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1. 发明申请

US20230116303A1 METAL MATERIAL, CONNECTION TERMINAL, AND METHOD FOR PRODUCING METAL MATERIAL 有权
公开(公告)号：US20230116303A1
公开(公告)日：2023-04-13
申请号：US17909606
申请日：2021-03-03
申请人： AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Ryo KEMMOTSU , Kingo FURUKAWA
IPC分类号： H01B1/02 , H01R13/03 , H01B13/00 , C25D5/12 , C25D5/50
摘要： Provided is a metal material including a substrate and an Ag—Sn covering layer that covers a surface of the substrate, in which the Ag—Sn covering layer contains Ag and Sn and has an Ag—Sn alloy exposed on a surface thereof, and an average crystal grain size in a cross section in parallel with a surface of the Ag—Sn covering layer is less than 0.28 μm. Provided is also a metal material, produced by forming a metal layer including Ag and Sn, on a surface of a substrate, and heating the resultant at a temperature equal to or more than the melting point of Sn, and including an Ag—Sn covering layer containing Ag and Sn and having an Ag—Sn alloy exposed on a surface thereof, on the surface of the substrate.

2. 发明申请

US20230072743A1 Ni-PLATED STEEL SHEET AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20230072743A1
公开(公告)日：2023-03-09
申请号：US17796643
申请日：2021-03-01
申请人： NIPPON STEEL CORPORATION
发明人： Yasuto GOTO , Kiyokazu ISHIZUKA , Tatsuo NAGATA , Katsumasa MATSUMOTO
IPC分类号： B32B15/01 , C22C19/03 , C25D3/56 , C25D5/50
摘要： A Ni-plated steel sheet according to one aspect of the present invention includes a base steel sheet; and a Ni plating layer provided on a surface of the base steel sheet, wherein the Ni plating layer includes a Ni—Fe alloy layer formed on the surface of the base steel sheet, and a ratio of a Sn content to a Ni content in the Ni plating layer is 0.0005% to 0.10%.

3. 发明授权

US11598009B2 Sn-plated steel sheet and method for manufacturing Sn-plated steel sheet 有权
公开(公告)号：US11598009B2
公开(公告)日：2023-03-07
申请号：US16975637
申请日：2019-03-01
申请人： NIPPON STEEL CORPORATION
发明人： Shintaro Yamanaka , Masakazu Noda , Yasuhiko Sato , Nobuo Nakasone
IPC分类号： B32B15/01 , C23C28/00 , C25D9/10 , C25D5/50 , C25D9/00 , C25D9/08 , C25D5/48 , C23C22/36 , B32B15/04 , C23C22/05 , C23C30/00 , B32B15/18 , C25D3/30 , C23C22/34 , C25D5/36
摘要： A Sn-plated steel sheet including a base plated steel sheet having a steel sheet, a Sn-plated layer on at least one surface of the steel sheet, and a film layer containing a zirconium oxide and a tin oxide. An adhesion amount of Sn per surface of the Sn-plated steel sheet is 0.1 g/m2 or more and 15 g/m2 or less, an amount of the zirconium oxide in the film layer is in a range of 1 mg/m2 or more and 30 mg/m2 or less in terms of an amount of metal Zr, a peak position of a binding energy of Sn3d5/2 of the tin oxide is 1.4 eV or more and less than 1.6 eV from a peak position of a binding energy of metal Sn, and a quantity of electricity required for reduction of the tin oxide is more than 5.0 mC/cm2 and 20 mC/cm2 or less.

4. 发明申请

US20230047624A1 METHODS OF FORMING A METAL COATED ARTICLE 有权
公开(公告)号：US20230047624A1
公开(公告)日：2023-02-16
申请号：US17813920
申请日：2022-07-20
申请人： Battelle Energy Alliance, LLC
发明人： Prabhat K. Tripathy
IPC分类号： C25D3/66 , C25D5/50 , C25D5/10 , C25D11/00
摘要： A method of forming a metal coated article, comprises forming a metal halide in a molten salt plating bath at a first temperature, wherein forming the metal halide in the molten salt further comprises forming at least one functional metal halide electrolyte; and forming at least two auxiliary metal halide electrolytes at eutectic conditions; increasing the first temperature to a second temperature; forming a plated metal coating from the at least one functional metal halide electrolyte, onto a thermally conductive substrate; and introducing at least one of deuterium and tritium into the plated metal coating.

5. 发明授权

US11542606B2 Method of tin-plating copper alloy for electric or electronic parts and automobile parts and tin-plating material of copper alloy manufactured therefrom 有权
公开(公告)号：US11542606B2
公开(公告)日：2023-01-03
申请号：US16462209
申请日：2018-05-08
申请人： Poongsan Corporation
发明人： Cheol Min Park , Hyo Moon Nam , Buem Jae Lee , Hyo Young Kim
IPC分类号： C23C22/17 , C23C22/07 , C25D3/30 , C25D3/38 , C25D3/56 , C25D3/60 , C25D5/12 , C25D5/34 , C25D5/50 , C25F1/02 , C25D5/48 , C25D5/10 , C25D7/00 , C25D5/00
摘要： The present invention provides a method of tin-plating a copper alloy for electric or electronic parts and automobile parts which has excellent insertion force, heat-resistant peeling, and solderability, and a tin-plating material of a copper alloy manufactured therefrom.

