICHAEL , CHAI LIANG
IPC分类号： H01R13/514 , H01R9/22 , H01R27/00
CPC分类号： H01R9/28 , E04B9/04 , H01R25/16
摘要： An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.
摘要翻译：提供导电模块。模块包括被配置为与一个或多个导电结构元件接合的面板。模块还包括形成在面板上或面板中的导电层。每个导电层具有构造成与至少一个导电结构元件电连通的端子。在本发明的一个实施例中，第一端子被配置为与第一导电结构元件电连通，并且第二端子被配置为与第二导电结构元件电连通。在本发明的另一个实施例中，第一端子和第二端子被配置为与第一导电结构元件电连通。在本实施例中，第一和第二端子分别构造成与第一导电结构元件的第一和第二导电部分电连通。

4. 发明申请

WO2012051176A2 CERAMIC CAPACITOR AND METHODS OF MANUFACTURE 审中-公开
标题翻译：陶瓷电容器和制造方法
公开(公告)号：WO2012051176A2
公开(公告)日：2012-04-19
申请号：PCT/US2011/055760
申请日：2011-10-11
申请人： APRICOT MATERIALS TECHNOLOGIES, LLC , CHAI, Liang
发明人： CHAI, Liang
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/1227 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/1245 , H01G4/1263 , H01G4/248 , H01G4/30 , H01G4/33
摘要： A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750°C to about 950°C to transform the metal coatings into discrete, separated metal aggregates. Contrary to conventional techniques of separating electrodes by a dielectric tape, this inventive system and method demonstrates that a metalized dielectric layer may be formed in-situ during sintering.
摘要翻译：电容器包括一对电极和设置在该对电极之间的金属化电介质层，其中金属化电介质层具有分布在电介质材料内的多个金属聚集体。该分布使得金属化的电介质层中的金属的体积分数为至少约30％。同时，多个金属聚集体通过介电材料彼此分离。用于形成金属 - 电介质复合物的方法可以包括用金属涂覆多个电介质粒子以形成多个金属涂覆的电介质粒子并且在至少约750℃的温度下烧结多个金属涂覆的电介质粒子到约950℃以将金属涂层转变成离散的分离的金属聚集体。与通过介电带分离电极的常规技术相反，本发明的系统和方法证明了金属化介电层可以在烧结过程中原位形成。

5. 发明申请

WO2010028006A8 ELECTRICALLY CONDUCTIVE ELEMENT, SYSTEM, AND METHOD OF MANUFACTURING 审中-公开
公开(公告)号：WO2010028006A8
公开(公告)日：2010-03-11
申请号：PCT/US2009/055678
申请日：2009-09-02
申请人： USG INTERIORS, INC. , BOSS, Daniel , QUALLS, Scott , MCDONALD, David , KAISERMAN, Terrance, Z. , MARGOLIN, Keith, J. , WASSIEF, Michael , CHAI, Liang
发明人： BOSS, Daniel , QUALLS, Scott , MCDONALD, David , KAISERMAN, Terrance, Z. , MARGOLIN, Keith, J. , WASSIEF, Michael , CHAI, Liang
IPC分类号： H01B3/00
摘要： An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.

6. 发明申请

WO2011084502A2 CAPACITOR WITH THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODE AND METHODS OF MANUFACTURE 审中-公开
标题翻译：具有三维高表面积电极的电容器和制造方法
公开(公告)号：WO2011084502A2
公开(公告)日：2011-07-14
申请号：PCT/US2010/060547
申请日：2010-12-15
申请人： APRICOT MATERIALS TECHNOLOGIES, LLC , CHAI, Liang , RAE, Alan , WILSON, Jim
发明人： CHAI, Liang , RAE, Alan , WILSON, Jim
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/10 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/1209 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved "three-dimensional" capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three- dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional "electrode - dielectric - electrode" arrangements in an ever increasing stack, or serially stringing together multiple capacitors.
摘要翻译：公开了一种电容器及其制造方法，其具有由增加电极表面的有效面积而导致的改善的电容效率。改进的“三维” 电容器可以用与电介质的界面处具有三维方面的电极层构造，使得电极的部分延伸到电介质层中。有利地，与当前的电容器设计相比，三维电容器的实施例显着地减小了电路中容纳电容器所需的空间占用面积。可以在不使用高k（高恒定）介电材料，额外的“电极 - 电介质 - 电极”的情况下实现增加的电容密度。以不断增加的堆叠方式布置，或者将多个电容串联在一起。

7. 发明申请

WO2011084502A3 CAPACITOR WITH THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODE AND METHODS OF MANUFACTURE 审中-公开
标题翻译：具有三维高表面电极的电容器及其制造方法
公开(公告)号：WO2011084502A3
公开(公告)日：2011-11-17
申请号：PCT/US2010060547
申请日：2010-12-15
申请人： APRICOT MATERIALS TECHNOLOGIES LLC , CHAI LIANG , RAE ALAN , WILSON JIM
发明人： CHAI LIANG , RAE ALAN , WILSON JIM
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/10 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/1209 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved "three-dimensional" capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three- dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional "electrode - dielectric - electrode" arrangements in an ever increasing stack, or serially stringing together multiple capacitors.
摘要翻译：公开了一种电容器及其制造方法，其具有由于增加电极表面的有效面积而提高的电容效率。可以在与电介质的界面点处具有三维方面的电极层来构造改进的“三维”电容器，使得电极的一部分延伸到电介质层中。有利地，当与当前的电容器设计相比时，三维电容器的实施例大大减少了电路中所需的容纳电容器的空间占空比。可以在不使用高k（高常数）介电材料的情况下实现增加的电容密度，而在不断增加的堆叠中使用附加的“电极 - 电介质 - 电极”布置，或者将多个电容器串联在一起。

