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1. 发明申请

WO2017111834A1 GROUND PLANE VERTICAL ISOLATION OF, GROUND LINE COAXIAL ISOLATION OF, AND IMPEDANCE TUNING OF HORIZONTAL DATA SIGNAL TRANSMISSION LINES ROUTED THROUGH PACKAGE DEVICES 审中-公开
标题翻译：水平数据信号传输线的接地平面垂直隔离，接地线的同轴隔离和阻抗调谐通过封装器件
公开(公告)号：WO2017111834A1
公开(公告)日：2017-06-29
申请号：PCT/US2015/000392
申请日：2015-12-26
申请人： INTEL CORPORATION
发明人： ZHANG, Yu, Amos , REGALADO, Gabriel, S. , QIAN, Zhiguo , AYGUN, Kemal
IPC分类号： H01L25/065 , H01L23/48
CPC分类号： H01L23/48 , H01L23/49838 , H01L2224/16227 , H01L2924/15192 , H01L2924/15311 , H05K1/0218 , H05K1/0219 , H05K1/0243
摘要： A ground isolation transmission line package device includes (1) ground isolation planes between, (2) ground isolation lines surrounding, or (3) such ground planes between and such ground isolation lines surrounding horizontal data signal transmission lines (e.g., metal signal traces) that are horizontally routed through the package device. The (1) ground isolation planes between, and/or (2) ground isolation lines electrically shield the data signals transmitted in signal lines, thus reducing signal crosstalk between and increasing electrical isolation of the data signal transmission lines. In addition, data signal transmission lines may be tuned using eye diagrams to select signal line widths and ground isolation line widths that provide optimal data transmission performance. This package device provides higher frequency and more accurate data signal transfer between different horizontal locations of the data signal transmission lines, and thus also between devices such as integrated circuit (IC) chips attached to the package device.
摘要翻译：接地隔离传输线封装装置包括（1）围绕或（3）这些接地平面周围的接地隔离线与围绕水平数据信号传输的这种接地隔离线之间的接地隔离平面通过封装器件水平布线的线（例如，金属信号迹线）。（1）接地隔离线和/或（2）接地隔离线之间的（1）接地隔离平面电隔离信号线中传输的数据信号，从而减少数据信号传输线之间的信号串扰并增加数据信号传输线的电隔离。另外，可以使用眼图来调谐数据信号传输线以选择提供最佳数据传输性能的信号线宽度和接地隔离线宽度。该封装器件在数据信号传输线的不同水平位置之间提供更高频率和更准确的数据信号传输，并且因此也在诸如附接到封装器件的集成电路（IC）芯片之类的器件之间提供更高频率和更准确的数据信号传输。

2. 发明申请

WO2017111830A1 RLINK-GROUND SHIELDING ATTACHMENT STRUCTURES AND SHADOW VOIDING FOR DATA SIGNAL CONTACTS OF PACKAGE DEVICES; VERTICAL GROUND SHIELDING STRUCTURES AND SHIELD FENCING OF VERTICAL DATA SIGNAL INTERCONNECTS OF PACKAGE DEVICES; AND GROUND SHIELDING FOR ELECTRO OPTICAL MODULE CONNECTOR DATA SIGNAL CONTACTS AND CONTACT PINS OF PACKAGE DEVICES 审中-公开
标题翻译：包装设备的数据信号接触的RLINK接地屏蔽附连结构和阴影空隙; 垂直数据信号接口的垂直接地屏蔽结构和屏蔽层的封装器件; 和接地屏蔽电光模块连接器数据信号接点和包装器件的接点引脚
公开(公告)号：WO2017111830A1
公开(公告)日：2017-06-29
申请号：PCT/US2015/000388
申请日：2015-12-26
申请人： INTEL CORPORATION
发明人： ZHANG, Yu, Amos , QIAN, Zhiguo , AYGUN, Kemal , MEKONNEN, Yidnekachew, S. , MURTAGIAN, Gregorio, R. , GANESAN, Sanka , ROYTMAN, Eduard , MORRISS, Jeff, C.
IPC分类号： H01L25/065 , H01L23/48
CPC分类号： H01L23/48 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L23/552 , H01L25/0655 , H01L2224/131 , H01L2224/16227 , H01L2924/14 , H01L2924/1432 , H01L2924/1433 , H01L2924/15192 , H01L2924/15311 , H01L2924/3025 , H01L2924/014 , H01L2924/00014
摘要： A vertically ground isolated package device can include (1) ground shielding attachment structures and shadow voiding for data signal contacts; (2) vertical ground shielding structures and shield fencing of vertical data signal interconnects; and (3) ground shielding for an electro-optical module connector of the package device. These reduce cross talk between data signal contacts, attachment structures and vertical "signal" interconnects of the package device. The ground shielding attachment structures may include patterns of solder bumps and/or surface contacts. The shadow voiding may be surrounding voids in ground planes that are larger than the data signal solder bumps. The vertical ground shielding structures may include patterns of ground shield interconnects between the vertical data signal interconnects: The shield fencing may include patterns of ground plated through holes (PTH) and micro-vias (uVia). The ground shielding for the electro-optical module may include patterns of ground isolation shielding attachments and contacts.
摘要翻译：垂直接地隔离封装器件可以包括（1）用于数据信号触点的接地屏蔽连接结构和阴影空洞; （2）垂直数据信号互连的垂直接地屏蔽结构和屏蔽栅栏; 和（3）封装装置的电光模块连接器的接地屏蔽。这些降低了数据信号触点，附件结构和垂直“信号”之间的串扰。封装器件的互连。接地屏蔽附接结构可以包括焊料凸块和/或表面接触的图案。阴影空洞可能是地平面周围的空洞，其大于数据信号焊料凸块。垂直接地屏蔽结构可以包括垂直数据信号互连之间的接地屏蔽互连的图案：屏蔽栅栏可以包括接地镀通孔（PTH）和微通孔（uVia）的图案。电光模块的接地屏蔽可能包括接地隔离屏蔽附件和触点的图案。

