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1. 发明申请

US20170339789A1 SEMICONDUCTOR DEVICE AND MOTOR APPARATUS 审中-公开
公开(公告)号：US20170339789A1
公开(公告)日：2017-11-23
申请号：US15581864
申请日：2017-04-28
申请人： JTEKT CORPORATION
发明人： Yuto SATO
IPC分类号： H05K1/18 , H05K1/02 , H02K11/33
CPC分类号： H05K1/18 , B62D5/0406 , H01L23/3677 , H01L23/4006 , H01L25/072 , H01L2023/4025 , H01L2023/4062 , H01L2023/4087 , H01L2224/40137 , H02K11/33 , H02K2211/03 , H05K1/0203 , H05K7/20454 , H05K7/209
摘要： A semiconductor device is provided that allows an IC chip and a heat sink to be prevented from being short-circuited even if facing surfaces of the IC chip and the heat sink are located closest to each other due to manufacturing variations and other variations. A controller for a motor apparatus includes a substrate on which MOSFETs are mounted and a heat sink provided facing the substrate and the MOSFETs so as to dissipate heat generated by the MOSFETs. Insulating portions are each provided on a facing surface of each MOSFETs. Protruding portions are each provided on a facing surface of the heat sink so as to protrude from the heat sink toward the insulating portion of the corresponding MOSFET. A second clearance smaller than the first clearance is formed between each of the insulating portions and the corresponding protruding portion.

2. 发明申请

US20140231869A1 Silicon Devices/Heatsinks Stack Assembly And A Method To Pull Apart A Faulty Silicon Device In Said Stack Assembly 有权
标题翻译：硅器件/散热器堆叠组件以及在所述堆叠组件中拉出故障硅器件的方法
公开(公告)号：US20140231869A1
公开(公告)日：2014-08-21
申请号：US13772296
申请日：2013-02-20
申请人： ALSTOM TECHNOLOGY LTD
发明人： Roman Raubo , Marek Furyk , John Schwartzenberg
IPC分类号： H01L23/58
CPC分类号： H01L23/58 , H01L23/40 , H01L23/4012 , H01L23/46 , H01L23/48 , H01L25/117 , H01L2023/4025 , H01L2924/0002 , H01L2924/00
摘要： The invention concerns a silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly. Said silicon devices/heatsinks stack assembly comprises an arrangement of many silicon devices disks, two adjacent silicon devices disks being separated by a flat heatsink device, each silicon device disk and each heatsink comprising a centering hole on its both faces, a centering pin placed between the adjacent centering holes of a silicon device disk and an adjacent heatsink device. Each heatsink device is pierced with two guide holes, at two opposite ends of this one.
摘要翻译：本发明涉及硅器件/散热器堆叠组件以及在所述堆叠组件中拉开故障硅器件的方法。所述硅器件/散热器堆叠组件包括许多硅器件盘的布置，两个相邻的硅器件盘由平坦的散热器器件隔开，每个硅器件盘和每个散热器在其两个面上包括定中心孔，硅器件盘的相邻定心孔和相邻的散热装置。每个散热装置穿过两个导孔，在这两个相对的两端。

3. 发明授权

US4965658A System for mounting and cooling power semiconductor devices 失效
标题翻译：用于安装和冷却功率半导体器件的系统
公开(公告)号：US4965658A
公开(公告)日：1990-10-23
申请号：US291780
申请日：1988-12-29
申请人： Dean K. Norbeck , Harold R. Schnetzka, II
发明人： Dean K. Norbeck , Harold R. Schnetzka, II
IPC分类号： H01L25/10 , H01L21/52 , H01L21/66 , H01L23/40 , H01L25/11
CPC分类号： H01L23/4006 , H01L25/115 , H01L2023/4025 , H01L2023/4043 , H01L2924/0002 , H01L2924/12044
摘要： Semiconductor apparatus for mounting and cooling disc type semiconductor devices. The apparatus includes two disc type semiconductor devices each having a pole face thereof in contact with a first terminal bar, that bar in turn being in contact, through thermally conductive electrical insulation, with a water-cooled plate. The opposite pole face of each disc device is in electrical and thermal contact with a first surface of a respective metallic block. A second surface of each block, opposing the first face, is in electrical conductive contact with a second terminal bar. A compressive mounting force is applied across the first and second terminal bars to appropriately compress the disc devices. Each metallic block is sized to absorb a substantial portion of the disc device junction heat generated during a transient portion of a duty cycle, such as may correspond to the starting of a motor.

