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1. 发明申请

US20040129575A1 Plating apparatus and plating liquid removing method 有权
公开(公告)号：US20040129575A1
公开(公告)日：2004-07-08
申请号：US10740630
申请日：2003-12-22
发明人： Satoshi Sendai , Kenya Tomioka , Katsumi Tsuda
IPC分类号： C25D005/48
CPC分类号： H01L21/67005 , C25D17/00 , C25D17/001 , C25D17/004 , C25D17/005 , C25D17/06 , H01L21/2885 , H05K3/423 , Y10S134/902
摘要： A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The plating apparatus comprises a head having a rotatable housing provided with a substrate holding member for holding a substrate, a plating process container, disposed below the head, for holding a plating liquid therein, and a plating liquid removing mechanism for removing plating liquid remaining on the substrate-contacting portion, or the portions in its vicinity, at an inner circumferential edge of the substrate holding member.

2. 发明申请

US20040050711A1 Method and apparatus for plating substrate with copper 审中-公开
标题翻译：用铜电镀基板的方法和装置
公开(公告)号：US20040050711A1
公开(公告)日：2004-03-18
申请号：US10660483
申请日：2003-09-12
发明人： Koji Mishima , Mizuki Nagai , Ryoichi Kimizuka , Tetsuo Matsuda , Hisashi Kaneko
IPC分类号： C25D005/48
CPC分类号： C25D17/001 , C25D5/18 , C25D5/34 , C25D7/123 , H05K3/22 , H05K2203/0392 , H05K2203/122 , Y10S205/917
摘要： The present invention relates to a method and apparatus for separating out metal copper according to an electroplating of copper using, for example, a solution of copper sulfate to produce copper interconnections on a surface of a substrate. The substrate is brought into contact, at least once, with a processing solution containing at least one of organic substance and sulfur compound which are contained in a plating solution. Thereafter, the substrate is brought into contact with the plating solution to plate the substrate.
摘要翻译：本发明涉及一种使用例如硫酸铜溶液在铜的电镀上分离金属铜的方法和装置，以在基板的表面上产生铜互连。使基板与包含在电镀液中的含有有机物质和硫化合物的至少一种的处理液接触至少一次。此后，使基板与电镀液接触以对基板进行平板化。

3. 发明申请

US20030209446A1 Method for enhancing the solderability of a surface 有权
标题翻译：提高表面可焊性的方法
公开(公告)号：US20030209446A1
公开(公告)日：2003-11-13
申请号：US10456329
申请日：2003-06-06
申请人： MacDermid Incorporated
发明人： Ronald Redline , David Sawoska , Peter Kukanskis
IPC分类号： C25D005/48
CPC分类号： H05K3/244 , B23K35/007 , C23C18/54
摘要： A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
摘要翻译：公开了一种用于增强金属表面的可焊性的方法，其中金属表面在焊接之前镀有浸银板，该浸渍银板用选自脂肪胺，脂肪酰胺，季铵盐，间苯二甲酸盐，树脂胺，树脂酰胺，脂肪酸，树脂酸，上述任何一种的乙氧基化衍生物，以及任何上述物质的混合物。所产生的沉浸银沉积物抵抗电迁移。

4. 发明申请

US20030089613A1 Method of selectively electroplating by screen-plating technology 审中-公开
标题翻译：通过镀膜技术选择性电镀的方法
公开(公告)号：US20030089613A1
公开(公告)日：2003-05-15
申请号：US10003135
申请日：2001-11-15
发明人： Chang Yu Ching
IPC分类号： C25D005/02 , H05K003/00 , C23C028/00 , C25D005/48
CPC分类号： C25D5/022 , H05K3/0079 , H05K3/0082 , H05K3/1216 , H05K3/243 , H05K2203/0769
摘要： The present invention is to provide a method of selective electroplating comprises a substrate. The substrate may include printed circuir board or other plating metal article on printed circuit board surface specified region. Then, a wet film formed on the substrate by screen-printing, wherein the wet film is photo-sensitivty. Next, it is hardening the wet film, and then exposing the wet film. Next, it is developing the wet film to expose some region for forming metal on the substrate. A metal layer formed on the substrate. Finally, it is stripping the wet film.
摘要翻译：本发明提供一种选择性电镀方法，其包括基底。基板可以包括在印刷电路板表面指定区域上的印刷电路板或其它电镀金属制品。然后，通过丝网印刷在基板上形成的湿膜，其中湿膜是光敏性的。接下来，使湿膜硬化，然后暴露湿膜。接下来，正在显影湿膜以暴露一些区域以在基底上形成金属。形成在基板上的金属层。最后，它是剥离湿膜。

