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1. 发明申请

WO2010129884A1 POROUS LIFT-OFF LAYER FOR SELECTIVE REMOVAL OF DEPOSITED FILMS 审中-公开
标题翻译：多孔提升层，用于选择性去除沉积膜
公开(公告)号：WO2010129884A1
公开(公告)日：2010-11-11
申请号：PCT/US2010/034067
申请日：2010-05-07
申请人： 1366 TECHNOLOGIES INC. , SACHS, Emanuel, M. , GABOR, Andrew, M.
发明人： SACHS, Emanuel, M. , GABOR, Andrew, M.
IPC分类号： H01L21/306 , H01L31/00 , H01L31/18
CPC分类号： H01L31/022425 , H01L21/76802 , H01L31/02363 , H01L31/18 , Y02E10/50
摘要： A porous lift off layer facilitates removal of films from surfaces, such as semiconductors. A film is applied over a patterned porous layer, the layer comprising openings typically larger than the film thickness. The porous material and the film are then removed from areas where film is not intended. The porous layer can be provided as a slurry, dried to open porosities, or fugitive particles within a field, which disassociate upon the application of heat or solvent. The film can be removed by etchant that enters through porosities where the film does not bridge the spaces between solid portions, so that the etchant attacks both film surfaces
摘要翻译：多孔提升层有助于从诸如半导体的表面去除膜。将膜施加在图案化的多孔层上，该层包括通常大于膜厚度的开口。然后将多孔材料和膜从不需要膜的区域中取出。多孔层可以作为浆料提供，干燥以打开孔隙，或场内的逸散颗粒，其在施加热或溶剂时解离。可以通过蚀刻剂从薄膜不固定部分之间的空隙的孔隙中进入薄膜，从而使蚀刻剂侵袭两个薄膜表面

2. 发明申请

WO2013044180A1 TECHNIQUES FOR IMPROVED IMPRINTING OF SOFT MATERIAL ON SUBSTRATE USING STAMP INCLUDING UNDERFILLING TO LEAVE A GAP AND PULSING STAMP 审中-公开
标题翻译：用于改善对基材上的软质材料进行加固的技术，其中包括打破缺口和冲压印花
公开(公告)号：WO2013044180A1
公开(公告)日：2013-03-28
申请号：PCT/US2012/056769
申请日：2012-09-22
申请人： 1366 TECHNOLOGIES INC. , SACHS, Emanuel, M.
发明人： SACHS, Emanuel, M.
IPC分类号： H01L31/18
CPC分类号： H01L31/18 , B29C33/40 , B29C33/42 , B29C33/424 , B29C43/021 , B29C2033/426 , B29C2043/025 , B29C2059/023 , B81C99/0085 , B81C2201/0153 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： A method for imparting a pattern to a flowable resist material on a substrate entails providing a resist layer so thin that during a stamp wedging process, the resist never completely fills the space between the substrate and the bottom surface of a stamp between wedge protrusions, leaving gap everywhere therebetween. A gap remains between the resist and the extended surface of the stamp. If the resist layer as deposited is somewhat thicker than the targeted amount, it will simply result in a smaller gap between resist and tool. The presence of a continuous gap assures that no pressure builds under the stamp. Thus, the force on the protrusions i determined only by the pressure above the stamp and is well controlled, resulting in well-controlled hole sizes. The gap prevents resist from being pumped entirely out of any one region, and thus prevents any regions from being uncovered of resist. The stamp can be pulsed in its contact with the substrate, repeatedly deforming the indenting protrusions. Several pulses clears away any scum layer better than does a single press, as measured by an etch test comparison of the degree to which a normal etch for a normal duration etches away substrate material. A method for imparting a pattern to a flowable resist material on a substrate entails providing a resist layer so thin that during a stamp wedging process, the resist never completely fills the space between the substrate and the bottom surface of a stamp between wedge protrusions, leaving a gap everywhere therebetween. A gap remains between the resist and the extended surface of the stamp.
摘要翻译：将图案赋予基板上的可流动抗蚀剂材料的方法需要提供如此薄的抗蚀剂层，使得在印模楔入过程中，抗蚀剂不会完全填充基板与楔形凸起之间的印模的底表面之间的空间，留下差距在其间。在抗蚀剂和印模的延伸表面之间留有间隙。如果沉积的抗蚀剂层比目标量稍厚一些，则将简单地导致抗蚀剂和工具之间的较小的间隙。连续间隙的存在确保印章下没有压力。因此，突起上的力i仅由压力上方的压力确定并且被良好地控制，导致良好控制的孔尺寸。间隙防止抗蚀剂完全从任何一个区域泵出，从而防止任何区域不被抗蚀剂覆盖。印模可以与基板接触地脉动，使压痕突起重复变形。几个脉冲比单次压机更好地清除任何浮渣层，如通过蚀刻测试比较正常蚀刻对正常时间蚀刻掉的衬底材料的程度所测量的。将图案赋予基板上的可流动抗蚀剂材料的方法需要提供如此薄的抗蚀剂层，使得在印模楔入过程中，抗蚀剂不会完全填充基板与楔形凸起之间的印模的底表面之间的空间，留下在它们之间的差距。在抗蚀剂和印模的延伸表面之间留有间隙。

