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1. 发明申请

US20130081790A1 LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM 有权
标题翻译：液体冷却电子系统
公开(公告)号：US20130081790A1
公开(公告)日：2013-04-04
申请号：US13688832
申请日：2012-11-29
申请人： Liquidcool Solutions, Inc.
发明人： Lyle R. TUFTY , Laurent A. REGIMBAL , Chad D. ATTLESEY
IPC分类号： F28D1/02
CPC分类号： G06F1/20 , F28D1/02 , F28D1/0206 , F28D15/02 , F28F9/007 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H05K5/067 , H05K7/20218 , H05K7/20236 , H05K7/20772 , H01L2924/00
摘要： A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
摘要翻译：一种液体淹没冷却系统，其适用于使用连接到支架系统的多个壳体来并行地冷却多个电子装置。该系统冷却服务器计算机和其他使用电子，发热组件并且并联系统连接的设备中的发热组件。该系统包括具有内部空间的壳体，内部空间中的介电冷却液体，设置在该空间内并浸没在电介质冷却液体中的发热电子部件。机架系统包含一个歧管系统，用于接合并允许多个箱体和IO连接器的液体传输，可与多个箱体/电子设备电气接合。机架系统可以连接到泵系统，用于将液体进出机架，从外部热交换器，热泵或其他散热/恢复装置抽出。

2. 发明申请

US20130083479A1 RACK MOUNTED LIQUID SUBMERSION COOLED ELECTRONIC SYSTEM 有权
标题翻译：机架安装液体冷却电子系统
公开(公告)号：US20130083479A1
公开(公告)日：2013-04-04
申请号：US13688815
申请日：2012-11-29
申请人： Liquidcool Solutions, Inc.
发明人： Lyle R. TUFTY , Laurent A. REGIMBAL , Chad D. ATTLESEY
IPC分类号： H05K7/20 , G06F1/20 , F28F9/007
CPC分类号： G06F1/20 , F28D1/02 , F28D1/0206 , F28D15/02 , F28F9/007 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H05K5/067 , H05K7/20218 , H05K7/20236 , H05K7/20772 , H01L2924/00
摘要： A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
摘要翻译：一种液体淹没冷却系统，其适用于使用连接到支架系统的多个壳体来并行地冷却多个电子装置。该系统冷却服务器计算机和其他使用电子，发热组件并且并联系统连接的设备中的发热组件。该系统包括具有内部空间的壳体，内部空间中的介电冷却液体，设置在该空间内并浸没在电介质冷却液体中的发热电子部件。机架系统包含一个歧管系统，用于接合并允许多个箱体和IO连接器的液体传输，可与多个箱体/电子设备电气接合。机架系统可以连接到泵系统，用于将液体进出机架，从外部热交换器，热泵或其他散热/恢复装置抽出。

3. 发明申请

US20130094146A1 LIQUID SUBMERSION COOLED NETWORK ELECTRONICS 有权
标题翻译：液体冷却网络电子
公开(公告)号：US20130094146A1
公开(公告)日：2013-04-18
申请号：US13688877
申请日：2012-11-29
申请人： LIQUIDCOOL SOLUTIONS, INC.
发明人： Lyle R. TUFTY , Laurent A. REGIMBAL , Chad D. ATTLESEY
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , F28D1/02 , F28D1/0206 , F28D15/02 , F28F9/007 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H05K5/067 , H05K7/20218 , H05K7/20236 , H05K7/20772 , H01L2924/00
摘要： A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
摘要翻译：一种液体淹没冷却系统，其适用于使用连接到支架系统的多个壳体来并行地冷却多个电子装置。该系统冷却服务器计算机和其他使用电子，发热组件并且并联系统连接的设备中的发热组件。该系统包括具有内部空间的壳体，内部空间中的介电冷却液体，设置在该空间内并浸没在电介质冷却液体中的发热电子部件。机架系统包含一个歧管系统，用于接合并允许多个箱体和IO连接器的液体传输，可与多个箱体/电子设备电气接合。机架系统可以连接到泵系统，用于将液体进出机架，从外部热交换器，热泵或其他散热/恢复装置抽出。

4. 发明申请

US20130081792A1 LIQUID SUBMERSION COOLED POWER SUPPLY SYSTEM 有权
标题翻译：液体冷却电源系统
公开(公告)号：US20130081792A1
公开(公告)日：2013-04-04
申请号：US13688872
申请日：2012-11-29
申请人： LIQUIDCOOL SOLUTIONS, INC.
发明人： Lyle R. TUFTY , Laurent A. REGIMBAL , Chad D. ATTLESEY
IPC分类号： F28D15/02
CPC分类号： G06F1/20 , F28D1/02 , F28D1/0206 , F28D15/02 , F28F9/007 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H05K5/067 , H05K7/20218 , H05K7/20236 , H05K7/20772 , H01L2924/00
摘要： A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
摘要翻译：一种液体淹没冷却系统，其适用于使用连接到支架系统的多个壳体来并行地冷却多个电子装置。该系统冷却服务器计算机和其他使用电子，发热组件并且并联系统连接的设备中的发热组件。该系统包括具有内部空间的壳体，内部空间中的介电冷却液体，设置在该空间内并浸没在电介质冷却液体中的发热电子部件。机架系统包含一个歧管系统，用于接合并允许多个箱体和IO连接器的液体传输，可与多个箱体/电子设备电气接合。机架系统可以连接到泵系统，用于将液体进出机架，从外部热交换器，热泵或其他散热/恢复装置抽出。

5. 发明申请

US20130081791A1 LIQUID SUBMERSION COOLED DATA STORAGE OR MEMORY SYSTEM 有权
标题翻译：液体冷却数据存储或存储系统
公开(公告)号：US20130081791A1
公开(公告)日：2013-04-04
申请号：US13688861
申请日：2012-11-29
申请人： Liquidcool Solutions, Inc.
发明人： Lyle R. TUFTY , Laurent A. REGIMBAL , Chad D. ATTLESEY
IPC分类号： F28D1/02
CPC分类号： G06F1/20 , F28D1/02 , F28D1/0206 , F28D15/02 , F28F9/007 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H05K5/067 , H05K7/20218 , H05K7/20236 , H05K7/20772 , H01L2924/00
摘要： A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
摘要翻译：一种液体淹没冷却系统，其适用于使用连接到支架系统的多个壳体来并行地冷却多个电子装置。该系统冷却服务器计算机和其他使用电子，发热组件并且并联系统连接的设备中的发热组件。该系统包括具有内部空间的壳体，内部空间中的介电冷却液体，设置在该空间内并浸没在电介质冷却液体中的发热电子部件。机架系统包含一个歧管系统，用于接合并允许多个箱体和IO连接器的液体传输，可与多个箱体/电子设备电气接合。机架系统可以连接到泵系统，用于将液体进出机架，从外部热交换器，热泵或其他散热/恢复装置抽出。

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