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    • 5. 发明申请
    • Fabrication of a microcantilever microwave probe
    • 微型悬臂微波探头的制作
    • US20120192319A1
    • 2012-07-26
    • US13009990
    • 2011-01-20
    • Xinxin LiYongliang Yang
    • Xinxin LiYongliang Yang
    • G01Q60/40
    • G01Q60/22G01Q60/40
    • A microwave probe having a metal tip on the free end of a microcantilever. In one embodiment, a pyramidal pit is isotropically etched in a device wafer of monocrystalline silicon. Oxidation may sharpen the pit. Deposited metal forms the metal tip in the pit and a bottom shield. Other metal sandwiched between equally thick dielectric layers contact the tip and form a conduction path along the cantilever for the probe and detected signals. Further metal forms a top shield overlying the conduction path and the dielectrically isolated tip and having equal thickness to the bottom shield, thus producing together with the symmetric dielectric layers a balanced structure with reduced thermal bending. The device wafer is bonded to a handle wafer. The handle is formed and remaining silicon of the device wafer is removed to release the cantilever.
    • 微型探针在微型悬臂梁的自由端上具有金属尖端。 在一个实施例中,在单晶硅的器件晶片中各向同性蚀刻金字塔形凹坑。 氧化可能会削弱坑。 沉积的金属在凹坑中形成金属尖端和底部屏蔽。 夹在同等厚度的电介质层之间的其他金属接触尖端,并形成沿着悬臂的探针和检测信号的导电路径。 另外的金属形成覆盖导电路径和介电隔离尖端的顶部屏蔽,并且具有与底部屏蔽件相等的厚度,从而与对称的电介质层一起产生具有降低的热弯曲的平衡结构。 器件晶片被结合到处理晶片。 形成手柄并移除器件晶片的剩余硅以释放悬臂。