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1. 发明申请

US20170355140A1 PRINTING A CHEMICAL MECHANICAL POLISHING PAD 审中-公开
公开(公告)号：US20170355140A1
公开(公告)日：2017-12-14
申请号：US15688408
申请日：2017-08-28
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Barry Lee Chin , Terrance Y. Lee
IPC分类号： B29C64/209 , B24D18/00 , B33Y10/00 , B29C64/20 , B29C64/112 , B24B37/26 , B33Y80/00 , B29C35/08 , B29L31/00 , B29K509/02 , B29K105/16 , B29K75/00 , B29K105/00
CPC分类号： B29C64/209 , B24B37/26 , B24D18/00 , B24D18/009 , B29C35/0805 , B29C64/112 , B29C64/20 , B29C2035/0827 , B29K2075/00 , B29K2105/0002 , B29K2105/16 , B29K2509/02 , B29L2031/736 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00
摘要： A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

2. 发明申请

US20160375550A1 CONTROLLED-POROSITY METHOD FOR FORMING POLISHING PAD 有权
标题翻译：用于形成抛光垫的控制 - 孔隙度方法
公开(公告)号：US20160375550A1
公开(公告)日：2016-12-29
申请号：US14751328
申请日：2015-06-26
申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc. , DOW GLOBAL TECHNOLOGIES LLC
发明人： Yuhua Tong , Andrew Wank , Diego Lugo , Marc R. Stack , David Michael Veneziale , Marty W. DeGroot , George C. Jacob , Jeffrey B. Miller
IPC分类号： B24D11/00 , B29C41/12
CPC分类号： B24D11/001 , B29C41/12 , B29L2031/736
摘要： The invention is to a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method includes applying droplets of a liquid polymer against a substrate to form a plurality of pores. The liquid polymer contains a nonionic surfactant, the nonionic surfactant has a concentration sufficient to facilitate growth of pores within the liquid polymer and an ionic surfactant has a concentration sufficient to limit growth of the pores within the liquid polymer. Curing the solid polymer forms a polishing pad with final size of the plurality of pores controlled by the concentration of nonionic surfactant and ionic surfactants.
摘要翻译：本发明是一种制造适于平坦化半导体，光学和磁性基板中的至少一种的抛光垫的方法。该方法包括将液体聚合物的液滴施加到基底上以形成多个孔。液体聚合物含有非离子表面活性剂，非离子表面活性剂具有足以促进液体聚合物内孔的生长的浓度，离子表面活性剂的浓度足以限制液体聚合物内孔的生长。固化固体聚合物形成抛光垫，其具有由非离子表面活性剂和离子表面活性剂的浓度控制的多个孔的最终尺寸。

3. 发明申请

US20160347002A1 APPARATUS FOR PRINTING A CHEMICAL MECHANICAL POLISHING PAD 有权
公开(公告)号：US20160347002A1
公开(公告)日：2016-12-01
申请号：US15237140
申请日：2016-08-15
申请人： Applied Materials, Inc.
发明人： Rajeev Bajaj , Barry Lee Chin , Terrance Y. Lee
IPC分类号： B29C67/00 , B33Y30/00 , B24D18/00 , B33Y50/02 , B33Y80/00 , B24B37/26 , B33Y10/00 , B29C35/08
CPC分类号： B29C64/209 , B24B37/26 , B24D18/00 , B24D18/009 , B29C35/0805 , B29C64/112 , B29C64/20 , B29C2035/0827 , B29K2075/00 , B29K2105/0002 , B29K2105/16 , B29K2509/02 , B29L2031/736 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00
摘要： A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

4. 发明授权

US09067299B2 Printed chemical mechanical polishing pad 有权
标题翻译：印刷化学机械抛光垫
公开(公告)号：US09067299B2
公开(公告)日：2015-06-30
申请号：US13591051
申请日：2012-08-21
申请人： Rajeev Bajaj , Barry Lee Chin , Terrance Y. Lee
发明人： Rajeev Bajaj , Barry Lee Chin , Terrance Y. Lee
IPC分类号： B29C67/00 , B24B37/26 , B24D18/00
CPC分类号： B29C64/209 , B24B37/26 , B24D18/00 , B24D18/009 , B29C35/0805 , B29C64/112 , B29C64/20 , B29C2035/0827 , B29K2075/00 , B29K2105/0002 , B29K2105/16 , B29K2509/02 , B29L2031/736 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00
摘要： A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.
摘要翻译：制造抛光垫的抛光层的方法包括用3D打印机连续沉积多个层，通过从喷嘴喷射垫材料前体而沉积多个抛光层的每层，并固化焊盘材料前体以形成固化垫材料。