4. 发明授权

US4739447A Mounting and connection device for power semi-conductors 失效
标题翻译：电力半导体的安装和连接装置
公开(公告)号：US4739447A
公开(公告)日：1988-04-19
申请号：US783380
申请日：1985-09-25
申请人： Rene Lecomte
发明人： Rene Lecomte
IPC分类号： H01L23/40 , H01L25/11 , H05K7/20
CPC分类号： H01L25/115 , H01L23/4006 , H01L2023/4025 , H01L2023/405 , H01L2924/0002
摘要： The device comprises a sink (12) and a clamping devicew (17, 18) associated to each semiconductor component (15, 16) for applying the latter to the sink (12). The clamping device bears on one hand on the sink (12) and on the other hand on the semi-conductor (15, 16) through a laminated connection bar (20) to present, length-wise and from a clamping range (23) on a fixed support (10), a flexibility enabling the bar (20) to be applied to bearing ranges of semi-conductor components having different heights. The device may be used for variable height power semi-conductors.
摘要翻译： PCT No.PCT / FR85 / 00007 Sec。 371日期：1985年9月23日 102（e）1985年9月23日PCT 1985年1月15日PCT PCT。公开号WO85 / 03385 日期为1985年8月1日。该装置包括与每个半导体部件（15,16）相关联的吸收器（12）和夹紧装置（17,18），用于将后者施加到吸收器（12）。夹紧装置一方面承载在水槽（12）上，另一方面通过层压连接杆（20）承载在半导体（15,16）上，以沿纵向和从夹紧范围（23）呈现，在固定支撑件（10）上，具有使杆（20）能够应用于具有不同高度的半导体部件的轴承范围的灵活性。该装置可用于可变高度功率半导体。

5. 发明授权

US4694322A Press-packed semiconductor device 失效
标题翻译：新兴的半导体装置
公开(公告)号：US4694322A
公开(公告)日：1987-09-15
申请号：US650107
申请日：1984-09-13
申请人： Hiroshi Sakurai , Masami Iwasaki
发明人： Hiroshi Sakurai , Masami Iwasaki
IPC分类号： H01L23/40 , H01L23/48 , H01L25/07 , H01L23/02 , H01L21/447 , H01L23/44 , H01L25/04
CPC分类号： H01L23/4006 , H01L23/40 , H01L24/72 , H01L25/072 , H01L2023/4025 , H01L2023/4081 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/1301 , H01L2924/15787
摘要： A common insulation plate is provided on a heat-discharging support member, and a plurality of press-packed semiconductor elements is provided on the common insulation plate. These semiconductor elements are coupled to electrodes which form a common electrode by a plurality of spring mechanisms. An internal connection terminal is slidably provided at each of the electrodes and is bent perpendicular to a pressing surface. Each of the internal connection terminals faces the adjacent one. After the electrodes are pressed against the respective semiconductor elements with adjustment, the internal connection terminals are electrically coupled together.
摘要翻译：在散热支撑构件上设置有共同的绝缘板，并且在公共绝缘板上设置多个压制半导体元件。这些半导体元件通过多个弹簧机构耦合到形成公共电极的电极。内部连接端子可滑动地设置在每个电极上并且垂直于按压表面弯曲。每个内部连接端子面向相邻的一个。在调整电极被压靠在各个半导体元件上之后，内部连接端子电耦合在一起。

