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1. 发明授权

US08141712B2 Thin wafer insert 有权
标题翻译：薄晶片插入
公开(公告)号：US08141712B2
公开(公告)日：2012-03-27
申请号：US11787082
申请日：2007-04-13
申请人： Brian Wiseman , Michael Peterson , Tony Simpson
发明人： Brian Wiseman , Michael Peterson , Tony Simpson
IPC分类号： B65D85/00
CPC分类号： H01L21/6732 , H01L21/67383 , Y10S206/832
摘要： A plastic insert is configured to provide support of thin wafers in wafer carriers configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the methods of supporting the thin wafers as provided by the insert and the wafer carrier. The inserts, in preferred embodiments, utilize tabs that fit into the side wall recesses and have an interference fit in said recesses to secure the insert in place. In preferred embodiments the inserts have a top surface with a plurality of ribs positioned inwardly from the wafer periphery for supporting the wafers with minimal contact. In preferred embodiments the insert has a lower surface having strengthening structure providing rigidity to the insert. The top surface ribs may preferably be oriented parallel to the insertion and withdrawal direction of the wafers and extend upwardly to position the supported wafer in the slot immediately above the slot defined by the recesses in which the tabs are positioned. Thus, the inserts may be inserted into alternate slots in the carrier. The insert, in preferred embodiments may have an h-shape offering an optimal combination of support of each wafer and precise positioning of the wafer while minimizing the amount of plastic and correspondingly the weight of the insert.
摘要翻译：塑料插入件构造成在晶片载体中提供薄晶片的支撑，其构造成提供外围晶片支撑。本发明包括插入件，与晶片载体组合的插入件以及由插入件和晶片载体提供的支撑薄晶片的方法。在优选实施例中，插入件使用嵌入侧壁凹部中的突出部，并且在所述凹部中具有过盈配合以将插入件固定就位。在优选实施例中，插入件具有顶表面，其具有从晶片周边向内定位的多个肋，用于以最小的接触来支撑晶片。在优选实施例中，插入件具有下表面，该下表面具有为插入件提供刚性的加强结构。顶表面肋可以优选地平行于晶片的插入和退出方向定向并向上延伸，以将受支撑的晶片定位在紧邻由突出部定位的凹槽限定的槽的上方的槽中。因此，插入件可以插入到载体中的交替槽中。在优选实施例中，插入件可以具有h形，其提供每个晶片的支撑的最佳组合以及晶片的精确定位，同时最小化塑料的量并相应地减小插入件的重量。

2. 发明申请

US20110226839A1 JET STACK BRAZING IN A DIFFUSION FURNACE 有权
标题翻译：喷浆机在扩散炉中打浆
公开(公告)号：US20110226839A1
公开(公告)日：2011-09-22
申请号：US13149559
申请日：2011-05-31
申请人： J. Kirk McGlothlan , Christopher Lansing Renfro , Constance Hilliary Texley Jones
发明人： J. Kirk McGlothlan , Christopher Lansing Renfro , Constance Hilliary Texley Jones
IPC分类号： B23K31/12 , B23K31/02
CPC分类号： B23K1/008 , B23K3/087 , Y10S206/832
摘要： A method and apparatus for batch brazing jet stacks in a diffusion furnace. The method may include inserting fusible parts into slots of quartz boats and transporting the quartz boats into an interior of a reaction chamber of a diffusion furnace. An operator may seal the interior of the reaction chamber and an atmosphere of the interior of the reaction chamber may be adjusted according to a brazing recipe. A preheated furnace heating element may be moved toward the reaction chamber to increase a temperature and the fusible parts may be brazed according to the brazing recipe. The furnace heating element may then be moved away from the reaction chamber, the chamber unsealed, and the brazed parts removed.
摘要翻译：一种用于在扩散炉中分批钎焊喷射叠层的方法和装置。该方法可以包括将易熔部件插入石英舟的槽中并将石英舟运送到扩散炉的反应室的内部。操作员可以密封反应室的内部，并且可以根据钎焊配方调节反应室内部的气氛。预热炉加热元件可以朝向反应室移动以增加温度，并且可熔体部分可以根据钎焊配方进行钎焊。然后可以将炉加热元件移离远离反应室，将该室未密封，并且将钎焊的部件移除。