3. 发明申请

WO2013044181A1 METHODS AND APPARATI FOR HANDLING, HEATING AND COOLING A SUBSTRATE UPON WHICH A PATTERN IS MADE BY A TOOL IN HEAT FLOWABLE MATERIAL COATING, INCLUDING SUBSTRATE TRANSPORT, TOOL LAYDOWN, TOOL TENSIONING, AND TOOL RETRACTION 审中-公开
标题翻译：用于处理，加热和冷却热可塑材料涂层中的工具制成的基板的方法和装置，包括基板运输，工具布局，工具拉伸和工具退回
公开(公告)号：WO2013044181A1
公开(公告)日：2013-03-28
申请号：PCT/US2012/056770
申请日：2012-09-22
申请人： 1366 TECHNOLOGIES INC. , SACHS, Emanuel, M. , KANE, Peter, E. , GATES, Holly, G. , HARRIS, Damian, W. , POLITO, Benjamin, F. , INIRIO, Hector, A.
发明人： SACHS, Emanuel, M. , KANE, Peter, E. , GATES, Holly, G. , HARRIS, Damian, W. , POLITO, Benjamin, F. , INIRIO, Hector, A.
IPC分类号： B29C59/02
CPC分类号： B29B13/02 , B29C59/02 , B29C2059/023 , G03F7/0002
摘要： A workpiece is transported using a porous belt, which belt delivers a workpiece to a chuck, upon which the workpiece is held by vacuum. The belt can be porous PTFE. A flexible stamp is preheated, before it is applied to a workpiece, by drawing the stamp toward a heated plate, for instance by vacuum.
摘要翻译：使用多孔带输送工件，该带将工件输送到卡盘，工件通过真空保持在该卡盘上。带可以是多孔PTFE。例如通过真空将柔性印模预先加热到被加热板之前，在将其印刷到工件之前进行预热。

4. 发明申请

WO2010080822A1 DISPENSING LIQUID CONTAINING MATERIAL TO PATTERNED SURFACES USING A DISPENSING TUBE 审中-公开
标题翻译：使用分配管将含液体的材料分配到图案表面
公开(公告)号：WO2010080822A1
公开(公告)日：2010-07-15
申请号：PCT/US2010/020245
申请日：2010-01-06
申请人： 1366 TECHNOLOGIES INC. , SACHS, Emanuel, M. , WALLACE, Richard, L. , BREDT, James, F. , POLITO, Benjamin, F. , ERSEN, Ali
发明人： SACHS, Emanuel, M. , WALLACE, Richard, L. , BREDT, James, F. , POLITO, Benjamin, F. , ERSEN, Ali
IPC分类号： H01L31/00
CPC分类号： H01L31/022425 , H01L21/6715 , Y02E10/50
摘要： Materials that contain liquid are deposited into grooves upon a surface of a work piece, such as a silicon wafer to form a solar cell. Liquid can be dispensed into work piece paths, such as grooves under pressure through a dispensing tube. The tube mechanically tracks in the groove. The tube may be small and rest at the groove bottom, with the sidewalls providing restraint. Or it may be larger and ride on the top edges of the groove. A tracking feature, such as a protrusion, Non-circular cross-sections, molded-on protrusions and lobes also enhance tracking. The tube may be forced against the groove by spring or magnetic loading. Alignment guides, such as lead-in features may guide the tube into the groove. Restoring features along the path may restore a wayward tube. Many tubes may be used. Many work pieces can be treated in a line or on a drum.
摘要翻译：含有液体的材料沉积在诸如硅晶片的工件的表面上的凹槽中，以形成太阳能电池。液体可以分配到工件路径中，例如通过分配管的压力下的槽。管子在凹槽中机械地跟踪。管可以小并且在槽底部搁置，其中侧壁提供约束。或者它可能更大并且骑在凹槽的顶部边缘上。跟踪特征，例如突起，非圆形横截面，模制突起和凸角也增强跟踪。管可以通过弹簧或磁负载而被迫力抵靠凹槽。诸如引入特征的对准引导件可以将管引导到凹槽中。沿着路径还原功能可能会恢复一个顺从的管。可以使用许多管。许多工件可以在一条线或一个鼓上进行处理。

