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1. 发明申请

US20020072016A1 Substrate cleaning apparatus and method 有权
标题翻译：基板清洗装置及方法
公开(公告)号：US20020072016A1
公开(公告)日：2002-06-13
申请号：US09737373
申请日：2000-12-13
申请人： Applied Materials, Inc.
发明人： Haojiang Chen , James S. Papanu , Mark Kawaguchi , Harald Herchen , Jeng H. Hwang , Guangxiang Jin , David Palagashvili
IPC分类号： G03F007/36
CPC分类号： H01L21/02071 , G03F7/427 , H01L21/32136
摘要： A method of processing a substrate 30 comprises exposing the substrate 30 to an energized process gas to etch features 67 on the substrate 30 and exposing the substrate 30 to an energized cleaning gas to remove etchant residue 70 and/or remnant resist 60 from the substrate 30. To enhance the cleaning process, the substrate 30 may be treated before, during or after the cleaning process by exposing the substrate 30 to an energized treating gas comprising a halogen species.
摘要翻译：处理衬底30的方法包括将衬底30暴露于通电工艺气体以蚀刻衬底30上的特征67，并将衬底30暴露于通电的清洁气体以从衬底30去除蚀刻剂残留物70和/或残余抗蚀剂60 为了增强清洁过程，可以在清洁过程之前，之中或之后对衬底30进行处理，通过将衬底30暴露于包含卤素物质的通电处理气体中。

2. 发明申请

US20040118697A1 Metal deposition process with pre-cleaning before electrochemical deposition 审中-公开
标题翻译：电化学沉积前金属沉积工艺与预清洗
公开(公告)号：US20040118697A1
公开(公告)日：2004-06-24
申请号：US10676208
申请日：2003-10-01
申请人： APPLIED MATERIALS, INC.
发明人： Mei Wen+ , Roman M. Mostovoy , Glen T. Mori , Harald Herchen
IPC分类号： C25D005/34
CPC分类号： H01L21/321 , C23C14/58 , C25D5/34 , H01L21/02052 , H01L21/76856 , H01L21/76861 , H01L21/76862 , H01L21/76873
摘要： A metal seed layer on a substrate is pre-cleaned prior to formation of an electrochemically deposited metal fill layer. A liquid-based pre-clean may include, for example, an agitated rinse, an etchant solution, a surfactant solution and/or a solvent-solution to remove organic and/or other contaminants from the metal seed layer. A dry pre-clean may utilize, for example, a hydrogen and/or an oxygen plasma to remove contaminants and/or reduce a metal oxide of the seed layer. In at least one embodiment, the reduction of the metal oxide may occur at a pressure in excess of 0.1 atmosphere.
摘要翻译：在形成电化学沉积的金属填充层之前，在基底上的金属种子层被预先清洁。基于液体的预清洁可以包括例如搅拌漂洗剂，蚀刻剂溶液，表面活性剂溶液和/或溶剂溶液以从金属种子层去除有机和/或其它污染物。干式预清洁可以利用例如氢和/或氧等离子体来去除污染物和/或减少种子层的金属氧化物。在至少一个实施方案中，金属氧化物的还原可以在超过0.1个气氛的压力下进行。

3. 发明申请

US20040074761A1 Plating uniformity control by contact ring shaping 失效
标题翻译：通过接触环成形进行电镀均匀性控制
公开(公告)号：US20040074761A1
公开(公告)日：2004-04-22
申请号：US10278527
申请日：2002-10-22
申请人： Applied Materials, Inc.
发明人： Harald Herchen , Henan Hao , Celina M. Esteban , Timothy R. Webb , Son N. Trinh
IPC分类号： H05F003/00
CPC分类号： C25D17/06 , C25D7/123 , C25D17/001 , H01L21/2885 , Y10T29/49117 , Y10T29/49204 , Y10T29/5313 , Y10T29/532
摘要： An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.
摘要翻译：描述了一种用于在处理系统中向基板提供电偏压的装置。该装置通常包括限定中心开口的导电环形体。导电环形体可以具有适于容纳衬底的衬底安置表面和形成在与衬底安置表面相对的表面上的多个扇贝。多个电触头可以形成在与多个扇贝相对的基板支座表面上。电触点可以适于接合基板的电镀表面。