6. 发明授权

US11527504B2 Conductive external connector structure and method of forming 有权
公开(公告)号：US11527504B2
公开(公告)日：2022-12-13
申请号：US16989461
申请日：2020-08-10
申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
发明人： Meng-Fu Shih , Chun-Yen Lo , Cheng-Lin Huang , Wen-Ming Chen , Chien-Ming Huang , Yuan-Fu Liu , Yung-Chiuan Cheng , Wei-Chih Huang , Chen-Hsun Liu , Chien-Pin Chan , Yu-Nu Hsu , Chi-Hung Lin , Te-Hsun Pang , Chin-Yu Ku
IPC分类号： H01L23/00 , C25D5/12 , C25D5/50 , C25D7/12 , C25D17/12 , C25D21/10 , C25D17/00 , H01L23/31 , C25D3/12 , C25D3/38 , C25D3/60
摘要： External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

7. 发明申请

US20220389590A1 Sn-BASED PLATED STEEL SHEET 有权
公开(公告)号：US20220389590A1
公开(公告)日：2022-12-08
申请号：US17772079
申请日：2019-12-19
申请人： NIPPON STEEL CORPORATION
发明人： Shintaro YAMANAKA , Shigeru HIRANO
IPC分类号： C23C28/00 , C25D3/32 , C25D5/50 , C25D9/08
摘要： To provide a Sn-based plated steel sheet excellent in yellowing resistance, coating film adhesiveness, and sulfurization blackening resistance without performing the conventional chromate treatment.
A Sn-based plated steel sheet of the present invention includes: a steel sheet; a Sn-based plating layer located on at least one surface of the steel sheet; and a coating layer located on the Sn-based plating layer, wherein: the Sn-based plating layer contains 0.10 to 15.00 g/m2 of Sn per side in terms of metal Sn; the coating layer contains a Zr oxide and a Mn oxide; a content of the Zr oxide is 0.20 to 50.00 mg/m2 per side in terms of metal Zr; a content of the Mn oxide in terms of metal Mn is 0.01 to 0.50 times on a mass basis relative to the content of the Zr oxide in terms of metal Zr; and a depth position A where an element concentration of Mn is maximum is located on a side closer to a surface of the coating layer than a depth position B where an element concentration of Zr is maximum, and a distance in a depth direction between the depth position A and the depth position B is 2 nm or more in an element analysis in the depth direction by XPS.

8. 发明授权

US11466379B2 Manufacturing method of copper foil and circuit board assembly for high frequency signal transmission 有权
公开(公告)号：US11466379B2
公开(公告)日：2022-10-11
申请号：US16211366
申请日：2018-12-06
申请人： NAN YA PLASTICS CORPORATION
发明人： Shih-Ching Lin , Fu-Je Chen , Kuo-Chao Chen
IPC分类号： C25D5/00 , H05K3/24 , H05K1/02 , H05K3/06 , H05K3/02 , C25F3/02 , C25D5/34 , C25D5/10 , C25D7/06 , C25D5/50 , C25D1/04 , C25D5/48 , C25D3/56 , C25D3/04 , C25D3/38
摘要： A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

9. 发明授权

US11466367B2 Method for manufacturing product with bright surface 有权
公开(公告)号：US11466367B2
公开(公告)日：2022-10-11
申请号：US14427754
申请日：2013-09-06
申请人： SANKEI GIKEN KOGYO CO., LTD.
发明人： Toshio Okabe , Shuji Yamamoto , Daisuke Sato
IPC分类号： C23C18/16 , B32B33/00 , B32B38/00 , B32B3/26 , B32B7/12 , B32B15/08 , C25D5/50 , C25D5/12 , C25D5/00 , C25D7/00 , C23C18/30 , C23C18/20 , C23C18/32 , C23C18/48 , C25D3/04 , C25D3/38 , C23C18/28
摘要： A method of manufacturing a bright surface product comprises a step of performing electroless plating to form a first metal film on a base coat layer formed on a substrate, a step of performing electrolytic plating to form a second metal film thereon so that the bonding strength between each film of a multi-layered metal film comprising the first metal film and the second film is higher than the bonding strength between the base coat layer and the first metal layer, a step of integrally and discontinuously segmentalizing the multi-layered metal film with cracks to form an island-like metal film comprising a collection of fine multi-layered metal regions with island-like structures; and a step of forming a translucent top coat layer to cover the fine multi-layered metal regions of the island-like metal film and enter into the cracks to make contact with the base coat layer.

10. 发明申请

US20220298663A1 A METHOD FOR CHROMIUM UPGRADING OF FERRITIC STEEL INTERCONNECTS FOR SOLID OXIDE CELL STACK APPLICATIONS 有权
公开(公告)号：US20220298663A1
公开(公告)日：2022-09-22
申请号：US17616756
申请日：2020-07-13
申请人： HALDOR TOPSØE A/S
发明人： Tobias Holt NØRBY , Rainer KÜNGAS , Bengt Peter Gustav BLENNOW , Jeppe RASS-HANSEN , Thomas HEIREDAL-CLAUSEN
IPC分类号： C25D3/04 , C25D5/36 , C25D7/06 , C25D5/50 , H01M8/0228
摘要： In a method for chromium upgrading of interconnects made of ferritic steel to be used in solid oxide cell stacks, comprising the steps of shaping the interconnect, depositing a coating comprising Cr on at least one surface of the shaped interconnect and performing one or more thermal treatments at a temperature below 1000° C., the resulting Cr concentration near the surface of the interconnect is higher than the Cr concentration in the ferritic steel before shaping. Specifically, the average Cr concentration of the shaped interconnect is increased to 26 wt % Cr or higher.

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