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1. 发明授权

US06601752B2 Electronic part mounting method 失效
标题翻译：电子零件安装方式
公开(公告)号：US06601752B2
公开(公告)日：2003-08-05
申请号：US09801855
申请日：2001-03-09
申请人： Yukihiro Maeda , Yuji Ootani , Tetsuo Nakano , Takashi Nagasaka
发明人： Yukihiro Maeda , Yuji Ootani , Tetsuo Nakano , Takashi Nagasaka
IPC分类号： B23K2010
CPC分类号： H01L24/85 , B23K20/004 , B23K2101/36 , B23K2101/42 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/78 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/48599 , H01L2224/48611 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/73265 , H01L2224/78313 , H01L2224/83192 , H01L2224/838 , H01L2224/8501 , H01L2224/85013 , H01L2224/85051 , H01L2224/85148 , H01L2224/85203 , H01L2224/85205 , H01L2224/85411 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H05K3/1225 , H05K3/4015 , H01L2924/01001 , H01L2924/01046 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： At the step of printing a wiring portion of a ceramic substrate with a conductive adhesive for mounting an IC chip or a part such as a capacitor other than the IC chip, a wire bonding pad made of gold is formed by the ball bonding method or the like at the portion of the wiring portion to be wire-bonded. After the pad was formed and before the conductive adhesive is printed, a heat treatment is performed to cause a thermal diffusion between the wiring portion and the pad to improve the jointability therebetween.
摘要翻译：在使用用于安装IC芯片的导电粘合剂或除了IC芯片之外的诸如电容器的部件之类的印刷陶瓷基板的布线部分的步骤中，由金焊接方法或类似于待接线的布线部分的部分。在形成焊盘并且在导电粘合剂被印刷之前，进行热处理以在布线部分和焊盘之间引起热扩散以提高它们之间的可接合性。

2. 发明授权

US06731001B2 Semiconductor device including bonded wire based to electronic part and method for manufacturing the same 有权
标题翻译：包括基于电子部件的接合线的半导体装置及其制造方法
公开(公告)号：US06731001B2
公开(公告)日：2004-05-04
申请号：US09918803
申请日：2001-08-01
申请人： Kan Kinouchi , Mitsuhiro Saitou , Takashi Nagasaka , Yuji Ootani , Hiroyuki Yamakawa , Koji Takeuchi , Hirokazu Imai , Yukihiro Maeda , Atsushi Kanamori
发明人： Kan Kinouchi , Mitsuhiro Saitou , Takashi Nagasaka , Yuji Ootani , Hiroyuki Yamakawa , Koji Takeuchi , Hirokazu Imai , Yukihiro Maeda , Atsushi Kanamori
IPC分类号： H01L2352
CPC分类号： H01L23/24 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01014 , H01L2924/01019 , H01L2924/01028 , H01L2924/01077 , H01L2924/01079 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H01L2924/20753 , H01L2924/2076 , H05K1/0306 , H05K1/141 , H05K3/284 , H05K3/366 , H01L2924/00014 , H01L2924/00012 , H01L2224/92247 , H01L2924/00
摘要： Several electronic parts are mounted on several ceramic substrates in a semiconductor device, and are wire bonded to the respective ceramic substrates through bonding wires. The electronic parts and the bonding wires are covered with an enclosing member on every ceramic substrate, and an inside of the enclosing member is filled with silicone gel for sealing. The ceramic substrates are bonded to a radiation fin together, and are mounted on a motherboard perpendicularly to the motherboard.
摘要翻译：几个电子部件安装在半导体器件中的多个陶瓷基板上，并且通过接合线引线接合到相应的陶瓷基板。电子部件和接合线在每个陶瓷基板上被封闭构件覆盖，并且封装构件的内部填充有用于密封的硅凝胶。陶瓷基板一起结合到散热片上，并垂直于母板安装在母板上。

3. 发明授权

US06645606B2 Electrical device having metal pad bonded with metal wiring and manufacturing method thereof 有权
公开(公告)号：US06645606B2
公开(公告)日：2003-11-11
申请号：US10120527
申请日：2002-04-12
申请人： Tetsuo Nakano , Yukihiro Maeda , Yasutomi Asai , Takashi Nagasaka
发明人： Tetsuo Nakano , Yukihiro Maeda , Yasutomi Asai , Takashi Nagasaka
IPC分类号： B32B1500
CPC分类号： H05K3/244 , H01L23/49811 , H01L23/538 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05147 , H01L2224/05599 , H01L2224/05644 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48644 , H01L2224/48647 , H01L2224/48699 , H01L2224/48747 , H01L2224/73265 , H01L2224/85444 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19105 , H05K3/245 , H05K3/328 , Y10T428/12493 , Y10T428/12514 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2224/48744
摘要： A substrate has a first surface and a second surface. A plurality of pads is formed on the first surfaces. Each pads has a Cu plating layer and an Au plating layer that is directly formed on the Cu plating layer. Al wiring or Au wiring is bonded with the pads. The thickness of the Au plating layer that is bonded with the Al wiring is less than 0.5 &mgr;m. Thickness of the Au plating layer that is bonded with the Au wiring is 0.05 &mgr;m or more.

