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    • 7. 发明授权
    • Method and device for slicing a shaped silicon ingot using layer transfer
    • 使用层转移来切割成型硅锭的方法和装置
    • US08623137B1
    • 2014-01-07
    • US12384926
    • 2009-04-10
    • Francois J. Henley
    • Francois J. Henley
    • C30B19/00
    • C30B29/06B28D5/045C01B33/02C30B33/00C30B33/06H01L21/0201H01L21/02027H01L31/1804
    • A method for slicing a shaped silicon ingot includes providing a single crystal silicon boule characterized by a cropped structure including a first end-face, a second end-face, and a length along an axis in an crystallographic direction substantially vertically extending from the first end-face to the second end-face. The method further includes cutting the single crystal silicon boule substantially through an {110} crystallographic plane in parallel to the axis to separate the single crystal silicon boule into a first portion with a first surface and a second portion with a second surface. Additionally, the method includes exposing either the first surface of the first portion or the second surface of the second portion and performing a layer transfer process to form a single crystal silicon sheet from either the first surface of the first portion or from the second surface of the second portion.
    • 用于切割成形硅锭的方法包括提供单晶硅棒,其特征在于包括第一端面,第二端面和沿着沿着轴线的长度的裁剪结构,该晶体方向基本垂直地从 第二个端面的第一个端面。 该方法还包括基本上通过平行于轴线的{110}晶面平面切割单晶硅棒,以将单晶硅棒分离成具有第一表面的第一部分和具有第二表面的第二部分。 此外,该方法包括将第一部分的第一表面或第二部分的第二表面暴露,并且执行层转移过程以从第一部分的第一表面或第一部分的第二表面形成单晶硅片 第二部分。