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1. 发明授权

US3522155A Method of electrodepositing a tinbismuth alloy and compositions therefor 失效
标题翻译：电沉积钛银合金及其组合物的方法
公开(公告)号：US3522155A
公开(公告)日：1970-07-28
申请号：US3522155D
申请日：1964-07-10
申请人： M & T CHEMICALS INC
发明人： DOW RONALD
IPC分类号： B01J19/00 , C25D3/60 , C23B5/38
CPC分类号： B01J19/0053 , B01J2219/00182 , B01J2219/00186 , C25D3/60

2. 发明授权

US3905878A Electrolyte for and method of bright electroplating of tin-lead alloy 失效
标题翻译：锡铅合金的电解质和光亮电镀方法
公开(公告)号：US3905878A
公开(公告)日：1975-09-16
申请号：US40638673
申请日：1973-10-15
申请人： HYOGO PREFECTURAL GOVERNMENT
发明人： DOHI NOBUYASU , KAMON MIKIO
IPC分类号： C25D3/60 , C23B5/38 , C23B5/40 , C23B5/46
CPC分类号： C25D3/60
摘要： A method of and an electrolyte for the bright electroplating tin-lead alloys which comprises using as the plating solution a mixture which contains phenolsulfonates or cresolsulfonates of divalent tin and lead, with the ''''reaction products of aliphatic aldehydes with aromatic primary amines,'''' and acetaldehyde.
摘要翻译：一种用于光亮电镀锡铅合金的方法和电解质，其包括使用含有二价锡和铅的酚磺酸盐或甲酚磺酸盐的混合物与“芳族伯胺的脂族醛的反应产物”和乙醛。

3. 发明授权

US3753873A Process for the electrodeposition of a colored nickel-tin alloy coating 失效
标题翻译：彩色镍铬合金涂层电沉积工艺
公开(公告)号：US3753873A
公开(公告)日：1973-08-21
申请号：US3753873D
申请日：1970-11-06
申请人： ENEQUIST CHEMICAL CO INC
发明人： GEFFON S , SCHWARTZ W , CATES L , GEFFON S
IPC分类号： C25D3/56 , C23B5/38
CPC分类号： C25D3/562
摘要： ELECTROPLATING APPARATUS FOR PLATING AN ARTICLE IMMERSED IN AN ELECTROLYTIC BATH BY APPLYING A POSITIVE DC VOLTAGE TO AN ANODE IMMERSED IN THE ELECTRLYTIC BATH AND BY APPLYING A NEGIVE DC VOLTAGE TO THE ARTICLE, COMPRISES AN ELECTROLYTIC BATH CONTAINING AN AQUEOUS SOLUTION OF NICKEL IN A RANGE OF 5 TO 100 GGRAMS LITER AND PROVIDED BY ONE OF A GROUP CONSISTING OF NICKEL SULFATE, NICKEL SULFAMATE, NICKEL FLUOBORATE, NICKEEL CHLORIDE, NICKEL CARBONATE, NICKEL CYANIDE, NICKEL ACETATE, NICKEL ETHYLENE DIAMINE TETRA ACETIC ACID, NICKEL OXIDE AND NICKEL TARTATE, TIN IN A RANGE OF 5 TO 100 GRAMS PER LITER AND PROVIDED BY ONE OF A GROUP CONSISTING OF SODIUM STANATE, POTAS-

SIUM STANATE, STANNIC CHLORIDE, STANNOUS CHLORIDE, STANNIC SULFATE, STANNOUS SULFATE, STANNOIC FLUOBORATE AND STANNOUS FLUOBORATE, ALKALI CYANIDE IN A RANGE OF 5 TO 200 GRAMS PER LITER PROVIDED BY ONE OF A GROUP CONSISTIN OF SO DIUM CYANIDE AND POTASSIUM CYANIDE, AND AT LEAST ONE OF A GROUP CONSISTING OF COPPER, ZINC MOLYBDENUM, SELENIUM ARSENIC AN SULFUR IN A RANGE OF 0 TO 20 GRAMS PER LITER.

4. 发明授权

US3554878A Plating tin-lead alloy on printed circuits and electrolyte therefor 失效
标题翻译：在印刷电路和电解质上镀钛锡合金
公开(公告)号：US3554878A
公开(公告)日：1971-01-12
申请号：US3554878D
申请日：1968-07-02
申请人： NORTH AMERICAN ROCKWELL
发明人： ROTHSCHILD BILL F
IPC分类号： C25D3/60 , C25D7/04 , H05K3/34 , C23B5/38 , C23B5/40
CPC分类号： C25D7/04 , C25D3/60 , H05K3/3473
摘要： A HIGH THROWING POWER TIN LEAD (SOLDER) FLUOBORATE PLATING BATH. THE BATH HAS A VERY LOW TOTAL METAL CONTENT, TYPICALLY 15 TO 30 GRAMS PER LITER, AND A HIGH FLUOBORIC ACID CONTENT, TYPICALLY 300 TO 500 GRAMS PER LITER. A SMALL WEIGHT PERCENTAGE OF PEPTONE, TYPICALLY 2 TO 10 GRAMS PER LITER COMPLETES THE SOLUTION. THE INVENTIVE PLATING BATH HAS A VERY HIGH THROWING POWER VALUE, TYPICALLY GREATER THAN 65, AND PERMITS SUBSTANTIALLY UNIFORM THICKNESS SOLDER PLATING OF PRINTED WIRING BOARDS THROUGH HOLES HAVING BOARD THICKNESS TO HOLE DIAMETER RATIOS OF 5:1 OR GREATER.

