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1. 发明申请

WO2009085992A3 THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION 审中-公开
标题翻译：具有改善气体流量分布的热反应器
公开(公告)号：WO2009085992A3
公开(公告)日：2009-09-24
申请号：PCT/US2008087496
申请日：2008-12-18
申请人： APPLIED MATERIALS INC , TSENG MING-KUEI MICHAEL , TAM NORMAN , YOKOTA YOSHITAKA , TJANDRA AGUS , NAVASCA ROBERT , BEHDJAT MEDHRAN , RAMAMURTHY SUNDAR , SANGAM KEDARNATH , LERNER ALEXANDER N
发明人： TSENG MING-KUEI MICHAEL , TAM NORMAN , YOKOTA YOSHITAKA , TJANDRA AGUS , NAVASCA ROBERT , BEHDJAT MEDHRAN , RAMAMURTHY SUNDAR , SANGAM KEDARNATH , LERNER ALEXANDER N
IPC分类号： H01L21/00 , H01L21/02 , H01L21/324
CPC分类号： H01L21/67115 , F27D7/06 , H01L21/67017 , H01L21/67098
摘要： Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.
摘要翻译：本发明的实施例提供了用于改善热处理期间气体分布的装置和方法。本发明的一个实施例提供了一种用于处理衬底的装置，其包括限定处理体积的室主体，设置在处理体积中的衬底支撑件，其中衬底支撑件构造成支撑和旋转衬底，气体入口组件，室主体的入口并且被配置为向处理容积提供第一气流，以及联接到室主体的出口的排气组件，其中气体入口组件和排气组件设置在室主体的相对侧上，并且排气组件限定了被配置为延长处理量的排气量。

2. 发明申请

WO2005002794A3 CELL, SYSTEM AND ARTICLE FOR ELECTROCHEMICAL MECHANICAL PROCESSING (ECMP) 审中-公开
标题翻译：电化学机械加工用电池，系统及其制品（ECMP）
公开(公告)号：WO2005002794A3
公开(公告)日：2005-03-31
申请号：PCT/US2004022722
申请日：2004-07-01
申请人： APPLIED MATERIALS INC , WANG YAN , NEO SIEW S , LIU FENG Q , TSAI STAN D , HU YONGQI , DUBOUST ALAIN , MANENS ANTOINE P , WADENSWEILER RALPH M , MAVLIV RASHID , CHEN LIANG-YUH , OLGADO DONALD J K , BUTTERFIELD PAUL D , TSENG MING-KUEI , CHANG SHOU-SUNG , SUN LIZHONG
发明人： WANG YAN , NEO SIEW S , LIU FENG Q , TSAI STAN D , HU YONGQI , DUBOUST ALAIN , MANENS ANTOINE P , WADENSWEILER RALPH M , MAVLIV RASHID , CHEN LIANG-YUH , OLGADO DONALD J K , BUTTERFIELD PAUL D , TSENG MING-KUEI , CHANG SHOU-SUNG , SUN LIZHONG
IPC分类号： B23H5/08 , B24B37/04 , B24B53/007 , C25F7/00 , H01L21/321
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F7/00
摘要： The invention provides a cell, a system and an article for processing a substrate in an electrochemical mechanical polishing system. A cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper polishing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. A system is provided having a bulk polishing cell and a residual polishing cell. The residual polishing cell includes a biased conductive polishing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明提供一种用于在电化学机械抛光系统中处理基底的电池，系统和制品。用于抛光基板的单元包括设置在压板组件的顶表面上的抛光垫。多个导电元件跨过上抛光表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏置衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。提供了具有大量抛光单元和残余抛光单元的系统。残余抛光单元包括偏置的导电抛光表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