3. 发明申请

WO2017111855A1 MICROPROCESSOR PACKAGE WITH FIRST LEVEL DIE BUMP GROUND WEBBING STRUCTURE 审中-公开
标题翻译：微处理器封装与第一级模具冲击地面网带结构
公开(公告)号：WO2017111855A1
公开(公告)日：2017-06-29
申请号：PCT/US2015/000431
申请日：2015-12-26
申请人： INTEL CORPORATION
发明人： ZHANG, Yu, Amos , MANUSHAROW, Mathew, J. , AYGUN, Kemal , MAZUMDER, Mohiuddin
IPC分类号： H01L23/48
CPC分类号： H01L23/48 , H01L23/50 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/13101 , H01L2224/1412 , H01L2224/16225 , H01L2224/17515 , H01L2224/81801 , H01L2924/14 , H01L2924/00014 , H01L2924/014
摘要： A ground isolation webbing structure package includes a top level with an upper interconnect layer having upper ground contacts, upper data signal contacts, and a conductive material upper ground webbing structure that is connected to the upper ground contacts and surrounds the upper data signal contacts. The upper contacts may be formed over and connected to via contacts or traces of a lower layer of the same interconnect level. The via contacts of the lower layer may be connected to upper contacts of a second interconnect level which may also have such webbing. There may also be at least a third interconnect level having such webbing. The webbing structure electrically isolates and reduces cross talk between the signal contacts, thus providing higher frequency and more accurate data signal transfer between devices such as integrated circuit (IC) chips attached to a package.
摘要翻译：接地隔离带状结构封装包括具有上互连层的顶层，所述上互连层具有上接地触点，上数据信号触点以及连接到所述上接地触点的导电材料上接地带状结构，以及围绕上部数据信号触点。上触点可以形成在相同互连层的下层的通孔触点或迹线上并连接到该通孔触点或迹线。下层的通孔触点可以连接到也可以具有这种织带的第二互连级的上触点。也可能有至少一个具有这种织带的第三互连层。该带状结构电隔离并减少信号触点之间的串扰，从而在诸如附接到封装的集成电路（IC）芯片之类的器件之间提供更高频率和更精确的数据信号传输。

4. 发明申请

WO2017111823A1 GROUND PLANE VERTICAL ISOLATION OF, GROUND LINE COAXIAL ISOLATION OF, AND IMPEDANCE TUNING OF HORIZONTAL DATA SIGNAL TRANSMISSION LINES ROUTED THROUGH PACKAGE DEVICES 审中-公开
标题翻译：水平数据信号传输线的接地平面垂直隔离，接地线的同轴隔离和阻抗调谐通过封装器件
公开(公告)号：WO2017111823A1
公开(公告)日：2017-06-29
申请号：PCT/US2015/000381
申请日：2015-12-26
申请人： INTEL CORPORATION
发明人： ZHANG, Yu, Amos , REGALADO, Gabriel, S. , QIAN, Zhiguo , AYGUN, Kemal
IPC分类号： H01L25/065 , H01L23/48
CPC分类号： H01L23/48 , H01L23/49838 , H01L2224/16225 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H05K1/0218 , H05K1/0219 , H05K1/0243
摘要： A ground isolation transmission line package device includes (1) ground isolation planes between, (2) ground isolation lines surrounding, or (3) such ground planes between and such ground isolation lines surrounding horizontal data signal transmission lines (e.g., metal signal traces) that are horizontally routed through the package device. The (1) ground isolation planes between, and/or (2) ground isolation lines electrically shield the data signals transmitted in signal lines, thus reducing signal crosstalk between and increasing electrical, isolation of the data signal transmission lines. In addition, data signal transmission lines may be tuned using eye diagrams to select signal line widths and ground isolation line widths that provide optimal data transmission performance. This package device provides higher frequency and more accurate data signal transfer between different horizontal locations of the data signal transmission lines, and thus also between devices such as integrated circuit (IC) chips attached to the package device.
摘要翻译：接地隔离传输线封装装置包括（1）围绕或（3）这些接地平面周围的接地隔离线与围绕水平数据信号传输的这种接地隔离线之间的接地隔离平面通过封装器件水平布线的线（例如，金属信号迹线）。（1）接地隔离线和/或（2）接地隔离线之间的（1）接地隔离平面电屏蔽信号线中传输的数据信号，从而减少数据信号传输线之间的信号串扰并增加电隔离。另外，可以使用眼图来调谐数据信号传输线以选择提供最佳数据传输性能的信号线宽度和接地隔离线宽度。该封装器件在数据信号传输线的不同水平位置之间提供更高频率和更准确的数据信号传输，并且因此也在诸如附接到封装器件的集成电路（IC）芯片之类的器件之间提供更高频率和更准确的数据信号传输。

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