3. 发明申请

US20080185315A9 Integrated circuit wafer packaging system and method 有权
标题翻译：集成电路晶圆封装系统及方法
公开(公告)号：US20080185315A9
公开(公告)日：2008-08-07
申请号：US10859720
申请日：2004-06-03
申请人： Ray Brooks , Timothy Brooks
发明人： Ray Brooks , Timothy Brooks
IPC分类号： B65D85/30
CPC分类号： H01L21/67353 , H01L21/67369 , H01L21/67373 , H01L21/67386 , Y10S206/832
摘要： A packaging system, hereinafter referred to as the Critical Packaging System, relates to critical issues that associate with sensitive articles such as IC wafers before, during and after shipment phases. The system employs a choice of two or more specialty designed containers, and any one selected design having choices of two or more methods by which to avoid, reduce and/or eliminate wafer damage from breakage, scratches and/or corrosion during shipment phases. For the purpose of maximizing product yield during packaging phases a special apparatus is used to insert wafers within containers without scratch damage. The following programs are used in packaging: (1) Quality Assurance/Certification, (2) Critical Factor Monitoring, and (3) a Recycle and Refurbish Program. These programs are specifically designed to achieve new levels of product yields, reduce product cost, and landfill impact.
摘要翻译：包装系统（以下简称“关键包装系统”）涉及与出货阶段之前，之中和之后的敏感物品如IC晶片相关的关键问题。该系统采用两种或更多种专门设计的容器，并且任何一种选择的设计都具有两种或更多种方法的选择，以避免，减少和/或消除在装运阶段期间的破裂，划痕和/或腐蚀造成的晶片损坏。为了在包装阶段最大限度地提高产品产量，使用特殊设备将晶片插入容器内而不会造成伤害。以下程序用于包装：（1）质量保证/认证，（2）关键因素监测和（3）回收和翻新计划。这些计划专门设计用于实现新的产品产量水平，降低产品成本和填埋影响。

4. 发明授权

US07188736B2 Structure for racking substrates 有权
标题翻译：支架底板结构
公开(公告)号：US07188736B2
公开(公告)日：2007-03-13
申请号：US10876711
申请日：2004-06-28
申请人： Lee-Ho Choi
发明人： Lee-Ho Choi
IPC分类号： B65D85/48
CPC分类号： B65G49/062 , H01L21/673 , Y10S206/832 , Y10S414/135
摘要： A structure for racking substrates includes first to fourth main legs isolated from one another at intervals wider than widths of both long sides and both short sides of a substrate, first to fourth protrusions respectively protruded from the first to fourth main legs in a direction of the long sides or the short sides of the substrate, a first side support bar coupled to the first and second protrusions and supporting an edge of one long side or one short side of the substrate, a second side support bar coupled to the third and fourth protrusions and supporting an edge of the other long side or the other short side of the substrate, at least one auxiliary leg disposed between the first and second main legs, or the second and third main legs, or the third and fourth main legs, or the fourth and first main legs, and at least two central support bars coupled to the auxiliary leg, extended parallel to the long sides or the short sides of the substrate, and supporting a central portion of the substrate.
摘要翻译：用于支撑基板的结构包括：第一至第四主支腿，其间隔宽度大于基板的两个长边和两个短边的宽度;第一至第四突起分别从第一至第四主支腿沿着衬底的长边或短边;第一侧支撑杆，其联接到第一和第二突起并且支撑衬底的一个长边或一个短边的边缘;第二侧支撑杆，联接到第三和第四突起并且支撑所述基板的另一个长边或另一个短边的边缘，设置在所述第一和第二主支腿之间的至少一个辅助支腿，或所述第二和第三主支腿或所述第三和第四主支腿，或第四和第一主支腿，以及耦合到辅助支腿的至少两个中心支撑杆，其平行于基板的长边或短边延伸，并且支撑基板的中心部分底物。

