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1. 发明申请

US20100221918A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR PREPARING THE SAME, KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于化学机械抛光的水性分散体及其制备方法，用于制备用于化学机械抛光的水性分散体的试剂盒和用于半导体器件的化学机械抛光方法
公开(公告)号：US20100221918A1
公开(公告)日：2010-09-02
申请号：US12676272
申请日：2008-08-12
申请人： Akihiro Takemura , Mitsuru Meno , Yuuji Shimoyama , Hirotaka Shida
发明人： Akihiro Takemura , Mitsuru Meno , Yuuji Shimoyama , Hirotaka Shida
IPC分类号： H01L21/304 , H01L21/306 , C09K13/00
CPC分类号： H01L21/3212 , C09G1/02 , C09K3/1463
摘要： A chemical mechanical polishing aqueous dispersion includes (A) a sulfonic acid group-containing water-soluble polymer, (B) an amino acid, (C) abrasive grains, and (D) an oxidizing agent.
摘要翻译：化学机械研磨用水系分散体包含（A）含有磺酸基的水溶性聚合物，（B）氨基酸，（C）磨粒，（D）氧化剂。

2. 发明申请

US20050239380A1 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method 审中-公开
标题翻译：化学机械抛光垫，其制造工艺和化学机械抛光方法
公开(公告)号：US20050239380A1
公开(公告)日：2005-10-27
申请号：US11110728
申请日：2005-04-21
申请人： Yukio Hosaka , Yuuji Shimoyama , Hiroshi Shiho , Nobuo Kawahashi
发明人： Yukio Hosaka , Yuuji Shimoyama , Hiroshi Shiho , Nobuo Kawahashi
IPC分类号： B24B37/04 , B24B1/00
CPC分类号： B24B37/04 , B24B37/042
摘要： A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 μm, a 10-point height (Rz) of 40 to 150 μm, a core roughness depth (Rk) of 12 to 50 μm and a reduced peak height (Rpk) of 7 to 40 μm, a manufacturing process thereof and a chemical mechanical polishing method. Even when the chemical mechanical polishing of a large-diameter wafer as an object to be polished is carried out by this pad, a polished surface having excellent in-plane uniformity and flatness can be formed.
摘要翻译：一种化学机械抛光垫，其抛光表面的算术平均粗糙度（Ra）为0.1〜15μm，10点高（Rz）为40〜150μm，芯粗糙度深度（Rk）为12〜50μm，降低的峰值高度（Rpk）为7至40μm，其制造方法和化学机械抛光方法。即使通过该垫进行作为被研磨物的大直径晶片的化学机械研磨，也可以形成具有优异的面内均匀性，平坦性的研磨面。

3. 发明申请

US20130012618A1 RESIN COMPOSITION, POLYMER, CURED FILM AND ELECTRONIC PART 审中-公开
标题翻译：树脂组合物，聚合物，固化膜和电子部件
公开(公告)号：US20130012618A1
公开(公告)日：2013-01-10
申请号：US13540624
申请日：2012-07-03
申请人： Akito HIRO , Masaaki HANAMURA , Futoshi YAMATO , Yuuji SHIMOYAMA , Jun MUKAWA , Hikaru MIZUNO , Akari SAKO , Tomohiko SAKURAI
发明人： Akito HIRO , Masaaki HANAMURA , Futoshi YAMATO , Yuuji SHIMOYAMA , Jun MUKAWA , Hikaru MIZUNO , Akari SAKO , Tomohiko SAKURAI
IPC分类号： C08L63/10 , C08F224/00
CPC分类号： C08G59/3209 , C08F12/22 , C08F212/14 , C08L25/18 , C08F212/08 , C08K5/04
摘要： Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent, wherein in the formula (a1), R1s are each independently a hydrogen atom or hydroxyl group, provided that at least one R1 is hydroxyl group; and R2 is a hydrogen atom or a C1-4 alkyl group; and in the formula (a2), R3s are each independently a group having a cationic polymerizable group, or a hydrogen atom, provided that at least one R3 is a group having a cationic polymerizable group; and R4 is a hydrogen atom or a C1-4 alkyl group.
摘要翻译：提供能够形成伸长性优异的固化膜的树脂组合物; 适合作为组合物中所含组分的聚合物; 由该组合物形成的固化膜; 以及包含固化膜的电子部件。树脂组合物包含（A）含有由式（a1）表示的结构单元和由式（a2）表示的结构单元的聚合物; 和（F）溶剂，其中在式（a1）中，R 1各自独立地为氢原子或羟基，条件是至少一个R 1为羟基; R2是氢原子或C1-4烷基; 在式（a2）中，R 3各自独立地为具有阳离子可聚合基团或氢原子的基团，条件是至少一个R 3为具有阳离子可聚合基团的基团; R4为氢原子或C1-4烷基。

4. 发明授权

US07081917B2 Automatic collimation surveying apparatus having image pick-up device 失效
标题翻译：具有摄像装置的自动准直测量装置
公开(公告)号：US07081917B2
公开(公告)日：2006-07-25
申请号：US10214457
申请日：2002-08-08
申请人： Yuuji Shimoyama , Kunitoshi Ogawa , Gen Kuriyama
发明人： Yuuji Shimoyama , Kunitoshi Ogawa , Gen Kuriyama
IPC分类号： H04N7/18 , H04N9/47
CPC分类号： G01C15/00
摘要： An automatic collimation surveying apparatus is provided with a collimation camera optical system (47) of a high magnification ratio; a wide-angle CCD camera optical system (89) having a wide field of view; a touch-panel display (64) for displaying an image picked up by both CCD camera optical systems; an image processing unit (60) for discriminating points of measurement from the above-described image; a touch-pen for pointing out points of measurement on the above-described image; and an automatic collimation unit (69) for automatically collimating the pointed-out points of measurement. In addition, illumination light from light source (80) is concurrently used as collimation light and is aligned so as to be emitted along the collimation axis (O) of a collimation camera optical system. The surveying apparatus can be remotely controlled from a measurement controller such as a peripheral personal computer. The surveying apparatus allows a number of point-of-measurement positions to be efficiently measured on a large-scaled structure by a single operator.
摘要翻译：自动准直测量装置具有高倍率的准直照相机光学系统（47）; 具有宽视场的广角CCD摄像机光学系统（89）; 用于显示由CCD照相机光学系统拾取的图像的触摸面板显示器（64）用于从上述图像中区分测量点的图像处理单元（60）用于指示上述图像上的测量点的触摸笔; 以及用于自动准直所述指示的测量点的自动准直单元（69）。此外，来自光源（80）的照明光同时用作准直光并且被排列成沿准直照相机光学系统的准直轴（O）发射。测量装置可以由诸如外围个人计算机的测量控制器进行远程控制。测量装置允许通过单个操作者在大规模结构上有效地测量多个测量点位置。

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