6. 发明授权

US4403242A Semiconductor device having a metal-fiber composite material electrode 失效
标题翻译：具有金属纤维复合材料电极的半导体装置
公开(公告)号：US4403242A
公开(公告)日：1983-09-06
申请号：US154470
申请日：1980-05-29
申请人： Masao Tsuruoka
发明人： Masao Tsuruoka
IPC分类号： H01L21/52 , H01L21/58 , H01L23/051 , H01L23/32 , H01L23/40 , H01L23/492 , H01L23/48 , H01L29/52
CPC分类号： H01L24/83 , H01L23/051 , H01L23/32 , H01L23/4006 , H01L23/4928 , H01L24/33 , H01L2023/4025 , H01L2224/2919 , H01L2224/48463 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1301 , H01L2924/351
摘要： A semiconductor device using a metal-fiber composite material as an electrode is disclosed. A semiconductor substrate may be a thyristor substrate of a center gate structure and a cathode electrode comprises a lower piece made of copper matrix-carbon fiber composite material which is ohmic-contacted to an n-emitter layer, and an upper piece made of copper which contacts the lower piece. The lower piece has an opening to allow the passage of a gate lead through it while the upper piece has a channel which leads to the lower piece and through which the gate lead extends. The semiconductor substrate is molded by epoxy resin extending from an anode electrode to a cathode electrode.
摘要翻译：公开了一种使用金属纤维复合材料作为电极的半导体器件。半导体衬底可以是中心栅极结构的晶闸管衬底，并且阴极包括由与n发射极层欧姆接触的铜基体 - 碳纤维复合材料制成的下部件和由铜制成的上部件接触较低的部分。下部件具有开口以允许栅极引线通过它，而上部件具有通向下部件的通道，并且栅极引线延伸穿过该通道。半导体衬底由从阳极电极延伸到阴极电极的环氧树脂模制。

7. 发明授权

US4125252A Power semiconductor assembly and the method and apparatus for assembly thereof 失效
标题翻译：功率半导体组件及其组装方法和装置
公开(公告)号：US4125252A
公开(公告)日：1978-11-14
申请号：US789521
申请日：1977-04-21
申请人： Robert Jouanny
发明人： Robert Jouanny
IPC分类号： H01L23/40 , H01L23/48 , B23Q3/08
CPC分类号： H01L23/4006 , H01L24/72 , H01L2023/4025 , H01L2023/4081 , H01L2924/01013 , H01L2924/0106 , H01L2924/1301 , Y10T29/41
摘要： A power semiconductor assembly in which two metallic heat sinks with inner planar surfaces clamp between these surfaces a housing of a power semiconductor therein at a set clamping pressure. The casing has planar surfaces against which the inner planar surfaces of the heat sinks are clamped. Three threaded rod assemblies are assembled in three sets of recesses on the heat sinks controlling the pressure applied to the semiconductor assembly. Each heat sink has three recesses communicating with outer surfaces thereof aligned axially with corresponding similar recesses of the other heat sink. The rod assemblies each have a pair of threaded rods joined coaxially by a molded element made of, for example, porcelain, or a resin epoxy such as "Araldite", or a mica-glass composition. Nuts are threaded on the two rods and a calibrated elastic washer on one rod hold the entire assembly at the desired clamping pressure. The power semiconductor assembly is assembled in a press in which the heat sinks with the semiconductor clamped therebetween are compressed to a given level and then the nuts of the rod assemblies tightened and the pressure of the press released so that the rod assemblies relax to the desired clamping pressure desired to be applied to the housing between the heat sinks.
摘要翻译：功率半导体组件，其中具有内平面表面的两个金属散热器在设定的夹紧压力下将功率半导体的壳体夹在这些表面之间。壳体具有平坦的表面，散热片的内平面被夹住。三个螺纹杆组件组装在散热器上的三组凹槽中，以控制施加到半导体组件的压力。每个散热器具有与其外表面连通的三个凹槽，其轴向与另一个散热器的相应类似的凹部对准。杆组件各自具有由例如由瓷制成的模制元件或诸如“Araldite”的树脂环氧树脂或云母玻璃组合物同轴地连接的一对螺杆。螺母穿在两根杆上，一根杆上的校准弹性垫圈将整个组件保持在所需的夹紧压力。功率半导体组件组装在压机中，其中夹在其间的半导体的散热器被压缩到给定的水平，然后将杆组件的螺母拧紧，并且压力机的压力被释放，使得杆组件松弛到期望的希望在散热器之间施加到壳体的夹紧压力。

