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1. 发明授权

US07790788B2 Method for producing chemical mechanical polishing pad 有权
标题翻译：化学机械抛光垫的生产方法
公开(公告)号：US07790788B2
公开(公告)日：2010-09-07
申请号：US12253349
申请日：2008-10-17
申请人： Yukio Hosaka , Rikimaru Kuwabara
发明人： Yukio Hosaka , Rikimaru Kuwabara
IPC分类号： D21H19/58 , C08B37/02 , B24D11/00
CPC分类号： B29C35/0866 , B24B37/24 , B24D18/0009 , B29C37/0057 , B29C2035/0877 , B29L2031/736
摘要： There is provided a method for producing a chemical mechanical polishing pad, the method comprising the steps of (1) producing a sheet-shaped polymer molded article and (2) irradiating the sheet-shaped polymer molded article with an electron beam within an irradiation dose of 10 to 400 kGy.A chemical mechanical polishing pad produced by the above method has advantages that it is excellent in removal rate and scratches and in-plane uniformity on a polished surface and that it shows a stable removal rate even when polishing a number of objects to be polished successively.
摘要翻译：提供了一种生产化学机械抛光垫的方法，该方法包括以下步骤：（1）制备片状聚合物模塑制品，和（2）在辐射剂量内用电子束照射片状聚合物模塑制品 10到400 kGy。通过上述方法制造的化学机械抛光垫具有在抛光表面上的去除率和划痕和面内均匀性优异的优点，即使在连续研磨多个待抛光物体时也能显示出稳定的去除率。

2. 发明授权

US08388799B2 Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method 有权
标题翻译：用于形成化学机械抛光垫抛光层，化学机械抛光垫和化学机械抛光方法的组合物
公开(公告)号：US08388799B2
公开(公告)日：2013-03-05
申请号：US12357706
申请日：2009-01-22
申请人： Rikimaru Kuwabara , Takahiro Okamoto , Yukio Hosaka , Takafumi Shimizu , Tsuyoshi Watanabe
发明人： Rikimaru Kuwabara , Takahiro Okamoto , Yukio Hosaka , Takafumi Shimizu , Tsuyoshi Watanabe
IPC分类号： H01L21/304 , C08G18/42 , C08G18/48 , C08G18/62
CPC分类号： C08G18/3206 , B24B37/042 , B24B37/24 , C08G18/44 , C08G18/4854 , C08G18/6674 , C08G18/675 , C08G18/69 , C08K5/14 , C08L75/16 , C08L75/14 , C08L2666/26
摘要： A composition for forming a chemical mechanical polishing pad having polishing characteristics such as a high polishing rate, an excellent planarity of the polished object, and less scratches of the polished object. The composition includes (A) a polyurethane having a carbon-carbon double bond on a side chain and (B) a cross-linking agent. The polyurethane (A) is preferably a thermoplastic polyurethane (A′) obtained by mixing at least components (a11) to (a13) and component (a2) in a proportion satisfying the following conditions (1) and (2) and reacting them.
摘要翻译：一种用于形成化学机械抛光垫的组合物，其具有抛光特性如抛光速度高，抛光物体的平坦度优异，并且抛光对象的划痕较少。该组合物包括（A）侧链上具有碳 - 碳双键的聚氨酯和（B）交联剂。聚氨酯（A）优选为通过以满足以下条件（1）和（2）的比例混合至少组分（a11）至（a13）和组分（a2）而得到的热塑性聚氨酯（A'）并使其反应。

