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    • 3. 发明申请
    • LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM
    • 液体冷却电子系统
    • US20130081790A1
    • 2013-04-04
    • US13688832
    • 2012-11-29
    • Liquidcool Solutions, Inc.
    • Lyle R. TUFTYLaurent A. REGIMBALChad D. ATTLESEY
    • F28D1/02
    • G06F1/20F28D1/02F28D1/0206F28D15/02F28F9/007G06F2200/201H01L23/473H01L2924/0002H05K5/067H05K7/20218H05K7/20236H05K7/20772H01L2924/00
    • A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
    • 一种液体淹没冷却系统,其适用于使用连接到支架系统的多个壳体来并行地冷却多个电子装置。 该系统冷却服务器计算机和其他使用电子,发热组件并且并联系统连接的设备中的发热组件。 该系统包括具有内部空间的壳体,内部空间中的介电冷却液体,设置在该空间内并浸没在电介质冷却液体中的发热电子部件。 机架系统包含一个歧管系统,用于接合并允许多个箱体和IO连接器的液体传输,可与多个箱体/电子设备电气接合。 机架系统可以连接到泵系统,用于将液体进出机架,从外部热交换器,热泵或其他散热/恢复装置抽出。