5. 发明申请

WO2012075306A2 MAKING SEMICONDUCTOR BODIES FROM MOLTEN MATERIAL USING A FREE-STANDING INTERPOSER SHEET 审中-公开
标题翻译：使用自由插入片材制作材料的半导体器件
公开(公告)号：WO2012075306A2
公开(公告)日：2012-06-07
申请号：PCT/US2011/062914
申请日：2011-12-01
申请人： 1366 TECHNOLOGIES INC. , JONCZYK, Ralf , SACHS, Emanuel, M.
发明人： JONCZYK, Ralf , SACHS, Emanuel, M.
IPC分类号： H01L21/28
CPC分类号： H01L31/182 , C04B41/4539 , C04B41/5096 , C30B11/002 , C30B15/00 , C30B15/007 , C30B15/32 , C30B29/06 , H01L21/02002 , H01L21/02532 , H01L31/1804 , Y02E10/546 , Y02P70/521
摘要： An interposer sheet can be used for making semiconductor bodies, such as of silicon, such as for solar cell use. It is free-standing, very thin, flexible, porous and able to withstand the chemical and thermal environment of molten semiconductor without degradation. It is typically of a ceramic material, such as silica, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbide, silicon carbonitride, silicon oxycarbonitride and others. It is provided between a forming surface of a mold sheet, and the molten material from which a semiconductor body will be formed. It may be secured to the forming surface or deposited upon the melt. The interposer sheet suppresses grain nucleation, and limits heat flow from the melt. It promotes separation of the semiconductor body from the forming surface. It can be fabricated before its use. Because free-standing and not adhered to the forming surface, problems of mismatch of CTE are minimized. The interposer sheet and semiconductor body are free to expand and contract relatively independently of the forming surface.
摘要翻译：插入片可用于制造诸如硅的半导体本体，例如用于太阳能电池。它是独立的，非常薄的，柔性的，多孔的并且能够耐受熔融半导体的化学和热环境而不降解。它通常是陶瓷材料，例如二氧化硅，氮化硅，氮氧化硅，碳氧化硅，碳化硅，碳氮化硅，碳氮氧化硅等。设置在模板的成形表面和将形成半导体本体的熔融材料之间。它可以固定到成形表面或沉积在熔体上。插入片抑制晶粒成核，并限制来自熔体的热流。它促进半导体主体与成形表面的分离。它可以在使用之前进行制造。由于独立且不粘附到成型表面，CTE的失配问题被最小化。插入片和半导体本体相对于成形表面相对自由地膨胀和收缩。