5. 发明授权

US4323393A Hot dipping lead base coating material 失效
标题翻译：热浸铅基涂料
公开(公告)号：US4323393A
公开(公告)日：1982-04-06
申请号：US179478
申请日：1980-08-18
申请人： Teiji Nagahori , Masanori Ohshima
发明人： Teiji Nagahori , Masanori Ohshima
IPC分类号： C22C11/00 , C22C11/06 , C23C2/08 , C23C2/10 , C25B11/10 , C23B5/14 , C23B5/38 , C23B5/40
CPC分类号： C22C11/06
摘要： A lead base coating material containing 0.3-30.0 weight percent, preferably 3.0-4.9 weight percent of tin and 0.001-0.3 weight percent, preferably 0.001-0.02 weight percent in phosphorus content equivalent of at least one selected from the group consisting of phosphorus, tin phosphide, zinc phosphide, antimony phosphide, bismuth phosphide and lead phosphide. The coating material has an excellent wetting to the matrix of a metal plated with the coating material, can promote the formation of an alloy phase between the plating metal matrix and a plating layer, and can also form a plating layer having an improved solderability and an improved corrosion resistivity. The coating material may further contain 0.1-7.0 weight percent of zinc and/or 0.5-35.0 weight percent of antimony, the former imparting sacrificial anodicity to the plating layer, while the latter imparting an enhanced hardness to the plating layer.
摘要翻译：含有0.3-30.0重量％，优选3.0-4.9重量％锡和0.001-0.3重量％，优选0.001-0.02重量％的铅含量的铅基涂料，其磷含量当量为选自磷，锡磷化物，磷化锌，磷化锑，磷化铋和磷化铅。涂覆材料对涂覆材料的金属的基体具有优异的润湿性，可以促进电镀金属基体和镀层之间的合金相的形成，并且还可以形成具有改善的可焊性的镀层和提高耐腐蚀性。涂料可以进一步含有0.1-7.0重量％的锌和/或0.5-35.0重量％的锑，前者赋予镀层牺牲阳极，而后者赋予镀层更高的硬度。

6. 发明授权

US3875029A Plating bath for electrodeposition of bright tin and tin-lead alloy 失效
标题翻译：用于电镀锌和锡铅合金的镀锌浴
公开(公告)号：US3875029A
公开(公告)日：1975-04-01
申请号：US44340674
申请日：1974-02-19
申请人： R O HULL & COMPANY INC
发明人： ROSENBERG WILLIAM E , ECKLES WILLIAM E
IPC分类号： C25D3/32 , C25D3/60 , C23B5/14 , C23B5/38 , C23B5/46
CPC分类号： C25D3/32 , C25D3/60
摘要： The invention disclosed herein relates to the electrolytic deposition of bright tin and tin-lead alloy. This invention is embodied in a new plating bath and a plating bath additive. The new plating bath includes tin or tin and lead ions, sulfuric acid or fluoboric acid, and the new additive. The new additive includes an emulsified naphthalene monocarboxaldehyde with or without a substituted olefin, having the general formula:

IN WHICH R1 is carboxy, carboxamido, alkali carboxylate, ammonium carboxylate, amine carboxylate, or alkyl carboxylate, and R2, R3, and R4 are hydrogen, methyl, or lower alkyl.

7. 发明授权

US3772168A Electrolytic plating of tin-nickel, tin-cobalt or tin-nickel-cobalt on a metal base and acid bath for said plating 失效
标题翻译：金镍基电解镀锌，金属镍或锡镍钴，用于镀层金属基底和酸浴
公开(公告)号：US3772168A
公开(公告)日：1973-11-13
申请号：US3772168D
申请日：1972-08-10
申请人： DILLENBERG H
发明人： DILLENBERG H
IPC分类号： C25D3/60 , C23B5/32 , C23B5/38
CPC分类号： C25D3/60
摘要： A method for electrolytic plating of tin-nickel, tin-cobalt or tin-nickel-cobalt on a metal base and acid bath for said plating in which a bivalent salt of tin and nickel or tin and cobalt or tin, nickel and cobalt is dissolved in an aqueous acid bath containing an alkali metal or ammonium fluoride or fluoborate which is reacted with at least about 2 volume percent of an amine to form the fluoride or fluoborate amine salt dissolved in said bath. Preferred amines which form salts are petrylene diamine, diethylene triamine, triethylene tetramine, mono, di or tri ethanolamine and pyridine. Heavy, lustrous ductile coatings are deposited from the bath at pH 3.8 - 5.5 under current intensity of 0.1 - 5 amps/dm2 and at a temperature of 40* - 90*C.
摘要翻译：在金属基体上的锡镍，锡钴或锡镍钴的电解电镀方法，其中锡和镍或锡，钴或锡，镍和钴的二价盐溶解在所述电镀中在含有碱金属或氟化铵或氟硼酸盐的含水酸浴中，其与至少约2体积％的胺反应以形成溶解在所述浴中的氟化物或氟硼酸盐盐。形成盐的优选胺是碳二胺，二亚乙基三胺，三亚乙基四胺，一元，二或三乙醇胺和吡啶。在电流强度为0.1-5安培/ dm 2，温度为40-90℃的条件下，从pH 3.8〜5.5的浴中沉积重光泽的延性涂层。