5. 发明申请

US20030000845A1 Method for creating a material library 失效
标题翻译：创建材料库的方法
公开(公告)号：US20030000845A1
公开(公告)日：2003-01-02
申请号：US10176431
申请日：2002-06-20
发明人： Thomas Brinz , Ilona Ullmann
IPC分类号： C23C014/00 , C23C014/32 , C25D005/34 , C25D005/48
CPC分类号： C23C14/04 , B01J19/0046 , C23C14/02
摘要： A method for creating a material library of surface areas having different properties in which a substrate is coated. The substrate is subjected to a combined pretreatment procedure.
摘要翻译：一种用于产生具有不同性质的表面区域的材料库的方法，其中涂覆基底。对基材进行组合预处理。

6. 发明申请

US20020139686A1 Methods of avoiding blowhole formation by conditioning through holes and glass 有权
标题翻译：通过孔和玻璃调理避免气孔形成的方法
公开(公告)号：US20020139686A1
公开(公告)日：2002-10-03
申请号：US10087051
申请日：2002-03-01
发明人： Michael V. Carano , Frank Polakovic
IPC分类号： C23C028/00 , C25D005/48
CPC分类号： H05K3/424
摘要： A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises carbonates, binders, and resins, and combinations thereof, that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (nullThrough holesnull as used herein refers both to through holes and to vias.)
摘要翻译：公开了一种用于清洁和调节由印刷电路板（PCB）中的通孔限定的非导电表面的组合物和方法。通孔表面与本发明的组合物接触以提供清洁和调理的表面。清洁和调理表面涂覆有导电碳颗粒（通常为石墨），以提供碳涂层表面。碳涂层表面电镀，然后使用热焊料焊接。已经焊接并且用本发明的组合物处理的那些表面表现出较少的孔洞问题。本发明的组合物包括碳酸盐，粘合剂和树脂及其组合，其改善了包含石墨的涂层在由通孔或其它基底限定的表面上的粘合性和覆盖性。（本文所用的“通孔”是指通孔和通孔）。

7. 发明申请

US20020066672A1 Process for manufacturing a wiring board 有权
标题翻译：制造布线板的工艺
公开(公告)号：US20020066672A1
公开(公告)日：2002-06-06
申请号：US09997665
申请日：2001-11-26
发明人： Takahiro Iijima , Akio Rokugawa , Yasuyoshi Horikawa
IPC分类号： H05K003/00 , C25D005/02 , C25D005/48
CPC分类号： H05K3/045 , H01L2224/16225 , H01L2924/15311 , H05K3/005 , H05K3/107 , H05K3/28 , H05K3/4007 , H05K3/423 , H05K3/426 , H05K3/4602 , H05K3/4644 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H05K2203/0108
摘要： A resin plate having wiring pattern recesses and via through holes is made. All of the surfaces of the resin plate including inner walls of said wiring pattern recesses and via through holes are coated with a metal film. An electroplating is applied using the metal film as a power-supply layer to fill a plated metal into the wiring pattern recesses and via through holes. The metal film formed on the resin plate except for the inner walls of the wiring pattern recesses and via through holes is removed, so that wiring pattern and via are exposed on a surface the same as that of the resin plate.
摘要翻译：制成具有布线图形凹部和通孔的树脂板。包括所述布线图案凹槽的内壁和通孔的树脂板的所有表面均涂覆有金属膜。使用金属膜作为电源层施加电镀，以将电镀金属填充到布线图案凹部中并经由通孔。去除了除了布线图形凹部和通路孔的内壁之外的树脂板上形成的金属膜，使得布线图案和通路露出在与树脂板相同的表面上。