6. 发明申请

WO2010104838A1 METHODS AND APPARATI FOR MAKING THIN SEMICONDUCTOR BODIES FROM MOLTEN MATERIAL 审中-公开
标题翻译：用于制备薄膜半导体体的方法和装置
公开(公告)号：WO2010104838A1
公开(公告)日：2010-09-16
申请号：PCT/US2010/026639
申请日：2010-03-09
申请人： 1366 TECHNOLOGIES INC. , SACHS, Emanuel, M. , WALLACE, Richard, L. , HANTSOO, Eerik, T. , LORENZ, Adam, M. , HUDELSON, G. D., Stephen , JONCZYK, Ralf
发明人： SACHS, Emanuel, M. , WALLACE, Richard, L. , HANTSOO, Eerik, T. , LORENZ, Adam, M. , HUDELSON, G. D., Stephen , JONCZYK, Ralf
IPC分类号： C30B15/00 , C03B19/02
CPC分类号： B29C33/44 , C30B11/007 , C30B15/30 , C30B19/068 , C30B28/04 , C30B29/06
摘要： A pressure differential is applied across a mold sheet and a semiconductor (e.g. silicon) wafer is formed thereon. Relaxation of the pressure differential allows release of the wafer. The mold sheet may be cooler than the melt. Heat is extracted almost exclusively through the thickness of the forming wafer. The liquid and solid interface is substantially parallel to the mold sheet. The temperature of the solidifying body is substantially uniform across its width, resulting in low stresses and dislocation density and higher crystallographic quality. The mold sheet must allow flow of gas through it. The melt can be introduced to the sheet by: full area contact with the top of a melt; traversing a partial area contact of melt with the mold sheet, whether horizontal or vertical, or in between; and by dipping the mold into a melt. The grain size can be controlled by many means.
摘要翻译：在模板上施加压差，并在其上形成半导体（例如硅）晶片。压差的放松允许晶片的释放。模具片可以比熔体更冷。几乎完全通过成形晶片的厚度提取热量。液体和固体界面基本上平行于模片。凝固体的温度在其宽度上基本均匀，导致低应力和位错密度和更高的晶体学质量。模板必须允许气体流过它。可以通过以下方式将熔体引入片材：与熔体的顶部完全区域接触; 穿过熔体与模板的部分区域接触，无论是水平还是垂直的，或者在其间; 并将模具浸入熔体中。可以通过许多方法控制晶粒尺寸。

7. 发明申请

WO2012094169A2 CRYSTAL RIBBON FABRICATION WITH MULTI-COMPONENT STRINGS 审中-公开
标题翻译：具有多组分条纹的晶体RIBBON制造
公开(公告)号：WO2012094169A2
公开(公告)日：2012-07-12
申请号：PCT/US2011/066842
申请日：2011-12-22
申请人： 1366 TECHNOLOGIES INC. , SACHS, Emanuel, M. , SERDY, James, G.
发明人： SACHS, Emanuel, M. , SERDY, James, G.
IPC分类号： B32B5/26
CPC分类号： C30B15/007 , C30B29/06
摘要： A string for growing ribbon crystal has a core and an outer cover, the cover composed of at least two different materials, chosen with the material of the core in amount and kind such that the CTE of the covered core matches in net, that of the silicon ribbon. The cover material is also chosen so that silicon readily wets significantly around the string, subtending an angle of at least about 55 degrees, up to a fully wetted string, resulting in a relatively thick strong ribbon adjacent the string, closer in thickness to the diameter of the sting. This prevents a thin, fragile ribbon near the string. For silicon ribbon, a cover may be an interspersed composition that is predominantly of silica, with some SiC. The core may also be composed of silica and SiC, in different proportions, and different geometry. Or, the core may be a single material, such as Carbon. SiC present in the cover in an amount as low as 10% by volume permits wetting around at least about 55 degrees of string circumference and does not excessively nucleate grain growth. Higher amounts of SiC are also beneficial. Using these same, or similar materials, the outer cover can be made fully dense and free of impurities that would harm silicon. The cover can be electrically non-conductive. Rather than silicon carbide, silicon nitride, and other materials can be used. It is also possible to intentionally mismatch the CTE of the string and the ribbon, such that the ribbon is in compression at the ends of the strings, which helps to prevent ribbon fracture.
摘要翻译：用于生长的带状晶体的线条具有芯部和外部覆盖物，所述覆盖物由至少两种不同的材料组成，其选择的材料的数量和种类的核心的材料使得被覆盖的芯部的CTE在网中匹配，硅带。覆盖材料也被选择成使得硅很容易在弦的周围润湿，对角至少约55度的角度，直到完全润湿的线，导致邻近弦的相对厚的强带，其厚度更接近于直径的刺痛。这样可以防止弦附近的薄而脆弱的丝带。对于硅带，覆盖物可以是散在的组合物，其主要是二氧化硅，具有一些SiC。核心也可以由不同比例的二氧化硅和SiC组成，并且具有不同的几何形状。或者，核心可以是单一材料，例如碳。存在于覆盖物中的低至10体积％的量的SiC允许在至少约55度的串周长处润湿，并且不会使晶粒生长过度成核。更高量的SiC也是有益的。使用这些相同或相似的材料，外盖可以制成完全致密且没有会损害硅的杂质。盖可以是非导电的。可以使用碳化硅，氮化硅等材料。还可以有意地使串和色带的CTE不匹配，使得色带在色带的端部处被压缩，这有助于防止色带断裂。