3. 发明申请

US20090191795A1 COMPOSITION FOR FORMING POLISHING LAYER OF CHEMICAL MECHANICAL POLISHING PAD, CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING METHOD 有权
标题翻译：用于形成化学机械抛光垫，化学机械抛光垫和化学机械抛光方法的抛光层组合物
公开(公告)号：US20090191795A1
公开(公告)日：2009-07-30
申请号：US12357706
申请日：2009-01-22
申请人： Rikimaru KUWABARA , Takahiro Okamoto , Yukio Hosaka , Takafumi Shimizu , Tsuyoshi Watanabe
发明人： Rikimaru KUWABARA , Takahiro Okamoto , Yukio Hosaka , Takafumi Shimizu , Tsuyoshi Watanabe
IPC分类号： B24B1/00 , B24D3/00 , C08G18/04 , C08G18/32 , B44C1/22
CPC分类号： C08G18/3206 , B24B37/042 , B24B37/24 , C08G18/44 , C08G18/4854 , C08G18/6674 , C08G18/675 , C08G18/69 , C08K5/14 , C08L75/16 , C08L75/14 , C08L2666/26
摘要： Provided is a composition for forming a polishing layer of a chemical mechanical polishing pad having polishing characteristics such as a high polishing rate, an excellent planarity of the polished object and less scratches of the polished object.The above composition for forming a polishing layer of a chemical mechanical polishing pad comprises (A) a polyurethane having a carbon-carbon double bond on a side chain and (B) a cross-linking agent. The polyurethane (A) is preferably a thermoplastic polyurethane (A′) obtained by mixing at least the following components (a11) to (a13) and component (a2) in a proportion satisfying the following conditions (1) and (2) and reacting them: (a11) an oligomer which has one or more hydroxyl groups and one or more carbon-carbon double bonds and which has a number average molecular weight of 500 to 2500, (a12) an oligomer which has two or more hydroxyl groups and either one or both of an ether bond and an ester bond and which has a number average molecular weight of 500 to 2500 and is different from the component (a11), (a13) a monomer having two hydroxyl groups and (a2) a monomer having two isocyanate groups; and (1) a value of M-1/M-OH is 0.85 to 1.10, and (2) a value of M-2/M-OH is 0.45 to 0.80, wherein M-1 is the number of isocyanate groups contained in the component (a2), M-2 is the number of hydroxyl groups contained in the component (a13) and M-OH is the total number of hydroxyl groups contained in the components (a11), (a12) and (a13).
摘要翻译：提供一种用于形成化学机械抛光垫的抛光层的组合物，其具有抛光特性如抛光速度高，抛光对象的优良平面度和抛光对象的划痕少。用于形成化学机械抛光垫的抛光层的上述组合物包括（A）侧链上具有碳 - 碳双键的聚氨酯和（B）交联剂。聚氨酯（A）优选为通过以满足以下条件（1）和（2）的比例混合至少以下成分（a11）〜（a13）和成分（a2）而得到的热塑性聚氨酯（A'），它们：（a11）具有一个或多个羟基和一个或多个碳 - 碳双键且数均分子量为500至2500的低聚物，（a12）具有两个或更多个羟基的低聚物和醚键和酯键中的一种或两种，并且其数均分子量为500至2500，并且不同于组分（a11），（a13）具有两个羟基的单体和（a2）具有两个羟基的单体异氰酸酯基; 和（1）M-1 / M-OH的值为0.85〜1.10，（2）M-2 / M-OH的值为0.45〜0.80，M-1为组分（a2），M-2是组分（a13）中包含的羟基数，M-OH是组分（a11），（a12）和（a13）中所含羟基的总数。

4. 发明申请

US20060075686A1 Polishing body 失效
标题翻译：抛光体
公开(公告)号：US20060075686A1
公开(公告)日：2006-04-13
申请号：US11288094
申请日：2005-11-29
申请人： Kou Hasegawa , Hozumi Satou , Osamu Ishikawa , Yukio Hosaka
发明人： Kou Hasegawa , Hozumi Satou , Osamu Ishikawa , Yukio Hosaka
IPC分类号： B24B7/30 , B24D18/00
CPC分类号： B24B37/245 , B24B37/24 , B24D3/28 , B24D11/001 , B24D18/0009 , C09K3/1454
摘要： An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the abrasive are contained. A polishing part constituting the polishing body in the invention is produced obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, α-methylstyrenedimer, and t-dodecylmercaptan in an autoclave, making the mixture react for 16 hours at 75° C. to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH 8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 μm and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like.
摘要翻译：本发明的目的是提供一种抛光体，其中抛光体中的磨料非常分散，在抛光过程中提供稳定的抛光性能，并且即使在大的情况下也能有效地减少划痕的发生含有磨料的数量。通过在高压釜中加载预定量的丁二烯，苯乙烯，甲基丙烯酸甲酯，衣康酸，丙烯酸，α-甲基苯乙炔二酮和叔十二烷基硫醇，制得本发明中构成抛光体的抛光部分，使混合物反应16小时在75℃下得到其中分散共聚物的乳液，将该乳液调节至pH8.5，并加入平均一次粒径为0.3μm的二氧化铈粉末并搅拌，得到水分散液，通过涂布干燥该水性分散体薄膜穿过薄膜，并模压所获得的干燥产品。上述抛光部分可以具有交联结构。本发明的研磨体可以在抛光垫等中有利地使用，用于研磨半导体晶片等的表面。