3. 发明申请

WO2009085992A2 THERMAL REACTOR WITH IMPROVED GAS FLOW DISTRIBUTION 审中-公开
标题翻译：具有改善的气流分布的热反应器
公开(公告)号：WO2009085992A2
公开(公告)日：2009-07-09
申请号：PCT/US2008/087496
申请日：2008-12-18
申请人： APPLIED MATERIALS, INC. , TSENG, Ming-kuei (michael) , TAM, Norman , YOKOTA, Yoshitaka , TJANDRA, Agus , NAVASCA, Robert , BEHDJAT, Medhran , RAMAMURTHY, Sundar , SANGAM, Kedarnath , LERNER, Alexander N.
发明人： TSENG, Ming-kuei (michael) , TAM, Norman , YOKOTA, Yoshitaka , TJANDRA, Agus , NAVASCA, Robert , BEHDJAT, Medhran , RAMAMURTHY, Sundar , SANGAM, Kedarnath , LERNER, Alexander N.
IPC分类号： H01L21/00 , H01L21/02 , H01L21/32
CPC分类号： H01L21/67115 , F27D7/06 , H01L21/67017 , H01L21/67098
摘要： Embodiments of the present invention provide apparatus and method for improving gas distribution during thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate comprising a chamber body defining a processing volume, a substrate support disposed in the processing volume, wherein the substrate support is configured to support and rotate the substrate, a gas inlet assembly coupled to an inlet of the chamber body and configured to provide a first gas flow to the processing volume, and an exhaust assembly coupled to an outlet of the chamber body, wherein the gas inlet assembly and the exhaust assembly are disposed on opposite sides of the chamber body, and the exhaust assembly defines an exhaust volume configured to extend the processing volume.
摘要翻译：本发明的实施例提供用于在热处理期间改善气体分布的装置和方法。本发明的一个实施例提供了一种用于处理基板的装置，该装置包括限定处理容积的腔室主体，设置在处理容积中的基板支撑件，其中基板支撑件被配置为支撑并旋转基板，气体入口组件耦合到所述腔室主体的入口并被配置为向所述处理容积提供第一气流;以及排气组件，所述排气组件耦合到所述腔室主体的出口，其中所述气体入口组件和所述排气组件设置在所述腔室主体的相对侧上，并且排气组件限定配置成延伸处理容积的排气容积。

4. 发明申请

WO2005002794A2 METHOD AND APPARATUS FOR ELECTROCHEMICAL MECHANICAL PROCESSING 审中-公开
标题翻译：电化学机械加工方法与装置
公开(公告)号：WO2005002794A2
公开(公告)日：2005-01-13
申请号：PCT/US2004/022722
申请日：2004-07-01
申请人： APPLIED MATERIALS, INC. , WANG, Yan , NEO, Siew, S. , LIU, Feng, Q. , TSAI, Stan D. , HU, Yongqi , DUBOUST, Alain , MANENS, Antoine, P. , WADENSWEILER, Ralph, M. , MAVLIV, Rashid , CHEN, Liang-Yuh , OLGADO, Donald, J.K. , BUTTERFIELD, Paul, D. , TSENG, Ming-Kuei , CHANG, Shou-Sung , SUN, Lizhong
发明人： WANG, Yan , NEO, Siew, S. , LIU, Feng, Q. , TSAI, Stan D. , HU, Yongqi , DUBOUST, Alain , MANENS, Antoine, P. , WADENSWEILER, Ralph, M. , MAVLIV, Rashid , CHEN, Liang-Yuh , OLGADO, Donald, J.K. , BUTTERFIELD, Paul, D. , TSENG, Ming-Kuei , CHANG, Shou-Sung , SUN, Lizhong
IPC分类号： B24B37/04
CPC分类号： B24B37/04 , B23H5/08 , B24B53/017 , C25F7/00
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical polishing system. In one embodiment, a cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper polishing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk polishing cell and a residual polishing cell. The residual polishing cell includes a biased conductive polishing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
摘要翻译：本发明的实施例通常提供一种用于在电化学机械抛光系统中处理衬底的方法和装置。在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的抛光垫。多个导电元件跨过上抛光表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏置衬底。多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。在另一个实施例中，提供了具有大量抛光单元和残余抛光单元的系统。残余抛光单元包括偏置的导电抛光表面。在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

