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    • 6. 发明申请
    • COMPENSATION TECHNIQUES FOR SUBSTRATE HEATING PROCESSES
    • 基板加热工艺补偿技术
    • WO2008063840A1
    • 2008-05-29
    • PCT/US2007/083271
    • 2007-11-01
    • APPLIED MATERIALS, INC.RANISH, Joseph M.ADAMS, Bruce E.
    • RANISH, Joseph M.ADAMS, Bruce E.
    • F27B5/14
    • C23C16/46C21D1/34
    • Methods for compensating for a thermal profile in a substrate heating process are provided herein. In one embodiment, a method of processing a substrate includes determining an initial thermal profile of a substrate resulting from a process; imposing a compensatory thermal profile on the substrate based on the initial thermal profile; and performing the process to create a desired thermal profile on the substrate. In other embodiments of the invention, the initial substrate thermal profile is compensated for by adjusting a local mass heated per unit area, a local heat capacity per unit area, or an absorptivity or reflectivity of a component proximate the substrate prior to performing the process. In another embodiment, the heat provided by an edge ring to the substrate may be controlled either prior to or during the substrate heating process.
    • 本文提供了用于补偿基板加热过程中的热分布的方法。 在一个实施例中,处理衬底的方法包括确定由工艺产生的衬底的初始热分布; 基于初始热分布在衬底上施加补偿热分布; 并执行该过程以在衬底上产生期望的热分布。 在本发明的其它实施例中,通过在执行该过程之前通过调节每单位面积加热的局部质量,每单位面积的局部热容量或接近该衬底的组分的吸收率或反射率来补偿初始衬底热分布。 在另一个实施例中,由边缘环提供到衬底的热可以在衬底加热过程之前或期间被控制。
    • 7. 发明申请
    • NON-CONTACT OPTICAL TECHNIQUES FOR MEASURING SURFACE CONDITIONS
    • 用于测量表面条件的非接触式光学技术
    • WO1992019944A1
    • 1992-11-12
    • PCT/US1992003456
    • 1992-04-27
    • LUXTRON CORPORATIONSCHIETINGER, Charles, W.ADAMS, Bruce, E.
    • LUXTRON CORPORATION
    • G01J05/00
    • G01B11/0658G01J5/0003G01J5/0007G01N21/474G01N21/8422G01N2021/4742
    • Thermal, optical, physical and chemical characteristics of a substrate (11) surface are determined with non-contact optical techniques that include illuminating (23) the surface with radiation having a ripple intensity characteristic (51), and then measuring the combined intensities (53) of that radiation after modification by the substrate surface and radiation emitted from the surface. Precise determinations of emissivity, reflectivity, temperature, changing surface composition, the existence of any layer formed on the surface and its thickness are all possible from this measurement. They may be made in situ and substantially in real time, thus allowing the measurement to control (39, 41) various processes of treating a substrate surface. This has significant applicability to semiconductor wafer processing and metal processing.
    • 使用非接触光学技术确定衬底(11)表面的热,光学,物理和化学特性,其包括用具有纹波强度特性(51)的辐射照射(23)表面,然后测量组合强度(53 )由基板表面改性后的辐射和从表面发射的辐射。 从该测量可以准确确定发射率,反射率,温度,表面组成,表面上形成的任何层的存在及其厚度。 它们可以在原位和实质上实时制备,从而允许测量控制(39,41)处理基底表面的各种过程。 这对于半导体晶片加工和金属加工具有显着的适用性。