5. 发明申请

US20140038493A1 TANK AND METHOD FOR PRODUCING POLISHING PAD USING TANK 有权
标题翻译：用于生产抛光垫的罐和方法
公开(公告)号：US20140038493A1
公开(公告)日：2014-02-06
申请号：US14111120
申请日：2011-04-25
申请人： Hiroshi Seyanagi
发明人： Hiroshi Seyanagi
IPC分类号： B24B37/24 , B65D25/04 , B24B37/04 , B65D8/00
CPC分类号： B24B37/24 , B24B37/042 , B29C39/006 , B29C39/24 , B29C44/38 , B29K2075/00 , B29L2031/736 , B65D7/04 , B65D25/04
摘要： It is an object of the invention to provide a tank for use in making high-quality, air void-less, polishing pads, to provide a method for producing a polishing pad using the tank, and to provide a polishing pad obtained by such a production method. A tank for holding a resin composition, the tank comprising two or more body components and joint parts, wherein the two or more body components are joined by the joint parts to form a frame-shaped body, at least one of the joint parts includes an opening and closing member that joins adjacent ones of the body components in such a way that the adjacent body components can swing open, and at least another one of the joint parts includes a joint member that joins adjacent ones of the body components in such a way that the adjacent body components can swing about the joint member.
摘要翻译：本发明的目的是提供一种用于制造高质量无空气的抛光垫的罐，以提供一种使用该罐生产抛光垫的方法，并提供由这样的抛光垫获得的抛光垫生产方式。一种用于保持树脂组合物的罐，所述罐包括两个或更多个主体部件和接头部件，其中所述两个或更多个主体部件通过所述接合部分连接以形成框架体，所述接合部件中的至少一个包括打开和关闭构件，其以相邻的身体部件可以摆动打开的方式连接身体部件中的相邻身体部件，并且至少另一个接合部件包括以这种方式连接身体部件的相邻部件的接合部件相邻的主体部件可围绕接头部件摆动。

6. 发明授权

US07678310B2 Block tool for surface finishing operations and method of obtaining the same 有权
标题翻译：用于表面精加工的块工具及其获得方法
公开(公告)号：US07678310B2
公开(公告)日：2010-03-16
申请号：US11436031
申请日：2006-05-18
申请人： Stefano Fioratti
发明人： Stefano Fioratti
IPC分类号： D04H1/52
CPC分类号： B29C45/0013 , B24D3/28 , B24D18/0009 , B24D99/005 , B29C45/14778 , B29C2045/14983 , B29L2031/736
摘要： A block tool for surface finishing operations, which has a support and coupling member (2) for connection to a machine tool, and an abrasive block (3) held by the support member (2), the abrasive block being obtained from a solution or emulsion of a granular abrasive material dispersed in a matrix comprising a thermoplastic resin.
摘要翻译：用于表面精加工操作的块工具，其具有用于连接到机床的支撑和联接构件（2）以及由所述支撑构件（2）保持的研磨块（3），所述研磨块由溶液或分散在包含热塑性树脂的基质中的粒状研磨材料的乳液。

7. 发明申请

US20050221741A1 Polymeric polishing pad having continuously regenerated work surface 审中-公开
标题翻译：聚合抛光垫具有连续再生的工作表面
公开(公告)号：US20050221741A1
公开(公告)日：2005-10-06
申请号：US11139060
申请日：2005-05-27
申请人： Heinz Reinhardt , John Roberts , Harry McClain , William Budinger , Elmer Jensen
发明人： Heinz Reinhardt , John Roberts , Harry McClain , William Budinger , Elmer Jensen
IPC分类号： B05D5/00 , B05D7/02 , B24B37/26 , B24B53/00 , B24B53/007 , B24B53/017 , B24D3/28 , B24D3/32 , B29C70/58 , B29C70/66 , C08J5/14 , H01L21/304 , H01L21/306 , H01L21/3105 , B24D11/00
CPC分类号： B29C70/66 , B24B37/26 , B24B53/00 , B24B53/017 , B24D3/28 , B24D3/32 , B29C70/58 , B29L2031/736 , Y10S438/959 , Y10T428/24355 , Y10T428/24372 , Y10T428/24405 , Y10T428/24446 , Y10T428/24479 , Y10T428/24537 , Y10T428/2457 , Y10T428/24579 , Y10T428/249924 , Y10T428/249954 , Y10T428/249972 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/268 , Y10T428/2982 , Y10T428/31551 , Y10T428/31591
摘要： The polishing pad is useful for polishing a surface of an electronic substrate. The pad comprises a polymeric matrix and polymeric microelements within the polymeric matrix. The polymeric microelements have a mean diameter of less than 150 μm (0.0059″). The pad has grooves forming artifacts and a depth less than 2000 times the mean diameter of the polymeric microelements; and the artifacts are spaced apart 0.1 to 10 mm (0.0039″ to 0.39″) and have a width of 1 to 5 mm (0.039″ to 0.20″).
摘要翻译：抛光垫可用于抛光电子基板的表面。该垫包括聚合物基质和聚合物基质内的聚合微量元素。聚合物微量元素的平均直径小于150μm（0.0059“）。垫具有形成假象的凹槽和小于聚合物微量元素的平均直径的2000倍的深度; 并且伪像间隔0.1〜10mm（0.0039“〜0.39”），宽度为1〜5mm（0.039“〜0.20”）。