4. 发明授权

US6079610A Wire bonding method 失效
标题翻译：接线方式
公开(公告)号：US6079610A
公开(公告)日：2000-06-27
申请号：US944822
申请日：1997-10-06
申请人： Yukihiro Maeda , Takashi Nagasaka , Toshio Suzuki
发明人： Yukihiro Maeda , Takashi Nagasaka , Toshio Suzuki
IPC分类号： H01L21/60 , B23K20/00 , H01L21/607 , B23K31/00 , B23K31/02 , B23K1/06 , B23K5/20
CPC分类号： H01L24/85 , B23K20/005 , H01L24/48 , B23K2201/40 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/4848 , H01L2224/48599 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/85181 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85951 , H01L2224/85986 , H01L2224/92247 , H01L24/45 , H01L24/73 , H01L24/78 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15787
摘要： A ball is formed at the tip of a wire projecting from a capillary. The capillary is positioned above an interconnection, and ball bonding forms a bump on the interconnection. The capillary is then moved next to the bump and wedge bonding is carried out. Next, the capillary is moved upward and another ball is formed at the tip of the wire, and the wire is primary bonded to a bonding pad of a semiconductor chip. The wire is then looped and the capillary is positioned above the bump, and secondary bonding is carried out. As a result, the formation of tails on the bump is prevented.
摘要翻译：在从毛细管突出的线的尖端处形成球。毛细管位于互连上方，球形接合在互连上形成凸块。然后将毛细管移动到凸起旁边并进行楔形结合。接下来，毛细管向上移动，另一个球形成在线的末端，并且导线初始接合到半导体芯片的焊盘。然后将导线环绕并且毛细管位于凸块上方，并进行二次接合。结果，防止在凸块上形成尾部。

5. 发明授权

US07209367B2 Electronic apparatus and method for manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US07209367B2
公开(公告)日：2007-04-24
申请号：US11402881
申请日：2006-04-13
申请人： Tetsuo Nakano , Yukihiro Maeda
发明人： Tetsuo Nakano , Yukihiro Maeda
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/3405 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/19107 , H05K3/0061 , H05K3/3415 , H05K3/3421 , H05K5/0069 , H05K2201/09745 , H05K2201/10189 , H05K2201/10446 , H05K2203/0173 , H01L2224/0401
摘要： An electronic apparatus has a wiring board and connector units which are mounted at a case unit. The connector unit has an external connection surface connected with the external and a terminal installation surface, which is substantially flat and positioned at an opposite side to the external connection surface. A terminal of the connector unit is electrically connected with a pad positioned at a first surface of the wiring board via a connection member. The wiring board and the connector unit which are integrated are mounted at the case unit, with the first surface and the terminal installation surface facing the case unit. The case unit has an installation surface at which a recess for accommodating therein the connection member is arranged.
摘要翻译：电子设备具有安装在壳体单元上的布线板和连接器单元。连接器单元具有与外部连接的外部连接表面和终端安装表面，其基本平坦并且位于与外部连接表面相对的一侧。连接器单元的端子经由连接构件与位于布线板的第一表面的焊盘电连接。集成的布线板和连接器单元安装在壳体单元处，第一表面和端子安装表面面向壳体单元。壳体单元具有安装表面，在该安装表面上设置用于容纳连接构件的凹部。

6. 发明授权

US5657203A Electronic device having a plurality of circuit boards arranged therein 失效
标题翻译：具有布置在其中的多个电路板的电子设备
公开(公告)号：US5657203A
公开(公告)日：1997-08-12
申请号：US400258
申请日：1995-03-06
申请人： Yasunobu Hirao , Takashi Nagasaka , Hidekazu Katsuyama , Makoto Koyama , Yuji Motoyama , Mamoru Urushizaki , Yukihiro Maeda
发明人： Yasunobu Hirao , Takashi Nagasaka , Hidekazu Katsuyama , Makoto Koyama , Yuji Motoyama , Mamoru Urushizaki , Yukihiro Maeda
IPC分类号： H01L25/00 , H01L21/48 , H01L23/498 , H01L23/50 , H01L25/04 , H01L25/07 , H01L25/16 , H01L25/18 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H05K5/0043 , H05K5/0056 , H05K5/064 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/1627 , H01L2924/181 , H01L2924/19041
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

7. 发明授权

US5646827A Electronic device having a plurality of circuit boards arranged therein 失效
公开(公告)号：US5646827A
公开(公告)日：1997-07-08
申请号：US400241
申请日：1995-03-06
申请人： Yasunobu Hirao , Takashi Nagasaka , Yuji Motoyama , Yukihiro Maeda
发明人： Yasunobu Hirao , Takashi Nagasaka , Yuji Motoyama , Yukihiro Maeda
IPC分类号： H01L23/498 , H01L25/16 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H05K5/064 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K5/0043 , H05K5/0056 , H01L2224/48091 , H01L2924/13091 , H01L2924/1627 , H05K1/144
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

