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    • 6. 发明授权
    • Method of making lightweight closed-back mirror
    • 制造轻质封闭镜的方法
    • US5741445A
    • 1998-04-21
    • US596021
    • 1996-02-06
    • Raymond L. TaylorMichael A. PickeringLee E. Burns
    • Raymond L. TaylorMichael A. PickeringLee E. Burns
    • G02B5/08H01Q15/14B29D11/00
    • H01Q15/141G02B5/08
    • A method of forming a light weight, closed-back mirror. The mirror is formed as a monolithic construction by the use of chemical vapor deposition techniques. A first deposition forms sheets of the material, which are machined to the proper size to form reinforcing ribs. A sacrificial mandrel is formed with grooves to receive the ribs in their assembled positions. The upper surface of the mandrel is in proximity to the rear edges of the ribs to form a substantially continuous surface. The mandrel and ribs are then subjected to a chemical vapor deposition process which forms a first coating upon the outer face of the mandrel, forming a back plate and side wall. The mandrel is then turned over, and the base is removed by machining to expose the front edges of the ribs. This process leaves islands of mandrel material between the ribs to form a substantially continuous surface. The mandrel and ribs are then subjected to a chemical vapor deposition process. This forms a second coating upon the lower surface of the mandrel, used as the mirror face. To reduce weight, holes are drilled through the back plate, and the remaining, encapsulated, mandrel material is removed by oxidation.
    • 一种形成轻质封闭式后视镜的方法。 反射镜通过使用化学气相沉积技术形成为整体结构。 首先沉积形成材料片材,其被加工成适当的尺寸以形成加强肋。 牺牲心轴形成有凹槽以在其组装位置接收肋。 心轴的上表面靠近肋的后边缘以形成基本连续的表面。 然后将心轴和肋条进行化学气相沉积工艺,其在心轴的外表面上形成第一涂层,形成背板和侧壁。 然后将心轴翻转,并且通过机械加工去除基底以露出肋的前边缘。 该工艺在肋之间留下芯棒材料岛以形成基本连续的表面。 然后对心轴和肋进行化学气相沉积工艺。 这在心轴的下表面上形成第二涂层,用作镜面。 为了减轻重量,通过后板钻出孔,并且通过氧化除去剩余的封装的心轴材料。
    • 7. 发明授权
    • Bonding of silicon carbide components
    • 碳化硅部件的粘接
    • US5683028A
    • 1997-11-04
    • US646737
    • 1996-05-03
    • Jitendra S. GoelaLee E. Burns
    • Jitendra S. GoelaLee E. Burns
    • B23K1/19C04B37/00H01L21/683B23K103/16B23K31/00
    • C04B37/005B23K1/19C04B2235/6586C04B2237/083C04B2237/16C04B2237/365C04B2237/708C04B2237/72C04B2237/84C04B2237/88
    • A method of bonding a first silicon carbide part to a second silicon carbide part is provided. The first silicon carbide part provides a receiving female joint member and the second silicon carbide part provides an insertion male joint member. The male and female members each have facing sidewalls substantially parallel to a direction in which the male member is inserted into the female member. The male and female joint members are configured to provide an average gap(s) between the facing sidewalls of the joint members which is up to about 0.003 inch (0.76 mm). The female joint member further has reservoir means for containing silicon when the male joint member is fully inserted into the female joint member, the reservoir means being in fluid communication with the gap(s). The reservoir means is filled with solid-state silicon, e.g., in powder form. The male joint member is inserted into the female joint member, and the first and second silicon carbide parts are heated to above the melting point of silicon for a time sufficient for the silicon to melt, whereupon molten silicon is drawn into the gap(s) between the facing sidewalls of the male and female joint members by capillary action. Subsequent cooling of the assembled parts solidifies the silicon, thereby securing the joint between the male and female members with solidified silicon forming a bond between the facing sidewalls of the male and female joint members.
    • 提供了将第一碳化硅部分接合到第二碳化硅部分的方法。 第一碳化硅部分提供接收阴接头构件,第二碳化硅部分提供插入阳接头构件。 阳构件和阴构件各自具有基本平行于阳构件插入阴构件的方向的面向侧壁。 公接头构件和阴接头构件构造成在接合构件的相对侧壁之间提供高达约0.003英寸(0.76mm)的平均间隙。 阴接头构件还具有用于在阳接头构件完全插入阴接头构件时容纳硅的储存装置,储存装置与间隙流体连通。 储存装置填充有例如粉末形式的固态硅。 将阳接头构件插入阴接头构件中,并将第一和第二碳化硅部件加热至高于硅的熔点足以使硅熔化的时间,然后将熔融硅吸入间隙中, 通过毛细管作用在雄性和雌性关节成员的面对侧壁之间。 随后的组装部件的冷却使硅固化,从而通过凝固硅固定阳构件和阴构件之间的接头,从而在阳接头和阴接头构件的相对的侧壁之间形成结合。
    • 8. 发明授权
    • Susceptor for semiconductor wafer processing
    • 用于半导体晶圆处理的受体
    • US5584936A
    • 1996-12-17
    • US572479
    • 1995-12-14
    • Michael A. PickeringLee E. Burns
    • Michael A. PickeringLee E. Burns
    • C23C16/44C23C16/458C30B25/12C30B31/14H01L21/205H01L21/683C23C16/00
    • C30B31/14C23C16/4583C30B25/12
    • A susceptor for rapid thermal processing for epitaxial deposition upon semiconductor wafers. The susceptor includes an outer supporting ring upon which the wafer rests. This outer ring is preferably formed of a monolithic mass of silicon carbide, and most preferably high purity .beta.-phase (face-centered cubic) silicon carbide. The wafer is supported upon a small wafer shoulder on the ring. To prevent deposition upon the rear or bottom face of the wafer, a blocker shoulder is also provided in the ring, below the wafer shoulder, and a blocker is placed upon this shoulder. The blocker is preferably formed of quartz, and simply rests upon the shoulder. In this manner the ring and blocker may expand at different rates upon the rapid temperature changes, and the blocker or ring may be replaced.
    • 用于快速热处理的基座,用于在半导体晶片上进行外延沉积。 基座包括外部支撑环,晶片搁置在该外部支撑环上。 该外环优选由碳化硅的整体块,最优选高纯度β相(面心立方)碳化硅形成。 晶片被支撑在环上的小晶片肩上。 为了防止沉积在晶片的后表面或底面上,在环中还设置有阻挡肩,在晶片肩部下方,并且阻挡器被放置在该肩部上。 阻塞剂优选由石英形成,并且仅仅靠在肩部上。 以这种方式,环和阻挡剂可以在快速温度变化时以不同的速率膨胀,并且可以更换阻滞剂或环。