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1. 发明授权

US5657203A Electronic device having a plurality of circuit boards arranged therein 失效
标题翻译：具有布置在其中的多个电路板的电子设备
公开(公告)号：US5657203A
公开(公告)日：1997-08-12
申请号：US400258
申请日：1995-03-06
申请人： Yasunobu Hirao , Takashi Nagasaka , Hidekazu Katsuyama , Makoto Koyama , Yuji Motoyama , Mamoru Urushizaki , Yukihiro Maeda
发明人： Yasunobu Hirao , Takashi Nagasaka , Hidekazu Katsuyama , Makoto Koyama , Yuji Motoyama , Mamoru Urushizaki , Yukihiro Maeda
IPC分类号： H01L25/00 , H01L21/48 , H01L23/498 , H01L23/50 , H01L25/04 , H01L25/07 , H01L25/16 , H01L25/18 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H05K5/0043 , H05K5/0056 , H05K5/064 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/1627 , H01L2924/181 , H01L2924/19041
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

2. 发明授权

US5408383A Container for electronic devices having a plurality of circuit boards 失效
标题翻译：具有多个电路板的电子设备的容器
公开(公告)号：US5408383A
公开(公告)日：1995-04-18
申请号：US118785
申请日：1993-09-10
申请人： Takashi Nagasaka , Yuji Motoyama , Yasunobu Hirao , Makoto Koyama , Mamoru Urushizaki , Hidekazu Katsuyama , Yukihiro Maeda
发明人： Takashi Nagasaka , Yuji Motoyama , Yasunobu Hirao , Makoto Koyama , Mamoru Urushizaki , Hidekazu Katsuyama , Yukihiro Maeda
IPC分类号： H01L21/48 , H01L23/498 , H01L25/16 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H05K5/064 , H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K1/144 , H05K5/0043 , H05K5/0056 , H05K5/0069 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/1627 , H01L2924/181 , H01L2924/19041
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

3. 发明授权

US5586389A Method for producing multi-board electronic device 失效
标题翻译：制造多板电子设备的方法
公开(公告)号：US5586389A
公开(公告)日：1996-12-24
申请号：US400242
申请日：1995-03-06
申请人： Yasunobu Hirao , Makoto Koyama , Yuji Motoyama
发明人： Yasunobu Hirao , Makoto Koyama , Yuji Motoyama
IPC分类号： H01L25/00 , H01L21/48 , H01L23/498 , H01L23/50 , H01L25/16 , H05K1/14 , H05K5/00 , H05K3/30 , H01R43/24 , H05K3/36
CPC分类号： H01L21/4842 , H01L23/49811 , H01L23/49861 , H01L25/162 , H01L25/165 , H05K1/144 , H05K5/0043 , H05K5/0056 , H05K5/064 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H01L2924/1627 , H01L2924/19041 , Y10T29/49121 , Y10T29/49126 , Y10T29/49146 , Y10T29/49158
摘要： In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.
摘要翻译：为了提供具有高封装密度并且可以促进其中的多个电路板之间的电连接的电子器件，电子器件包括具有通过主平面的两个相互相对的开口的框架，布置在框架中的多个电路板平行并分别安装所选择的电子电路，以及用于封闭主平面中的开口的第一和第二闭合盖; 第一闭合盖与至少一个电路板的表面接触，在其上没有安装电子电路。另外，在框架的内壁上; 形成用于支撑封闭盖构件，支撑板，电路板等的适当的阶梯部分。此外，在阶梯部分中，设置容纳多余粘合剂的部分。

4. 发明申请

US20100204202A1 DRUG FOR ALLEVIATING MOTOR COMPLICATIONS OR PSYCHIATRIC SYMPTOMS OF PARKINSON'S DISEASE 审中-公开
标题翻译：用于表达PARCINSON疾病的电机综合症或心理症状的药物
公开(公告)号：US20100204202A1
公开(公告)日：2010-08-12
申请号：US12673786
申请日：2008-11-28
申请人： Yoshihiro Tani , Makoto Koyama
发明人： Yoshihiro Tani , Makoto Koyama
IPC分类号： A61K31/553 , A61P25/14 , A61P25/16
CPC分类号： C07D413/14 , A61K31/198 , A61K31/553 , A61K45/06 , A61K2300/00
摘要： A drug containing a compound having the formula (I): or a pharmacologically acceptable salt thereof or their hydrates, which alleviates motor complications associated with a treatment with levodopa for Parkinson's disease, delays the onset of motor complications associated with a treatment with levodopa, and inhibiting or delaying the advance of symptoms of Parkinson's disease is provided. The compound having the formula (I) has a serotonin 1A receptor partial agonist action, does not have an antagonist action against dopamine D2 receptors, has an agonist action against dopamine D3 receptors, has an effect of alleviation and delay of onset of motor complications associated with repeated doses of levodopa and, further, is also effective against associated with psychiatric symptoms in advanced stage Parkinson's disease patients.
摘要翻译：含有具有式（I）化合物或其药理学上可接受的盐或其水合物的药物可缓解与用于帕金森病的左旋多巴治疗相关的运动并发症延迟了与左旋多巴治疗相关的运动并发症的发作，以及提供抑制或延缓帕金森病症状的进展。具有式（I）的化合物具有5-羟色胺1A受体部分激动剂作用，不具有针对多巴胺D2受体的拮抗作用，具有针对多巴胺D3受体的激动剂作用，具有减轻和延迟运动并发症发作相关的作用重复剂量的左旋多巴，此外，还有效抵抗晚期帕金森病患者的精神症状。