5. 发明授权

US07077913B2 Apparatus for fabricating a semiconductor device 有权
公开(公告)号：US07077913B2
公开(公告)日：2006-07-18
申请号：US10345190
申请日：2003-01-16
申请人： Tomoharu Shimada
发明人： Tomoharu Shimada
IPC分类号： H01L21/00 , C23C16/00
CPC分类号： H01L21/67309 , C23C16/4583 , H01L21/67109 , H01L21/68707 , Y10S206/832
摘要： A semiconductor fabricating apparatus having a structure, which facilitates a loading and unloading operation of wafers while having a low effect by a high temperature during a heat treatment. The semiconductor fabricating apparatus includes a plurality of ring-shaped holder having brims and recessed portions, the brims for mounting the to-be-processed wafers thereon, thereby performing the required heat treatment. A tweezer plate of a wafer loading-transferring device is inserted onto the recessed portion or taken out therefrom, and the inserted tweezer plate is ascended or descended, so that the wafer can be inserted on the brims or taken out therefrom.

6. 发明授权

US07022192B2 Semiconductor wafer susceptor 失效
标题翻译：半导体晶圆基座
公开(公告)号：US07022192B2
公开(公告)日：2006-04-04
申请号：US10233483
申请日：2002-09-04
申请人： Anthony Dip , Takanori Saito , Raymond Joe
发明人： Anthony Dip , Takanori Saito , Raymond Joe
IPC分类号： H01L21/00 , C23C16/00
CPC分类号： H01L21/67309 , Y10S206/832
摘要： A semiconductor wafer susceptor for batch substrate processing. The susceptor includes a central region in a primary plane and a plurality of flat annular extensions extending below the central region in a secondary plane. The primary and secondary planes are parallel to each other. An edge of the substrate overhangs the central region allowing no contact of the susceptor with the substrate edge.
摘要翻译：用于批量衬底加工的半导体晶片基座。基座包括主平面中的中心区域和在次平面内在中心区域下方延伸的多个平的环形延伸部。主平面和次平面彼此平行。衬底的边缘突出中心区域，允许基座与衬底边缘不接触。

7. 发明授权

US06905026B2 Wafer carrying system 失效
标题翻译：晶圆承载系统
公开(公告)号：US06905026B2
公开(公告)日：2005-06-14
申请号：US10318663
申请日：2002-12-13
申请人： Chang Chih-Kang
发明人： Chang Chih-Kang
IPC分类号： H01L21/677 , B65D85/30 , B65D85/86
CPC分类号： H01L21/67772 , H01L21/67775 , Y10S206/832
摘要： The purpose of the present invention is to provide a wafer carrying system with a manual-opened cover. The wafer carrying system of the present invention includes a wafer cassette having an opening, a cover disposed on the wafer cassette for covering the opening of the wafer cassette, an opener disposed on the cover for opening the cover, a base for mounting the opener thereon, a separating device connected with the base and the opener, thereby the cover being movable from a shut position to a separated position, a first pivoting device connected to the separating device for pivoting the cover to a first specific position, and a second pivoting device connected to the first pivoting device for pivoting the cover to a second specific position.
摘要翻译：本发明的目的是提供具有手动打开的盖的晶片承载系统。本发明的晶片承载系统包括具有开口的晶片盒，设置在晶片盒上的用于覆盖晶片盒的开口的盖，设置在盖上用于打开盖的开启器，用于在其上安装开启器的基座，与基座和开启器连接的分离装置，从而盖可从关闭位置移动到分离位置;连接到分离装置的第一枢转装置，用于将盖枢转到第一特定位置;以及第二枢转装置连接到第一枢转装置，用于将盖枢转到第二特定位置。