5. 发明申请

US20050239380A1 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method 审中-公开
标题翻译：化学机械抛光垫，其制造工艺和化学机械抛光方法
公开(公告)号：US20050239380A1
公开(公告)日：2005-10-27
申请号：US11110728
申请日：2005-04-21
申请人： Yukio Hosaka , Yuuji Shimoyama , Hiroshi Shiho , Nobuo Kawahashi
发明人： Yukio Hosaka , Yuuji Shimoyama , Hiroshi Shiho , Nobuo Kawahashi
IPC分类号： B24B37/04 , B24B1/00
CPC分类号： B24B37/04 , B24B37/042
摘要： A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 μm, a 10-point height (Rz) of 40 to 150 μm, a core roughness depth (Rk) of 12 to 50 μm and a reduced peak height (Rpk) of 7 to 40 μm, a manufacturing process thereof and a chemical mechanical polishing method. Even when the chemical mechanical polishing of a large-diameter wafer as an object to be polished is carried out by this pad, a polished surface having excellent in-plane uniformity and flatness can be formed.
摘要翻译：一种化学机械抛光垫，其抛光表面的算术平均粗糙度（Ra）为0.1〜15μm，10点高（Rz）为40〜150μm，芯粗糙度深度（Rk）为12〜50μm，降低的峰值高度（Rpk）为7至40μm，其制造方法和化学机械抛光方法。即使通过该垫进行作为被研磨物的大直径晶片的化学机械研磨，也可以形成具有优异的面内均匀性，平坦性的研磨面。

6. 发明授权

US06442486B1 Method for determining amount of fertilizer application for grain crops, method for estimating quality and yield of grains and apparatus for providing grain production information 失效
标题翻译：确定粮食作物施肥量的方法，粮食质量和产量估算方法及粮食生产信息提供机制
公开(公告)号：US06442486B1
公开(公告)日：2002-08-27
申请号：US09385094
申请日：1999-08-30
申请人： Satoru Satake , Yukio Hosaka , Hideharu Maruyama , Nobuhiko Nakamura
发明人： Satoru Satake , Yukio Hosaka , Hideharu Maruyama , Nobuhiko Nakamura
IPC分类号： G06F1760
CPC分类号： G06Q10/04 , A01C21/007
摘要： A method and an apparatus for determining an amount of fertilizer to be applied to grain crops are disclosed. A fertilizer application related formula for obtaining the necessary amount of fertilizer to be applied is established by analyzing growth information including leaf blade information, fertilizer application information and quality information, all the above information being obtained in advance from a number of grains or grain crops. The formula thus established is stored in the memory. The necessary amount of fertilizer to be applied for each specific period for grain crops which are presently under growth is calculated by applying to the above formula, growth information of the grain crops presently under growth and target quality information. The growth information includes leaf blade information in relation to a specific period. The results of the calculation are displayed or printed out. A method and an apparatus for estimating a quality or yield of grains prior to the harvesting is also disclosed. In this case, a quality or yield related formula is established in advance and stored in the memory.
摘要翻译：公开了一种用于确定施用于粮食作物的肥料的量的方法和装置。通过分析包括叶片信息，肥料施用信息和质量信息在内的增长信息，建立了获得所需施肥量的肥料施用相关配方，所有这些信息预先从许多谷物或谷类作物获得。这样建立的公式存储在内存中。根据目前正在成长的粮食作物的增长信息和目标质量信息，计算了目前正在生长的粮食作物每个特定时期适用的肥料所需量。生长信息包括与特定时段有关的叶片信息。计算结果显示或打印出来。还公开了一种用于在收获之前估计谷物质量或产量的方法和装置。在这种情况下，预先建立质量或产量相关公式并存储在存储器中。