8. 发明授权

US5408383A Container for electronic devices having a plurality of circuit boards 失效
标题翻译：具有多个电路板的电子设备的容器
公开(公告)号：US5408383A
公开(公告)日：1995-04-18
申请号：US118785
申请日：1993-09-10
申请人： Takashi Nagasaka , Yuji Motoyama , Yasunobu Hirao , Makoto Koyama , Mamoru Urushizaki , Hidekazu Katsuyama , Yukihiro Maeda
发明人： Takashi Nagasaka , Yuji Motoyama , Yasunobu Hirao , Makoto Koyama , Mamoru Urushizaki , Hidekazu Katsuyama , Yukihiro Maeda
IPC分类号： H01L21/48 , H01L23/498 , H01L25/16 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H05K5/064 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K1/144 , H05K5/0043 , H05K5/0056 , H05K5/0069 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19041
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

9. 发明申请

US20060234528A1 Electronic apparatus and method for manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20060234528A1
公开(公告)日：2006-10-19
申请号：US11402881
申请日：2006-04-13
申请人： Tetsuo Nakano , Yukihiro Maeda
发明人： Tetsuo Nakano , Yukihiro Maeda
IPC分类号： H05K1/00
CPC分类号： H05K3/3405 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2924/19107 , H05K3/0061 , H05K3/3415 , H05K3/3421 , H05K5/0069 , H05K2201/09745 , H05K2201/10189 , H05K2201/10446 , H05K2203/0173 , H01L2224/0401
摘要： An electronic apparatus has a wiring board and connector units which are mounted at a case unit. The connector unit has an external connection surface connected with the external and a terminal installation surface, which is substantially flat and positioned at an opposite side to the external connection surface. A terminal of the connector unit is electrically connected with a pad positioned at a first surface of the wiring board via a connection member. The wiring board and the connector unit which are integrated are mounted at the case unit, with the first surface and the terminal installation surface facing the case unit. The case unit has an installation surface at which a recess for accommodating therein the connection member is arranged.
摘要翻译：电子设备具有安装在壳体单元上的布线板和连接器单元。连接器单元具有与外部连接的外部连接表面和终端安装表面，其基本平坦并且位于与外部连接表面相对的一侧。连接器单元的端子经由连接构件与位于布线板的第一表面的焊盘电连接。集成的布线板和连接器单元安装在壳体单元处，第一表面和端子安装表面面向壳体单元。壳体单元具有安装表面，在该安装表面上设置用于容纳连接构件的凹部。

10. 发明申请

US20100085395A1 Inkjet image-forming apparatus and method for printing 有权
标题翻译：喷墨成像设备和印刷方法
公开(公告)号：US20100085395A1
公开(公告)日：2010-04-08
申请号：US12588110
申请日：2009-10-05
申请人： Tomohiko Shimoda , Yukihiro Maeda , Kenji Oshima
发明人： Tomohiko Shimoda , Yukihiro Maeda , Kenji Oshima
IPC分类号： B41J29/38
CPC分类号： B41J2/175 , B41J2/04528 , B41J2/04553 , B41J2/04581 , B41J2/04588 , B41J2/04595 , B41J2/04596
摘要： An image forming apparatus including: a print-job controller configured to receive a print job and control a printing operation based on the received print job; an ink-ejection driver configured to output a driving signal on the basis of the print job; an ink ejector configured to eject ink onto a paper sheet on the basis of the driving signal outputted by the ink-ejection driver; and an ink-temperature measuring unit configured to measure an ink temperature. When the ink temperature measured by the ink-temperature measuring unit is equal to or higher than a first reference temperature, the ink-ejection driver outputs a driving signal of a first voltage. When the ink temperature measured by the ink-temperature measuring unit is lower than the first reference temperature and is equal to or higher than a second reference temperature that is lower than the first reference temperature, the print-job controller performs the printing operation as long as predetermined conditions are satisfied for suppressing lowering of print quality possibly caused by ink ejection based on a driving signal of a second voltage that is higher than the first voltage and the ink-ejection driver outputs the driving signal of the second voltage while the printing operation is being performed.
摘要翻译：一种图像形成装置，包括：打印作业控制器，被配置为接收打印作业并基于所接收的打印作业来控制打印操作; 喷墨驱动器，被配置为基于所述打印作业来输出驱动信号; 墨水喷射器，被配置为基于由喷墨驱动器输出的驱动信号将墨水喷射到纸张上; 以及墨水温度测量单元，其被配置为测量墨水温度。当由油墨温度测量单元测量的油墨温度等于或高于第一参考温度时，喷墨驱动器输出第一电压的驱动信号。当由油墨温度测量单元测量的油墨温度低于第一参考温度并且等于或高于低于第一参考温度的第二参考温度时，打印作业控制器执行打印操作由于根据高于第一电压的第二电压的驱动信号来抑制可能由喷墨引起的打印质量的降低的预定条件，并且喷墨驱动器在打印操作期间输出第二电压的驱动信号正在执行。

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