8. 发明申请

WO2009128946A1 WEDGE IMPRINT PATTERNING OF IRREGULAR SURFACE 审中-公开
标题翻译：不规则表面的楔形图案
公开(公告)号：WO2009128946A1
公开(公告)日：2009-10-22
申请号：PCT/US2009/002423
申请日：2009-04-17
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , 1366 TECHNOLOGIES INC. , POLITO, Benjamin, E. , GATES, Holly, G. , SACHS, Emanuel, M.
发明人： POLITO, Benjamin, E. , GATES, Holly, G. , SACHS, Emanuel, M.
IPC分类号： B29C59/02
CPC分类号： H01L31/182 , B29C43/021 , B29C43/222 , B29C59/02 , B29C2043/025 , B29C2043/3634 , B29C2043/3652 , B29C2043/465 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L31/0236 , H01L31/02363 , Y02E10/50
摘要： Patterned substrates for photovoltaic and other uses are made by pressing a flexible stamp upon a thin layer of resist material, which covers a substrate, such as a wafer. The resist changes phase or becomes flowable, flowing away from locations of impression, revealing the substrate, which is subjected to some shaping process, typically etching. Portions exposed by the stamp being are removed, and portions that protected by the resist, remain. A typical substrate is silicon, and a typical resist is a wax. Workpiece textures include extended grooves, discrete, spaced apart pits, and combinations and intermediates thereof. Platen or rotary patterning apparatus may be used. Rough and irregular workpiece substrates may be accommodated by extended stamp elements. Resist may be applied first to the workpiece, the stamp, or substantially simultaneously, in discrete locations, or over the entire surface of either. The resist dewets the substrate completely where desired.
摘要翻译：用于光伏和其他用途的图案化基板是通过将柔性印模压在覆盖诸如晶片的基底的抗蚀剂材料薄层上而制成的。抗蚀剂改变相位或变得可流动，从印模的位置流出，露出经受一些成形过程的基底，通常是蚀刻。被邮票曝光的部分被去除，并且被抗蚀剂保护的部分保留。典型的基底是硅，典型的抗蚀剂是蜡。工件纹理包括延伸凹槽，离散的，间隔开的凹坑，以及它们的组合和中间体。可以使用压板或旋转图案形成装置。粗糙和不规则的工件衬底可以由延长的印模元件容纳。抗蚀剂可以首先施加到工件，印模或基本上同时地在离散的位置，或者在两者的整个表面上。抗蚀剂在需要时完全将基材脱模。