7. 发明授权

US6089172A Lock stitch sewing machine with automatic thread tension adjusting device 有权
标题翻译：自动线张力调节装置的锁缝机
公开(公告)号：US6089172A
公开(公告)日：2000-07-18
申请号：US374672
申请日：1999-08-16
申请人： Hideaki Takenoya , Yoshikazu Ebata , Akira Orii , Yoshitaka Takahashi , Eiji Murakami , Eiichi Shomura , Tsutomu Takagi , Yukio Hosaka
发明人： Hideaki Takenoya , Yoshikazu Ebata , Akira Orii , Yoshitaka Takahashi , Eiji Murakami , Eiichi Shomura , Tsutomu Takagi , Yukio Hosaka
IPC分类号： D05B19/12 , D05B47/04 , D05B47/06
CPC分类号： D05B19/12 , D05B47/04
摘要： A lock stitch sewing machine with an automatic thread tension adjusting device is disclosed, wherein the sewing machine has a plurality of thread tension adjusting mechanisms 7, each of which including a pair of thread tension disks 12, 13, one of which is normally pressed by a spring toward the other. A sensor 4 is responsive to the operation of a thread tension releasing lever 20 made by a user with a slight touch applied thereto to give a signal. A CPU1 is responsive to the signal to compare the value of the existing thread tension of the thread tension adjusting mechanisms 7 with a predetermined one. If the value of the existing thread tension is higher than the predetermined one, the CPU1 is operated reduce the value of the existing thread tension to a predetermined one. Thus the tension releasing operation ability is increased.
摘要翻译：公开了一种具有自动线张力调节装置的缝纫缝纫机，其中缝纫机具有多个线张力调节机构7，每个线张力调节机构7包括一对线张力盘12,13，其中一个线张力盘12通常被朝向另一个的春天。传感器4响应于由使用者施加的轻微触摸而产生的线张力释放杆20的操作以产生信号。 CPU1响应该信号以将线张力调节机构7的现有线张力的值与预定线张力调节机构7的值进行比较。如果现有线张力的值高于预定线张力，则CPU1被操作将现有线张力的值减小到预定线张力。因此，张力释放操作能力增加。

8. 发明授权

US5976882A Method for measuring ash content of food stuff 失效
标题翻译：测量食物灰分含量的方法
公开(公告)号：US5976882A
公开(公告)日：1999-11-02
申请号：US249167
申请日：1999-02-12
申请人： Satoru Satake , Takaharu Kameoka , Yukio Hosaka , Takeshi Imai , Shinji Saito
发明人： Satoru Satake , Takaharu Kameoka , Yukio Hosaka , Takeshi Imai , Shinji Saito
IPC分类号： G01N21/27 , G01N21/33 , G01N21/35 , G01N21/3563 , G01N21/359 , G01N33/02
CPC分类号： G01N21/33 , G01N21/274 , G01N21/3563 , G01N21/359 , G01N33/02 , Y10T436/10
摘要： A method for measuring ash content of food stuff is carried out by 1) preparing, with respect to food stuff samples whose ash content values are known, a calibration curve by a non-linear analysis of absorbance values and the known ash content of each sample, the absorbance values being obtained by irradiating light having particular wavelengths containing at least an ultraviolet ray band wavelength, the particular wavelength being specific to organic ingredients well coupled to inorganic ingredients which result in the ash content, and 2) deriving, with respect to a sample whose ash content value is unknown, an ash content value of the sample from absorbance values obtained by irradiating, on the sample, light having the particular wavelengths containing at least the ultraviolet ray band wavelength and from the calibration curve prepared in advance by the non-linear analysis. An apparatus for carrying out the method includes a light source section, a photo detecting section, a storing section for storing the calibration curve, and a calculation section for calculating, with respect to a sample whose ash content value is unknown, the ash content value based on the absorbance values and the calibration curve stored in the storing section. It is possible to speed up the measuring operation and to improve the measuring precision.
摘要翻译：通过以下方式进行食品灰分含量测定的方法：1）对于灰分含量已知的食品样品，通过吸光度值的非线性分析和每个样品的已知灰分含量制备校准曲线通过照射具有至少具有紫外线波长的特定波长的光获得的吸光度值，该特定波长特异于有机成分，其与无机成分良好耦合，导致灰分含量，以及2）相对于灰分含量未知的样品，样品的灰分含量值，其通过在样品上照射具有至少包含紫外线波段波长的特定波长的光和由非预定制备的校准曲线获得的吸光度值，线性分析。用于执行该方法的装置包括光源部分，光检测部分，用于存储校准曲线的存储部分，以及计算部分，用于相对于灰分含量值未知的样本计算灰分含量值基于存储部分中存储的吸光度值和校准曲线。可以加快测量操作，提高测量精度。