4. 发明申请

US20040140203A1 Liquid isolation of contact rings 有权
标题翻译：液体隔离接触环
公开(公告)号：US20040140203A1
公开(公告)日：2004-07-22
申请号：US10348800
申请日：2003-01-21
申请人： Applied Materials,Inc.
发明人： Vincent E. Burkhart , Harald Herchen , Joseph Yahalom
IPC分类号： C25D005/00
CPC分类号： C25D17/06 , C25D7/123 , C25D17/005
摘要： Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate support surface, a first seal positioned on the substrate support surface radially inward of the plurality of electrical contacts, and a second seal positioned radially outward of the plurality of electrical contacts. Additionally, the contact ring generally includes a fluid inlet configured to supply a fluid to a volume between the first seal and the second seal.
摘要翻译：本发明的实施例还可以提供用于电化学电镀系统的接触环。触点通常包括其上形成有基板支撑表面的基板接收构件，从基板支撑表面延伸的多个电接触销，位于多个电触点的径向内侧的基板支撑表面上的第一密封件，以及第二密封件定位在多个电触头的径向外侧的密封件。另外，接触环通常包括被配置为将流体供应到第一密封件与第二密封件之间的体积的流体入口。

5. 发明申请

US20030221957A1 Anode impedance control through electrolyte flow control 失效
标题翻译：阳极阻抗控制通过电解质流动控制
公开(公告)号：US20030221957A1
公开(公告)日：2003-12-04
申请号：US10156749
申请日：2002-05-28
申请人： APPLIED MATERIALS, INC
发明人： Harald Herchen , Craig Brodeur , Qunwei Wu , Peter Kimball , Vincent Burkhart
IPC分类号： C25C007/02
CPC分类号： C25D7/123 , C25D17/001 , C25D17/12
摘要： Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface. PATENT
摘要翻译：本发明的实施方案通常提供一种电化学电镀单元，其具有构造成在其中容纳电镀溶液的电解质容器组件，位于电解质容器上方的头组件，头组件构造成在电化学电镀过程期间支撑衬底，以及阳极组件位于电解质容器的下部。阳极组件通常包括具有基本上平坦的上表面的铜构件，形成在基本平坦的上表面中的至少一个凹槽，所述至少一个凹槽中的每一个源自基本平坦的阳极表面的中心部分，并且终止于位置靠近所述基本平坦的上表面的周边，以及位于所述基本平坦的上阳极表面的周边处的至少一个流体出口。专利

6. 发明申请

US20040140217A1 Noble metal contacts for plating applications 审中-公开
标题翻译：贵金属触点用于电镀应用
公开(公告)号：US20040140217A1
公开(公告)日：2004-07-22
申请号：US10349761
申请日：2003-01-22
申请人： Applied Materials, Inc.
发明人： Harald Herchen
IPC分类号： C25B009/02
CPC分类号： H01L21/2885 , C25D17/001
摘要： Apparatus for electrochemical plating, comprising a support ring and a plurality of inwardly directed shanks extended from an inner circumference of the ring, wherein each of the shanks comprises a contacting tip brazed to the distal end the shank.
摘要翻译：用于电化学电镀的装置，包括支撑环和从环的内周延伸的多个向内指向的柄，其中每个柄包括钎焊到柄的远端的接触尖端。

7. 发明申请

US20040074777A1 Method for removing electrolyte from electrical contacts and wafer touching areas 失效
标题翻译：从电触点和晶片接触区域去除电解质的方法
公开(公告)号：US20040074777A1
公开(公告)日：2004-04-22
申请号：US10273539
申请日：2002-10-18
申请人： Applied Materials, Inc.
发明人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
IPC分类号： C25D005/48
CPC分类号： C25D7/12 , C25D21/00 , H01L21/2885
摘要： A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.
摘要翻译：提供了一种用于清洁电化学电镀接触环的电接触区域或衬底接触区域的方法。该方法的实施例包括将基板定位在具有一个或多个电触点的基板支撑构件上，在基板表面的至少一部分上化学镀覆金属层，从处理基板移除经处理的基板，并清洁该基板或更多的与包含醇的蒸汽混合物的电接触。在另一方面，该方法包括在旋转衬底支撑构件的同时将蒸气混合物喷射到电触点上。

