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    • 3. 发明授权
    • Method of fabricating the high-density diode-based read-only memory
device
    • 制造基于高密度二极管的只读存储器件的方法
    • US5907778A
    • 1999-05-25
    • US907020
    • 1997-08-06
    • Jih-Wen ChouJemmy Wen
    • Jih-Wen ChouJemmy Wen
    • H01L21/8229H01L27/102H01L21/8246
    • H01L21/8229H01L27/1021Y10S257/926
    • A method is provided for fabricating a read-only memory (ROM) device of the type including an array of diode-based memory cells for permanent storage of binary-coded data. The ROM device is partitioned into a memory division and an output division. The memory cells are formed over an insulating layer in the memory division. The insulating layer separates the memory cells from the underlying substrate such that the leakage current that can otherwise occur therebetween can be prevented. Moreover, the coding process is performing by forming contact windows at selected locations rather than by performing ion-implantation as in conventional methods. The fabrication process is thus easy to perform. Since the memory cells are diode-based rather than MOSFET-based, the punch-through effect that usually occurs in MOSFET-based memory cells can be prevented. The diode-based structure also allows the packing density of the memory cells on the ROM device to be dependent on the line width of the polysilicon layers in the ROM device. The feature size of the ROM device is thus dependent on the capability of the photolithographic process.
    • 提供了一种用于制造这种类型的只读存储器(ROM)器件的方法,该器件包括用于永久存储二进制编码数据的基于二极管的存储器单元阵列。 ROM设备被划分为存储器部分和输出部分。 存储器单元形成在存储器分区中的绝缘层上。 绝缘层将存储器单元与下层衬底分离,从而可以防止其间发生的泄漏电流。 此外,编码过程是通过在所选位置形成接触窗而不是按照常规方法进行离子注入而进行的。 因此制造工艺容易执行。 由于存储器单元是基于二极管的而不是基于MOSFET的,所以可以防止通常发生在基于MOSFET的存储器单元中的穿透效应。 基于二极管的结构还允许ROM器件上的存储器单元的堆积密度取决于ROM器件中多晶硅层的线宽。 因此ROM器件的特征尺寸取决于光刻工艺的能力。
    • 4. 发明授权
    • Method of making a mask ROM using tunnel current detection to store data
    • 使用隧道电流检测来制作掩模ROM以存储数据的方法
    • US5580809A
    • 1996-12-03
    • US492217
    • 1995-06-19
    • Shinichi MoriOsamu UedaMasayuki Yamashita
    • Shinichi MoriOsamu UedaMasayuki Yamashita
    • G11C11/56H01L21/8246H01L27/112
    • G11C11/5692H01L27/112Y10S257/926Y10S438/981
    • Each of the portions corresponding to the crossings of a plurality of first strip conductive layers serving as bit lines and a plurality of second strip conductive layers serving as word lines crossing the conductive layers at right angles is used as one memory cell. An oxide film is provided between the first strip conductive layers and the second strip conductive layers. The thickness of this oxide film is set in each memory cell according to stored data. Also a multi-value memory can be realized, since the amount of stored data in each memory cell is an arbitrary amount of 1 bit or more by making the stored data of a plurality of types of memory cells having different thicknesses in the tunnel oxide film 15 correspond to a plurality of different data. The size of each memory cell can be reduced since the occupying area of each memory cell on the semiconductor substrate is dependent on the width of the first strip conductive layer and the second strip conductive layer. An insulation film in which tunnel phenomenon is generated can be formed using conventional manufacturing technology.