9. 发明申请

WO2004091911A2 POSITIVE PRESSURE DROP-ON-DEMAND PRINTING 审中-公开
标题翻译：积极压力下降打印
公开(公告)号：WO2004091911A2
公开(公告)日：2004-10-28
申请号：PCT/US2004/010523
申请日：2004-04-07
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , SACHS, Emanuel, M. , GLEASON, Blake, W. , SERDY, James, G.
发明人： SACHS, Emanuel, M. , GLEASON, Blake, W. , SERDY, James, G.
IPC分类号： B41F
CPC分类号： B41J2/1429 , B33Y10/00 , B33Y30/00 , B41J2002/14475
摘要： A drop on demand printer has a nozzle with an orifice and a surrounding annular land. Surrounding the land is an edge, which is surrounded by a perimetrical surface that is inclined to the land at an angle α. A pressure controller maintains a positive overpressure on liquid to be printed such that a cap of liquid is substantially always present covering the orifice and the land. The edge between the land and the perimetrical surface prevents liquid from overflowing, and maintains the cap, if the pressure is maintained between lower and upper limits disclosed. The liquid to be printed preferably wets the orifice land, which may be alumina, glass, ceramic, and others. Liquids with very small, even zero, wetting angles relative to the land may be used, such as water and organic solvents, including, isopropyl and ethyl alcohol and chloroform. The liquid can be loaded with dissolved polymers, or particles, such as of polymer or ceramic. Very small drops can be printed, by using an orifice of about 40 microns effective diameter, with a land of about 90 microns effective diameter. The printer can be used for any drop dispensing application, such as ink jet, Three Dimensional printing, and also for depositing small amounts of pharmaceutical materials into a receptacle, or drug delivery vehicle. A means for establishing a temperature differential, with a higher upstream and lower downstream temperature, eliminates any gas bubbles at the orifice.
摘要翻译：按需打印机具有具有孔口和周围环形区域的喷嘴。周围的土地是一个边缘，被一个以α角度倾向于陆地的周边表面所包围。压力控制器对待印刷的液体保持正的超压，使得液体盖基本上始终存在覆盖孔口和焊盘。如果压力保持在所公开的下限和上限之间，则陆面和周边表面之间的边缘防止液体溢出，并保持盖。待印刷的液体优选地润湿孔板，其可以是氧化铝，玻璃，陶瓷等。可以使用相对于陆地具有非常小甚至零润湿角度的液体，例如水和有机溶剂，包括异丙醇和乙醇和氯仿。液体可以装载溶解的聚合物或颗粒，例如聚合物或陶瓷。通过使用约40微米有效直径的孔，可以印刷非常小的液滴，有效直径约为90微米。打印机可用于任何滴剂分配应用，例如喷墨，三维印刷，以及用于将少量药物材料沉积到容器或药物递送载体中。用于建立具有较高上游和下游温度的温差的装置消除了孔口处的任何气泡。

10. 发明申请

WO2009002550A1 RECRYSTALLIZATION OF SEMICONDUCTOR WAFERS IN A THIN FILM CAPSULE AND RELATED PROCESSES 审中-公开
标题翻译：薄膜胶片和相关工艺中半导体晶体的再结晶
公开(公告)号：WO2009002550A1
公开(公告)日：2008-12-31
申请号：PCT/US2008/008030
申请日：2008-06-26
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , SACHS, Emanuel, M. , SERDY, James, G. , HANTSOO, Eerik, T.
发明人： SACHS, Emanuel, M. , SERDY, James, G. , HANTSOO, Eerik, T.
IPC分类号： H01L21/00
CPC分类号： C30B13/00 , C30B1/02 , C30B28/02 , C30B29/06 , H01L21/02532 , H01L21/02667 , H01L23/3171 , H01L29/04 , H01L2924/0002 , H01L2924/00
摘要： An original wafer, typically silicon, has the form of a desired end PV wafer. The original may be made by rapid solidification or CVD. It has small grains. It is encapsulated in a clean thin film, which contains and protects the silicon when recrystallized to create a larger grain structure. The capsule can be made by heating a wafer in the presence of oxygen, or steam, resulting in silicon dioxide on the outer surface, typically 1-2 microns. Further heating creates a molten zone in space, through which the wafer travels, resulting in recrystallization with a larger grain size. The capsule contains the molten material during recrystallization, and protects against impurities. Recrystallization may be in air. Thermal transfer through backing plates minimizes stresses and defects. After recrystallization, the capsule is removed.
摘要翻译：原始晶片（通常为硅）具有期望的端部PV晶片的形式。原件可以通过快速凝固或CVD制成。它有小颗粒。它被封装在干净的薄膜中，其在再结晶时含有并保护硅以产生更大的晶粒结构。胶囊可以通过在氧气或蒸汽的存在下加热晶片来制造，从而在外表面上产生二氧化硅，通常为1-2微米。进一步的加热在空间中产生熔融区，晶片经过该熔融区，导致晶粒尺寸更大的再结晶。胶囊在再结晶期间含有熔融材料，防止杂质。重结晶可能在空气中。通过背板进行热转印可最大限度地减少应力和缺陷。重结晶后，除去胶囊。

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