9. 发明授权

US5145117A Process of and system for flouring wheat 失效
标题翻译：播种小麦的过程和系统
公开(公告)号：US5145117A
公开(公告)日：1992-09-08
申请号：US690674
申请日：1991-04-24
申请人： Toshihiko Satake , Yukio Hosaka
发明人： Toshihiko Satake , Yukio Hosaka
IPC分类号： B02B5/02 , B02C9/04
CPC分类号： B02C9/04 , B02B5/02
摘要： A wheat flouring system comprises a polishing machine for polishing wheat grains, a humidifying machine for humidifying the grains, a conditioning machine for subjecting the grains to conditioning and a milling machine for milling the grains to produce a flour. The polishing machine, the humidifying machine, the conditioning machine and the milling machine are successively arranged from an upstream side to a downstream side as viewed in a direction of flow of the wheat grains. There is provided an agitating machine for agitating the grains humidified by the humidifying machine, thereby preventing the humidified grains from sticking together into lumps of the grains.
摘要翻译：小麦面粉系统包括用于抛光小麦籽粒的抛光机，用于加湿谷粒的加湿机，用于对谷物进行调理的调理机和用于研磨谷物的研磨机以生产面粉。研磨机，加湿机，调理机，铣刨机，从小麦籽粒流动方向观察，从上游侧向下游侧排列。提供了一种用于搅拌加湿机加湿的颗粒的搅拌机，从而防止加湿颗粒粘在一起成为颗粒块。

10. 发明授权

US4540286A Apparatus for continuously measuring the degree of milling of grains 失效
标题翻译：用于连续测量谷物研磨度的装置
公开(公告)号：US4540286A
公开(公告)日：1985-09-10
申请号：US486808
申请日：1983-04-19
申请人： Toshihiko Satake , Yukio Hosaka
发明人： Toshihiko Satake , Yukio Hosaka
IPC分类号： G01N21/47 , G01N21/53 , G01N21/85 , G01N33/10 , G01N21/13
CPC分类号： G01N21/4738 , G01N33/10 , G01N21/532 , G01N21/85
摘要： An apparatus for continuously measuring the degree of milling of rice grains wherein there is provided a grain passage unit, one wall of which is positioned angularly so that the grains in contact therewith slide down with their lengthwise axes generally parallel to this wall and another wall of which is positioned so that the grains introduced in the grain passage unit flow without a gap between this wall and the grains, and wherein there are provided integrated data take-up units, the inputs of which are connected to amplifiers and the outputs of which are coupled to a degree of milling meter through an arithmetic unit so that the integrated data obtained in a given period divided into a number of divisions is averaged to calculate the degree of milling sought.
摘要翻译：一种用于连续测量米粒研磨度的装置，其中设置有一个谷物通道单元，其一个壁成角度地定位，使得与其接触的谷物沿其纵向轴线大致平行于该壁滑动，另一个壁其位置使得引入颗粒通道单元中的颗粒在该壁和颗粒之间没有间隙地流动，并且其中提供了集成的数据卷取单元，其输入连接到放大器，其输出是通过算术单元耦合到一定程度的铣削计量器，使得在给定时间段内获得的积分数据被划分成多个分区，以计算寻找的铣削程度。

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