8. 发明授权

US06811040B2 Wafer holding apparatus 有权
标题翻译：晶圆保持装置
公开(公告)号：US06811040B2
公开(公告)日：2004-11-02
申请号：US10191192
申请日：2002-07-09
申请人： Thomas Payne , Jitendra S. Goela , Lee E. Burns , Michael A. Pickering
发明人： Thomas Payne , Jitendra S. Goela , Lee E. Burns , Michael A. Pickering
IPC分类号： A47G1908
CPC分类号： H01L21/67303 , H01L21/67313 , Y10S206/832
摘要： A wafer holding apparatus composed of a plurality of rods joined at opposite ends by endplates. Each rod at each end is secured to the endplates by a mechanical dovetail joint. The dovetail joint secures the rods to the endplates without the need for sealing or coating agents. Also, auxiliary mechanical components such as nuts and bolts to secure the joint components need not be employed to secure the joint. Each rod has multiple grooves or slits for placing multiple semiconductor wafers that are to be processed in processing chambers. The wafer holding apparatus is oxidation resistant, chemical resistant and thermal shock resistant.
摘要翻译：一种晶片保持装置，由多个由端板在相对端连接的杆构成。每个端部的每个杆通过机械燕尾接头固定到端板。燕尾接头将杆固定到端板上，而不需要密封或涂层剂。此外，不需要使用用于固定接头部件的辅助机械部件，例如螺母和螺栓来固定接头。每个杆具有用于放置要在处理室中处理的多个半导体晶片的多个凹槽或狭缝。晶片保持装置抗氧化，耐化学腐蚀和耐热冲击。

9. 发明授权

US06780251B2 Substrate processing apparatus and method for fabricating semiconductor device 失效
标题翻译：基板处理装置及半导体装置的制造方法
公开(公告)号：US06780251B2
公开(公告)日：2004-08-24
申请号：US10196958
申请日：2002-07-18
申请人： Kouji Tometsuka
发明人： Kouji Tometsuka
IPC分类号： H01L2100
CPC分类号： H01L21/68785 , C23C16/4583 , H01L21/67306 , H01L21/67309 , Y10S206/832
摘要： A substrate processing apparatus includes a first holder made of silicon carbide or silicon and a second holder made of quartz. Each of the first and the second holder is of a ring shape and the second ring shaped holder is mounted on the first holder. The second holder is used to mount a substrate thereon while the substrate is being processed.
摘要翻译：基板处理装置包括由碳化硅或硅制成的第一保持器和由石英制成的第二保持器。第一和第二保持器中的每一个都是环形的，第二环形保持器安装在第一保持器上。第二保持器用于在衬底被处理时将衬底安装在其上。

10. 发明授权

US06532642B1 Method of making a silicon carbide rail for use in a semiconductor wafer carrier 失效
标题翻译：制造用于半导体晶片载体的碳化硅轨道的方法
公开(公告)号：US06532642B1
公开(公告)日：2003-03-18
申请号：US09677055
申请日：2000-09-29
申请人： Larry S. Wingo
发明人： Larry S. Wingo
IPC分类号： B23P1304
CPC分类号： H01L21/67309 , Y10S206/832 , Y10S269/902 , Y10S269/904 , Y10S269/909 , Y10S414/135 , Y10S414/141 , Y10T29/49996
摘要： A silicon carbide rail for use as a support in an apparatus for holding semiconductor wafers is made by forming a first series of parallel slots or grooves into the front side of a graphite plate usually without piercing the back side of the plate, converting the slotted graphite plate into a slotted silicon carbide plate, and forming a second series of parallel slots into the back side of the slotted silicon carbide plate such that each slot on the back side connects with a corresponding slot on the front side. The width of each back side slot is less than that of the corresponding front side slot, thereby forming rail teeth having a ledge running along their to top surfaces.
摘要翻译：在用于保持半导体晶片的装置中用作支撑体的碳化硅轨道是通过在石墨板的前侧形成第一系列的平行槽或槽而通常不刺穿板的背面，将开槽的石墨将其制成开槽的碳化硅板，并且在开槽的碳化硅板的后侧形成第二系列的平行槽，使得后侧的每个槽与前侧的相应的槽连接。每个后侧槽的宽度小于相应的前侧槽的宽度，从而形成具有沿其顶部表面延伸的凸缘的轨道齿。

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