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    • 10. 发明申请
    • Method of Forming Electronic Circuit
    • 电子电路形成方法
    • US20110284496A1
    • 2011-11-24
    • US13141753
    • 2009-12-22
    • Keisuke YamanishiKengo KaminagaRyo Fukuchi
    • Keisuke YamanishiKengo KaminagaRyo Fukuchi
    • H05K3/00
    • C23F1/02B32B15/08B32B15/20B32B2307/406B32B2307/50B32B2307/732B32B2457/08C23C22/05C23F1/14C25D3/562C25D5/022C25D5/12C25D5/48C25D7/0614H05K3/06H05K3/067H05K3/384H05K2201/0338H05K2201/0355H05K2203/0723
    • Provided is a method of forming an electronic circuit, wherein a nickel or nickel alloy layer is formed on an etching side of a rolled copper foil or an electrolytic copper foil, the rolled copper foil or the electrolytic copper foil is bonded to a resin substrate to obtain a copper-clad laminate, a resist pattern for forming a circuit is subsequently applied on the copper foil, any unwanted portion of the copper foil and the nickel or nickel alloy layer of the copper-clad laminate other than the portion to which the resist pattern was applied is removed using an etching solution of an aqueous ferric chloride, the resist is further removed, and soft etching is additionally performed in order to remove the remnant nickel or nickel alloy layer and thereby form a circuit in which the space between copper circuit lines is of a width that is double or more from the thickness of copper. This invention aims to form a circuit with a uniform circuit width, improve the etching properties in pattern etching, and prevent the occurrence of short circuits and defects in the circuit width.
    • 提供一种形成电子电路的方法,其中在轧制的铜箔或电解铜箔的蚀刻侧上形成镍或镍合金层,将轧制的铜箔或电解铜箔结合到树脂基板上 得到覆铜层压板,随后在铜箔上涂覆用于形成电路的抗蚀剂图案,铜箔的不需要部分和覆铜层压板的镍或镍合金层除了抗蚀剂的部分 使用氯化铁水溶液的蚀刻溶液除去图案,进一步除去抗蚀剂,另外进行软蚀刻以除去残留的镍或镍合金层,从而形成电路,其中铜电路 线的宽度是铜的厚度的两倍或更多。 本发明旨在形成具有均匀电路宽度的电路,提高图案蚀刻中的蚀刻性能,并且防止电路宽度中的短路和缺陷的发生。