    • 作为用作位线的多个第一带状导电层和作为与导电层成直角交叉的字线的多个第二带状导电层的交叉部分的每个部分被用作一个存储单元。 在第一带状导电层和第二带状导电层之间设置氧化膜。 根据存储的数据,将该氧化膜的厚度设定在各存储单元中。 另外,可以实现多值存储器,因为通过在隧道氧化膜中存储具有不同厚度的多种类型的存储单元的存储数据,每个存储单元中存储的数据量是1位或更多的任意量 15对应于多个不同的数据。 由于半导体衬底上的每个存储单元的占有面积取决于第一带状导电层和第二带状导电层的宽度,因此可以减小每个存储单元的尺寸。 可以使用传统的制造技术形成其中产生隧道现象的绝缘膜。
    • 6. 发明授权
    • High resolution amorphous silicon radiation detectors
    • 高分辨率非晶硅辐射探测器
    • US5117114A
    • 1992-05-26
    • US448240
    • 1989-12-11
    • Robert A. StreetSelig N. KaplanVictor Perez-Mendez
    • Robert A. StreetSelig N. KaplanVictor Perez-Mendez
    • G01T1/20G01T1/24H01L31/0232H01L31/117
    • H01L31/0232G01T1/2018H01L31/02322H01L31/117Y10S257/926
    • A radiation detector employing amorphous Si:H cells in an array with each detector cell having at least three contiguous layers (n type, intrinsic, p type), positioned between two electrodes to which a bias voltage is applied. An energy conversion layer atop the silicon cells intercepts incident radiation and converts radiation energy to light energy of a wavelength to which the silicon cells are responsive. A read-out device, positioned proximate to each detector element in an array allows each such element to be interrogated independently to determine whether radiation has been detected in that cell. The energy conversion material may be a layer of luminescent material having a columnar structure. In one embodiment a column of luminescent material detects the passage therethrough of radiation to be detected and directs a light beam signal to an adjacent a-Si:H film so that detection may be confined to one or more such cells in the array. One or both electrodes may have a comb structure, and the teeth of each electrode comb may be interdigitated for capacitance reduction. The amorphous Si:H film may be replaced by an amorphous Si:Ge:H film in which up to 40 percent of the amorphous material is Ge. Two dimensional arrays may be used in X-ray imaging, CT scanning, crystallography, high energy physics beam tracking, nuclear medicine cameras and autoradiography.
    • 一种辐射检测器,其采用阵列中的非晶Si:H电池,其中每个检测器单元具有至少三个相邻层(n型,本征型,p型),位于施加有偏置电压的两个电极之间。 硅单元顶部的能量转换层拦截入射辐射,并将辐射能转换成硅单元响应的波长的光能。 位于阵列中的每个检测器元件附近的读出装置允许独立地询问每个这样的元件以确定是否在该单元中检测到辐射。 能量转换材料可以是具有柱状结构的发光材料层。 在一个实施例中,一列发光材料检测待检测的辐射的通过,并将光束信号引导到相邻的a-Si:H膜,使得检测可以局限于阵列中的一个或多个这样的单元。 一个或两个电极可以具有梳状结构,并且每个电极梳的齿可以相互交叉以减少电容。 非晶Si:H膜可以由非晶Si:Ge:H膜替代,其中高达40%的无定形材料是Ge。 二维阵列可用于X射线成像,CT扫描,晶体学,高能物理光束跟踪,核医学相机和放射自显影。
    • 7. 发明授权
    • Programmable memory matrix employing voltage-variable resistors
    • 采用电压可变电阻的可编程存储矩阵
    • US5070383A
    • 1991-12-03
    • US295274
    • 1989-01-10
    • Alexander B. SinarLevy GerzbergYosef Y. ShachamIlan A. BlechEric R. Sirkin
    • Alexander B. SinarLevy GerzbergYosef Y. ShachamIlan A. BlechEric R. Sirkin
    • H01L23/525H01L27/102
    • H01L27/1021H01L23/5252H01L2924/0002Y10S257/91Y10S257/926
    • A memory matrix comprises a plurality of word lines, a plurality of bit lines, and a stacked diode and voltage-variable resistor structure interconnecting bit lines to word lines. The stacked diode and voltage-variable resistor structure includes a doped region in a semiconductor substrate defining a work line, a doped polycrystalline silicon layer over said word line and forming a p-n junction therewith, and an amorphized region in the doped polycrystalline silicon layer having increased resistance over the non-amorphized portion of the doped polycrystalline silicon layer. A contact is made to the amorphized polycrystalline silicon material which preferably includes a titanium-tungsten barrier layer and an aluminum layer over the barrier layer. To improve the breakdown voltage of the diode structure, a region of opposite conductivity type is formed in the word line under the doped polycrystalline silicon layer either by out-diffusion of dopants from the polycrystalline silicon layer or by the implantation of dopant ions through the polycrystalline silicon layer into the word line.
    • 存储矩阵包括多个字线,多个位线以及将位线互连到字线的堆叠二极管和电压可变电阻器结构。 层叠二极管和可变电压结构包括在限定工作线的半导体衬底中的掺杂区域,在所述字线上方形成掺杂多晶硅层并与其形成pn结,掺杂多晶硅层中的非晶化区域具有增加的 掺杂多晶硅层非非晶化部分的电阻。 对非晶化多晶硅材料进行接触,其优选在阻挡层上包括钛 - 钨阻挡层和铝层。 为了提高二极管结构的击穿电压,在掺杂多晶硅层下面的字线中形成相反导电类型的区域,通过掺杂剂从多晶硅层的扩散或通过掺杂剂离子注入多晶硅 硅层进入字线。