8. 发明授权

US4067042A Heat sink mechanism hydraulically propelled into contact with semiconductor devices 失效
标题翻译：液压驱动器与半导体器件接触的散热机构
公开(公告)号：US4067042A
公开(公告)日：1978-01-03
申请号：US721377
申请日：1976-09-08
申请人： Petr Novak , Michal Pellant , Pavel Reichel
发明人： Petr Novak , Michal Pellant , Pavel Reichel
IPC分类号： H01L23/40 , H01L23/427 , H01L23/473 , H01L25/04 , H01L23/48 , H01L29/40
CPC分类号： H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4025 , H01L2924/0002
摘要： An arrangement including a hydraulic chamber for simultaneously regulating the contact pressure on a plurality of heat sinks associated with planar semiconductor devices to be cooled is described. A corresponding plurality of elongated rods coupled at their outer ends to one surface of each of the heat sinks extend outwardly through aligned holes in a boundary wall of the chamber. A plunger or other suitable device extends into the chamber through a second opening therein to vary the pressure on the compressible medium and thereby to urge the heat sinks against the associated semiconductive elements with a uniform pressure. Facilities are provided for electrically deactivating the semiconductive elements when the pressure within the chamber falls below a predetermined value.
摘要翻译：描述了包括用于同时调节与待冷却的平面半导体器件相关联的多个散热器上的接触压力的液压室的布置。在其外端处耦合到每个散热器的一个表面的对应的多个细长杆通过在腔室的边界壁中的对准的孔向外延伸。柱塞或其它合适的装置通过其中的第二开口延伸到腔室中以改变可压缩介质上的压力，从而以均匀的压力推动散热器抵靠相关联的半导体元件。设置用于当室内的压力下降到预定值以下时，使半导体元件电动停用。

9. 发明授权

US3972063A Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope 失效
标题翻译：封装在具有用于将所述装置保持在所述封套内的压缩机构的封套中的蒸气冷却的半导体器件
公开(公告)号：US3972063A
公开(公告)日：1976-07-27
申请号：US513924
申请日：1974-10-10
申请人： Yoshio Kimura , Hiroshi Mitsuoka , Isamu Hosono
发明人： Yoshio Kimura , Hiroshi Mitsuoka , Isamu Hosono
IPC分类号： H01L23/40 , H01L23/427 , H01L23/48 , H01L25/04 , H01L23/42 , H01L23/44 , H01L23/46
CPC分类号： H01L23/427 , H01L23/4006 , H01L24/72 , H01L2023/4025 , H01L2023/4081 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082
摘要： A stack including a semiconductor element and the associated components is held within a lower portion of a hermetic envelope between its side wall and a closure block movably secured to its opposite side wall to close an opening on the latter and is immersed into a cooling liquid boilable adjacent the operating temperature of the semiconductor element. A pressing plate fixed to the opposite side wall resiliently presses the closure block to apply a compressible contact force to the semiconductor element. The stack may be sandwiched between two closure blocks closing the opposite opening on the bilateral walls of the lower envelope portion and pressed toward each other by two spherical segment of resilient material arranged back-to-back. Alternatively the stack may be carried between the bilateral envelope walls through a resilient spherical segment.
摘要翻译：包括半导体元件和相关部件的堆叠被保持在其侧壁和可移动地固定到其相对侧壁的封闭块之间的密封外壳的下部，以封闭其上的开口并且被浸入冷却液体可煮沸邻近半导体元件的工作温度。固定到相对侧壁的按压板弹性地按压封闭块，以对半导体元件施加可压缩的接触力。堆叠可以夹在两个闭合块之间，封闭块封闭下部信封部分的双侧壁上的相对的开口，并通过背对背布置的两个弹性材料的球形部分彼此挤压。或者，堆叠可以通过弹性球形段在双向包络壁之间承载。

10. 发明授权

US3867003A Semi-conductor clamping means 失效
标题翻译：半导体夹紧装置
公开(公告)号：US3867003A
公开(公告)日：1975-02-18
申请号：US36515073
申请日：1973-05-30
申请人： CABLEFORM LTD
发明人： MORTON JOHN , STEVENS KEITH DRUMMOND , THEXTON GRAHAM SPENCER
IPC分类号： H01L23/40 , H01L23/48 , H01R13/54
CPC分类号： H01L23/4006 , H01L24/72 , H01L2023/4025 , H01L2023/4081 , H01L2023/4087 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01075 , H01L2924/1301 , H01L2924/3011 , H01L2924/00
摘要： A clamping means for clamping a semi-conductor device between two heat sink clamping pieces, comprise a plurality of bolts holding the clamping pieces together through the intermediary of a plurality of disc spring washers and insulation pieces, the disc spring washers having a saturation characteristic such that above a certain deflection further deflection does little to increase the spring force.
摘要翻译：用于将半导体器件夹紧在两个散热片夹持件之间的夹持装置包括多个螺栓，其通过多个碟形弹簧垫圈和绝缘件将夹紧件夹在一起，碟形弹簧垫圈具有饱和特性，如在一定偏转之后，进一步的偏转对增加弹簧力几乎没有作用。

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