8. 发明授权

US3769182A Bath and method for electrodepositing tin and/or lead 失效
标题翻译：用于电沉积锡和/或铅的浴和方法
公开(公告)号：US3769182A
公开(公告)日：1973-10-30
申请号：US3769182D
申请日：1971-07-06
申请人： CONVERSION CHEM CORP
发明人： BECKWITH M , HSU G
IPC分类号： C25D3/32 , C25D3/36 , C25D3/56 , C25D3/60 , C23B5/14 , C23B5/16 , C23B5/38
CPC分类号： C25D3/56 , C25D3/32 , C25D3/36 , C25D3/60
摘要： A plating bath for electrodepositing tin and/or lead contains stannous ion, lead ion, or a mixture thereof, together with a fluoborate, fluosilicate and/or sulfamate electrolyte and a polyoxyalkylated fatty acid alkylolamide surfactant. The bath operates at pH values of less than about 3.0, and very desirable deposits are produced over wide ranges of current densities and under a variety of plating conditions.
摘要翻译：用于电沉积锡和/或铅的电镀浴与氟硼酸盐，氟硅酸盐和/或氨基磺酸盐电解质和聚氧化烷基化脂肪酸烷醇酰胺表面活性剂一起含有亚锡离子，铅离子或其混合物。浴的pH值小于约3.0，并且在宽电流密度范围内和在各种电镀条件下产生非常理想的沉积物。

9. 发明授权

US3859182A Coating printed circuit boards with tin or tin-lead alloy and tin-lead fluoborate plating baths 失效
标题翻译：涂层印刷电路板，镀锡或镀锡合金和铅笔浮子镀层
公开(公告)号：US3859182A
公开(公告)日：1975-01-07
申请号：US32109273
申请日：1973-01-04
申请人： ALLIED CHEM
发明人： VANDER MEY JOHN E
IPC分类号： C25D3/32 , C25D3/60 , H05K3/34 , C23B5/14 , C23B5/38 , C23B5/46
CPC分类号： C25D3/32 , C25D3/60 , H05K3/3473 , Y10S205/92
摘要： The plating bath of the invention is an aqueous plating bath comprising, per liter of bath, from about 150 to about 700 grams of bath of fluoboric acid; from about 2 to about 15 grams of a plate modifying additive, preferably an amino acid chain compound; from about 15 to about 82 grams of metal selected from stannous tin or a mixture of stannous tin and lead, which mixture contains at least 5 weight percent tin, and from about 0.01 to about 1 gram of beta-naphtol. An electrically conductive substrate is plated with tin or a tin-lead alloy by immersing the substrate in the above plating bath at a temperature between about 50* and 100* F. and applying sufficient negative voltage to the substrate relative to an anode within the bath to cause a current density at the substrate of between about 7 and about 35 amperes per square foot.

10. 发明授权

US3785939A Tin/lead plating bath and method 失效
标题翻译： TIN / LEAD镀锌浴和方法
公开(公告)号：US3785939A
公开(公告)日：1974-01-15
申请号：US3785939D
申请日：1970-10-22
申请人： CONVERSION CHEM CORP
发明人： HSU G
IPC分类号： C25D3/32 , C25D3/36 , C25D3/56 , C25D3/60 , C23B5/38 , C23B5/40 , C23B5/46
CPC分类号： C25D3/56 , C25D3/32 , C25D3/36 , C25D3/60
摘要： A PLATING BATH FOR ELECTRODEPOSITION OF TIN/LEAD ALLOYS CONTAINS STANNOUS ION, LEAD ION, A FLUOBORATE, FLUOSILICATE OR SULFAMATE RADICAL AND, AS A BRIGHTENER SYSTEM, A NON IONIC POLYOXALKYLATED SURFACTANT, A LOWER ALIPHATIC ALDEHYDE, AN ALIPHATIC OR AROMATIC AMINE AND AN AROMATIC ALDEHYDE, THE PH OF THE BATH BEING LESS THAN ABOUT 3.0.

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