8. 发明申请

US20040144654A1 Color coding carbide 审中-公开
标题翻译：彩色编码碳化物
公开(公告)号：US20040144654A1
公开(公告)日：2004-07-29
申请号：US10352544
申请日：2003-01-28
发明人： Fletcher Walls
IPC分类号： C25D005/48
CPC分类号： C25D5/50 , C23C10/18 , C23C10/60 , C23C18/165 , C23C22/00 , C23C22/33 , C23C30/005 , C25D5/48
摘要： The present invention enables one to easily and immediately distinguish between grades, dimensions and manufacturers of cemented carbide by color coding. This invention further provides for a semi-permanent coloration of the carbide and this coloration does not interfere with the brazing process. When the process disclosed here is applied to carbide parts, the coloration can be used as a means to distinguish between grades of carbide or to classify visually indistiguishable dimensional changes. In addition, the coloration can provide a record of the manufacturing origin of each individual carbide part.
摘要翻译：本发明使得能够通过颜色编码容易且立即地区分硬质合金的等级，尺寸和制造商。本发明进一步提供碳化物的半永久着色，并且该着色不会干扰钎焊过程。当这里公开的方法应用于碳化物部件时，着色可以用作区分碳化物等级的手段或者将视觉上不可见的尺寸变化分类。此外，着色可以提供每个单独的碳化物部分的制造原点的记录。

9. 发明申请

US20040074777A1 Method for removing electrolyte from electrical contacts and wafer touching areas 失效
标题翻译：从电触点和晶片接触区域去除电解质的方法
公开(公告)号：US20040074777A1
公开(公告)日：2004-04-22
申请号：US10273539
申请日：2002-10-18
申请人： Applied Materials, Inc.
发明人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
IPC分类号： C25D005/48
CPC分类号： C25D7/12 , C25D21/00 , H01L21/2885
摘要： A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.
摘要翻译：提供了一种用于清洁电化学电镀接触环的电接触区域或衬底接触区域的方法。该方法的实施例包括将基板定位在具有一个或多个电触点的基板支撑构件上，在基板表面的至少一部分上化学镀覆金属层，从处理基板移除经处理的基板，并清洁该基板或更多的与包含醇的蒸汽混合物的电接触。在另一方面，该方法包括在旋转衬底支撑构件的同时将蒸气混合物喷射到电触点上。

10. 发明申请

US20040004004A1 Method for reducing cu surface defects following cu ECP 失效
标题翻译：减少cu ECP后的cu表面缺陷的方法
公开(公告)号：US20040004004A1
公开(公告)日：2004-01-08
申请号：US10188689
申请日：2002-07-02
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Chia-Liang Chueh , Volume Chien , Shih-Ming Wang
IPC分类号： C25D005/48
CPC分类号： C25D5/48 , Y10S134/902
摘要： A method for cleaning an electrodeposition surface following an electroplating process including providing a process surface including electro-chemically deposited metal following an electrodeposition process; and, cleaning the process surface with a sulfuric acidic cleaning solution to remove electrodeposited metal particles according to at least one of an immersion and spraying process the spraying process including simultaneously rotating the process surface.
摘要翻译：一种用于在电镀工艺之后清洁电沉积表面的方法，包括在电沉积工艺之后提供包括电化学沉积金属的工艺表面; 并且用硫酸酸性清洁溶液清洗工艺表面以根据浸渍和喷涂工艺中的至少一个去除电沉积金属颗粒，所述喷涂工艺包括同时旋转工艺表面。

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