8. 发明申请

US20040224142A1 Method of polishing a semiconductor device 有权
标题翻译：抛光半导体器件的方法
公开(公告)号：US20040224142A1
公开(公告)日：2004-11-11
申请号：US10850083
申请日：2004-05-19
发明人： Heinz F. Reinhardt , John V. H. Roberts , Harry George McClain , William D. Budinger , Elmer William Jensen
IPC分类号： B32B003/00
CPC分类号： B29C70/66 , B24B37/26 , B24B53/00 , B24B53/017 , B24D3/28 , B24D3/32 , B29C70/58 , B29L2031/736 , Y10S438/959 , Y10T428/24355 , Y10T428/24372 , Y10T428/24405 , Y10T428/24446 , Y10T428/24479 , Y10T428/24537 , Y10T428/2457 , Y10T428/24579 , Y10T428/249924 , Y10T428/249954 , Y10T428/249972 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/268 , Y10T428/2982 , Y10T428/31551 , Y10T428/31591
摘要： The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the polishing pad and in a subsurface proximate the work surface. The method further comprises dissolving the dissolvable substance at the work surface while polishing the semiconductor device and wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes a new work surface that polishes the semiconductor device.
摘要翻译：本发明提供了一种抛光半导体器件的方法，包括：用抛光垫抛光半导体器件，抛光垫包括聚合物基体和可溶解物质。可溶解物质位于抛光垫的工作表面上，并位于靠近工作表面的地下。该方法还包括在研磨半导体器件时将可溶解物质溶解在工作表面上，并在抛光半导体器件时磨损抛光垫，使得地下成为修整半导体器件的新工作表面。

9. 发明申请

US20040018805A1 Polishing pad and method of manufacture 失效
标题翻译：抛光垫及其制造方法
公开(公告)号：US20040018805A1
公开(公告)日：2004-01-29
申请号：US10408750
申请日：2003-04-07
发明人： Xuyen Pham
IPC分类号： B24B001/00 , B24D011/00
CPC分类号： B24B37/20 , B29C53/382 , B29C65/02 , B29C65/04 , B29C65/06 , B29C65/08 , B29C65/10 , B29C65/4815 , B29C65/505 , B29C66/1142 , B29C66/1282 , B29C66/12841 , B29C66/14 , B29C66/43 , B29C66/4322 , B29C66/4324 , B29L2009/00 , B29L2031/709 , B29L2031/736
摘要： A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint. The joint is resistant to infiltration of slurry and is not susceptible to delamination that commonly occurs in a typical laminate joint.
摘要翻译：一种接合用于半导体晶片的化学机械平面化的抛光垫部分的方法。抛光垫的两个部分被定位成使得它们彼此接触。然后将两个部分焊接在一起以形成牢固的接头。接头耐浆料渗透，并且不易于在典型的层压接头中通常发生分层。

10. 发明申请

US20030068960A1 Polymeric polishing pad having continuously regenerated work surface 有权
标题翻译：聚合抛光垫具有连续再生的工作表面
公开(公告)号：US20030068960A1
公开(公告)日：2003-04-10
申请号：US10292770
申请日：2002-11-12
发明人： Heinz F. Reinhardt , John V. H. Roberts , Harry George McClain , William D. Budinger , Elmer William Jensen
IPC分类号： B29C071/02 , H01L021/302 , B24B001/00
CPC分类号： B29C70/66 , B24B37/26 , B24B53/00 , B24B53/017 , B24D3/28 , B24D3/32 , B29C70/58 , B29L2031/736 , Y10S438/959 , Y10T428/24355 , Y10T428/24372 , Y10T428/24405 , Y10T428/24446 , Y10T428/24479 , Y10T428/24537 , Y10T428/2457 , Y10T428/24579 , Y10T428/249924 , Y10T428/249954 , Y10T428/249972 , Y10T428/25 , Y10T428/254 , Y10T428/26 , Y10T428/268 , Y10T428/2982 , Y10T428/31551 , Y10T428/31591
摘要： A polishing pad used in a method for polishing a semiconductor device is made by combining a polymeric matrix and a dissolvable substance that dissolves upon contact with a polishing slurry.
摘要翻译：用于抛光半导体器件的方法中的抛光垫通过将聚合物基质和与抛光浆料接触时溶解的可溶解物质组合而制成。

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