8. 发明申请

US20040060812A1 Method for modulating stress in films deposited using a physical vapor deposition (PVD) process 审中-公开
标题翻译：使用物理气相沉积（PVD）工艺沉积的膜中调节应力的方法
公开(公告)号：US20040060812A1
公开(公告)日：2004-04-01
申请号：US10256660
申请日：2002-09-27
申请人： Applied Materials, Inc.
发明人： Jr-Jyan Chen , Harald Herchen , Kenny King-Tai Ngan
IPC分类号： C23C014/32
CPC分类号： C23C14/345 , C23C14/165
摘要： A method of controlling intrinsic stress in metal films deposited on a substrate using physical vapor deposition (PVD) techniques is disclosed. The film stress is controlled, by applying a bias power to the substrate during the deposition process. The magnitude of the bias power applied to the substrate modulates the film stress such that as-deposited material layers have an intrinsic stress that may be either tensile or compressive. Also, a reflected bias power may be applied to the substrate during the deposition process, in addition to the bias power. The magnitude of the reflected bias power in combination with the bias power also modulates the film stress such that as-deposited material layers have an intrinsic stress that may be either tensile or compressive.
摘要翻译：公开了使用物理气相沉积（PVD）技术控制沉积在衬底上的金属膜中的固有应力的方法。通过在沉积过程中向衬底施加偏置功率来控制膜应力。施加到衬底的偏置功率的大小调制膜应力，使得沉积的材料层具有可以是拉伸或压缩的本征应力。此外，除了偏置功率之外，还可以在沉积工艺期间将反射偏压功率施加到衬底。反射偏置功率的大小与偏置功率的组合也调节膜应力，使得沉积的材料层具有可以是拉伸或压缩的本征应力。

9. 发明申请

US20040007459A1 Anode isolation by diffusion differentials 失效
标题翻译：阳极通过扩散差分隔离
公开(公告)号：US20040007459A1
公开(公告)日：2004-01-15
申请号：US10194160
申请日：2002-07-11
申请人： Applied Materials, Inc.
发明人： Harald Herchen
IPC分类号： C25C007/04
CPC分类号： C25D7/123 , C02F1/44 , C02F2201/46115 , C02F2301/08 , C25D17/001 , C25D17/002
摘要： Embodiments of the invention generally provide an electrochemical plating cell having a cell body configured to contain a plating solution therein. An anode assembly is immersed in a fluid solution contained in the cell body, the anode being positioned in an anode compartment of the cell body. A cathode assembly is positioned in a cathode compartment of the cell body, and a multilevel diffusion differentiated permeable membrane is positioned between the anode compartment and the cathode compartment. The multilevel diffusion differentiated permeable membrane is generally configured to separate the anode compartment from the cathode compartment, while allowing a fluid solution to flow therethrough in a direction from the anode compartment towards the cathode compartment.
摘要翻译：本发明的实施方案通常提供一种电化学电镀单元，其具有构造成在其中容纳电镀液的电池体。阳极组件浸入包含在电池体内的流体溶液中，阳极位于电池体的阳极室中。阴极组件位于电池体的阴极室中，并且多层扩散微分渗透膜位于阳极室和阴极室之间。多层扩散分化渗透膜通常被配置为将阳极室与阴极室分开，同时允许流体溶液沿着从阳极室朝向阴极室的方向流过。

10. 发明申请

US20040149573A1 Contact ring with embedded flexible contacts 有权
标题翻译：接触环带嵌入式柔性触点
公开(公告)号：US20040149573A1
公开(公告)日：2004-08-05
申请号：US10355479
申请日：2003-01-31
申请人： Applied Materials, Inc.
发明人： Harald Herchen
IPC分类号： C25C007/00
CPC分类号： C25D17/001 , C25D7/123 , C25D17/06
摘要： A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.
摘要翻译：一种用于在电化学电镀系统中支撑衬底的接触组件，其中所述接触组件包括接触环和推力板组件。接触环包括具有上表面和下表面的环形环构件，位于上表面上的环形凸起构件以及从下表面径向向内延伸的多个柔性和导电的衬底接触指。推力板包括尺寸设置成容纳在环形环构件内的环形板构件和从板构件径向向外延伸的密封构件，密封构件构造成与环形凸起构件接合以与其形成流体密封。

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