5. 发明申请

WO2008002909A3 METHOD AND APPARATUS FOR MULTI-CHAMBER EXHAUST CONTROL 审中-公开
公开(公告)号：WO2008002909A3
公开(公告)日：2008-01-03
申请号：PCT/US2007/072111
申请日：2007-06-26
申请人： SOKUDO CO., LTD. , TSENG, Ming-Kuei , RAMANAN, Natarajan , ISHIKAWA, Tetsuya , GONDHALEKAR, Sudhir, R.
发明人： TSENG, Ming-Kuei , RAMANAN, Natarajan , ISHIKAWA, Tetsuya , GONDHALEKAR, Sudhir, R.
IPC分类号： B05D3/04 , B05C11/02
摘要： A method of operating a multi-chamber module including a first chamber, a second chamber, and a dispense arm area positioned between the first chamber and the second chamber. The method includes flowing a process gas into the first chamber, the second chamber, and the dispense arm area. The method also includes exhausting a first gas from the first chamber using a first exhaust path in fluid communication with a shared exhaust, exhausting a second gas from the second chamber using a second exhaust path in fluid communication with the shared exhaust, and exhausting a third gas from the dispense arm area using a dispense arm area exhaust in fluid communication with the shared exhaust. The method further includes monitoring a first chamber pressure in the first chamber, a second chamber pressure in the second chamber, and a dispense pressure in the dispense arm area, and adjusting a flow through at least one of the first exhaust path, the second exhaust path, and the dispense arm area exhaust to maintain the first chamber pressure and the second chamber pressure at a value higher than the dispense pressure.

6. 发明申请

WO2008002909A2 METHOD AND APPARATUS FOR MULTI-CHAMBER EXHAUST CONTROL 审中-公开
标题翻译：多室排气控制方法与装置
公开(公告)号：WO2008002909A2
公开(公告)日：2008-01-03
申请号：PCT/US2007072111
申请日：2007-06-26
申请人： SOKUDO CO LTD , TSENG MING-KUEI , RAMANAN NATARAJAN , ISHIKAWA TETSUYA , GONDHALEKAR SUDHIR R
发明人： TSENG MING-KUEI , RAMANAN NATARAJAN , ISHIKAWA TETSUYA , GONDHALEKAR SUDHIR R
IPC分类号： G01F11/00 , B67B7/00
CPC分类号： G05D16/202 , H01L21/67017 , H01L21/6719
摘要： A method of operating a multi-chamber module including a first chamber, a second chamber, and a dispense arm area positioned between the first chamber and the second chamber. The method includes flowing a process gas into the first chamber, the second chamber, and the dispense arm area. The method also includes exhausting a first gas from the first chamber using a first exhaust path in fluid communication with a shared exhaust, exhausting a second gas from the second chamber using a second exhaust path in fluid communication with the shared exhaust, and exhausting a third gas from the dispense arm area using a dispense arm area exhaust in fluid communication with the shared exhaust. The method further includes monitoring a first chamber pressure in the first chamber, a second chamber pressure in the second chamber, and a dispense pressure in the dispense arm area, and adjusting a flow through at least one of the first exhaust path, the second exhaust path, and the dispense arm area exhaust to maintain the first chamber pressure and the second chamber pressure at a value higher than the dispense pressure.
摘要翻译：一种操作多室模块的方法，该多室模块包括位于第一室和第二室之间的第一室，第二室和分配臂区域。该方法包括使处理气体流入第一室，第二室和分配臂区域。该方法还包括使用与共用排气流体连通的第一排气路径从第一室排出第一气体，使用与共用排气流体连通的第二排气通道从第二室排出第二气体，以及排出第三气体来自分配臂区域的气体使用与共用排气流体连通的分配臂区域排气。该方法还包括监测第一室中的第一室压力，第二室中的第二室压力和分配臂区域中的分配压力，以及调节通过第一排气路径，第二排气中的至少一个的流量路径和分配臂区域排气以将第一室压力和第二室压力保持在高于分配压力的值。

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