8. 发明申请

WO2010028009A8 ELECTRICALLY CONDUCTIVE MODULE 审中-公开
标题翻译：电导体模块
公开(公告)号：WO2010028009A8
公开(公告)日：2011-04-07
申请号：PCT/US2009055684
申请日：2009-09-02
申请人： USG INTERIORS INC , BOSS DANIEL , QUALLS SCOTT , KAISERMAN TERRANCE Z , MARGOLIN KEITH J , WASSIEF MICHAEL , CHAI LIANG
发明人： BOSS DANIEL , QUALLS SCOTT , KAISERMAN TERRANCE Z , MARGOLIN KEITH J , WASSIEF MICHAEL , CHAI LIANG
IPC分类号： H01R13/514 , H01R9/22 , H01R27/00
CPC分类号： H01R9/28 , E04B9/04 , H01R25/16
摘要： An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.
摘要翻译：提供导电模块。模块包括被配置为与一个或多个导电结构元件接合的面板。模块还包括形成在面板上或面板中的导电层。每个导电层具有构造成与至少一个导电结构元件电连通的端子。在本发明的一个实施例中，第一端子被配置为与第一导电结构元件电连通，并且第二端子被配置为与第二导电结构元件电连通。在本发明的另一个实施例中，第一端子和第二端子被配置为与第一导电结构元件电连通。在本实施例中，第一和第二端子分别构造成与第一导电结构元件的第一和第二导电部分电连通。

9. 发明申请

WO2010028007A3 ELECTRICALLY CONDUCTIVE TAPE FOR WALLS AND CEILINGS 审中-公开
标题翻译：用于墙面和天花板的电导电胶带
公开(公告)号：WO2010028007A3
公开(公告)日：2010-05-20
申请号：PCT/US2009055681
申请日：2009-09-02
申请人： USG INTERIORS INC , BOSS DANIEL , MCDONALD DAVID , KAISERMAN TERRANCE Z , MARGOLIN KEITH J , WASSIEF MICHAEL , CHAI LIANG
发明人： BOSS DANIEL , MCDONALD DAVID , KAISERMAN TERRANCE Z , MARGOLIN KEITH J , WASSIEF MICHAEL , CHAI LIANG
IPC分类号： H01B7/08 , H01B13/00
CPC分类号： H01B7/0815 , H01B7/0846 , Y10T428/24273 , Y10T428/24612
摘要： An electrically conductive tape for walls and ceilings is provided. The tape includes a substrate configured to be applied to at least one surface including at least one surface of a wall or ceiling and at least one conductive layer applied to the substrate. The conductive layer is penetrable by at least a conductor of an electrical device to provide an electrical connection thereto. In one embodiment the conductive layer is formed from a conductive composition including an electrically conductive material therein. The conductive composition can include a conductive ink. A method of manufacturing an electrically conductive tape or film for walls and ceilings is also provided. The method includes providing a conductive composition including an electrically conductive material therein, and providing a substrate configured to be applied to at least one surface including at least one surface of a wall or ceiling. The method also includes applying the conductive composition to the substrate forming a conductive layer attached to the substrate, the conductive layer being penetrable by a conductor of an electrical device.
摘要翻译：提供了一种用于墙壁和天花板的导电胶带。胶带包括被配置为施加到包括壁或天花板的至少一个表面的至少一个表面的衬底和施加到衬底的至少一个导电层。导电层可以由电气装置的至少一个导体穿透以提供与其电连接。在一个实施例中，导电层由其中包含导电材料的导电组合物形成。导电组合物可以包括导电油墨。还提供了制造用于墙壁和天花板的导电带或膜的方法。该方法包括在其中提供包括导电材料的导电组合物，并提供构造成施加到包括壁或天花板的至少一个表面的至少一个表面的基底。该方法还包括将导电组合物施加到形成连接到衬底的导电层的衬底上，导电层可被电子器件的导体穿透。

10. 发明申请

WO2010028009A3 ELECTRICALLY CONDUCTIVE MODULE 审中-公开
公开(公告)号：WO2010028009A3
公开(公告)日：2010-03-11
申请号：PCT/US2009/055684
申请日：2009-09-02
申请人： USG INTERIORS, INC. , BOSS, Daniel , QUALLS, Scott , KAISERMAN, Terrance, Z. , MARGOLIN, Keith, J. , WASSIEF, Michael , CHAI, Liang
发明人： BOSS, Daniel , QUALLS, Scott , KAISERMAN, Terrance, Z. , MARGOLIN, Keith, J. , WASSIEF, Michael , CHAI, Liang
IPC分类号： H01R13/514 , H01R27/00 , H01R9/22
摘要： An electrically conductive module is provided. The module includes a panel configured to engage with one or more conductive structural elements. The module further includes conductive layers formed on or in the panel. Each conductive layer has a terminal configured to be in electrical communication with at least one of the conductive structural elements. In one embodiment of the present invention, a first terminal is configured to be in electrical communication with a first conductive structural element and a second terminal is configured to be in electrical communication with a second conductive structural element. In another embodiment of the present invention, both a first terminal and a second terminal are configured to be in electrical communication with a first conductive structural element. In this embodiment, the first and second terminals are respectively configured to be in electrical communication with first and second conductive portions of the first conductive structural element.

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