5. 发明申请

US20090258207A1 Biaxially Oriented Film Laminated Board, Electrical Insulation Board and Machine Part 有权
标题翻译：双轴取向膜层压板，电绝缘板和机器零件
公开(公告)号：US20090258207A1
公开(公告)日：2009-10-15
申请号：US12085552
申请日：2006-11-21
申请人： Shinichiro Miyaji , Makoto Koyama , Miyoshi Yokura
发明人： Shinichiro Miyaji , Makoto Koyama , Miyoshi Yokura
IPC分类号： B32B5/00
CPC分类号： B32B27/36 , B29C55/143 , B29K2067/00 , B29K2081/04 , B32B27/00 , B32B27/16 , B32B38/0012 , B32B2037/0092 , B32B2038/0028 , B32B2307/206 , B32B2309/02 , B32B2309/105 , B32B2367/00 , B32B2607/00 , Y10T428/266
摘要： Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical in sulation, mechanical strength, flexibility and workability can be obtained.
摘要翻译：公开了一种厚度为0.5mm以上的双轴取向膜叠层板，其中由多层条件层叠由熔点为240℃以上的树脂组合物构成的双轴取向膜，而不在其间插入粘合剂。该双轴取向膜层压板的特征在于，当将板冲压成矩形时，纵向和横向的断裂伸长率的最小值为25％以上。还公开了各自使用层压板的电绝缘板和机器部件。可以获得具有包括耐热性，电气调节性，机械强度，柔韧性和可加工性的双轴取向膜性质的层压板。

6. 发明授权

US08178195B2 Biaxially oriented film laminated board, electrical insulation board and machine part 有权
标题翻译：双向取向膜层压板，电气绝缘板和机器部分
公开(公告)号：US08178195B2
公开(公告)日：2012-05-15
申请号：US12085552
申请日：2006-11-21
申请人： Shinichiro Miyaji , Makoto Koyama , Miyoshi Yokura
发明人： Shinichiro Miyaji , Makoto Koyama , Miyoshi Yokura
IPC分类号： B32B7/02
CPC分类号： B32B27/36 , B29C55/143 , B29K2067/00 , B29K2081/04 , B32B27/00 , B32B27/16 , B32B38/0012 , B32B2037/0092 , B32B2038/0028 , B32B2307/206 , B32B2309/02 , B32B2309/105 , B32B2367/00 , B32B2607/00 , Y10T428/266
摘要： Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical insulation, mechanical strength, flexibility and workability can be obtained.
摘要翻译：公开了一种厚度为0.5mm以上的双轴取向膜叠层板，其中由多层条件层叠由熔点为240℃以上的树脂组合物构成的双轴取向膜，而不在其间插入粘合剂。该双轴取向膜层压板的特征在于，当将板冲压成矩形时，纵向和横向的断裂伸长率的最小值为25％以上。还公开了各自使用层压板的电绝缘板和机器部件。可以获得具有包括耐热性，电绝缘性，机械强度，柔韧性和可加工性的双轴取向膜性质的层压板。

7. 发明授权

US07094715B2 Non-halogen series floor material 有权
标题翻译：非卤素系列地板材料
公开(公告)号：US07094715B2
公开(公告)日：2006-08-22
申请号：US10695450
申请日：2003-10-29
申请人： Eiji Sakaguchi , Makoto Koyama , Junichi Takeda , Yoshiharu Nishino , Hiroaki Ishii
发明人： Eiji Sakaguchi , Makoto Koyama , Junichi Takeda , Yoshiharu Nishino , Hiroaki Ishii
IPC分类号： B32B5/06 , B32B5/26
CPC分类号： B32B27/20 , B32B5/30 , B32B7/02 , B32B25/10 , B32B27/32 , B32B2309/105 , B32B2323/10 , B32B2419/04 , E04F15/16 , Y10T428/2495 , Y10T428/24975 , Y10T428/26 , Y10T428/263 , Y10T428/266 , Y10T428/268 , Y10T428/269 , Y10T442/3886 , Y10T442/678 , Y10T442/699
摘要： A non-halogen series floor material includes a first intermediate resin layer containing filler of 100 to 400 mass parts with respect to resin ingredient of 100 mass parts, the resin ingredient consisting essentially of resin having no chlorine atom in chemical structure, a surface resin layer integrally formed at an upper surface side of the first intermediate resin layer, the surface resin layer containing resin having no chloride atom in chemical structure and having a thickness of 100 to 1,000 μm, a second intermediate resin layer integrally formed at a lower surface side of the first intermediate resin layer, the second intermediate resin layer containing resin having no chloride atom in chemical structure and filler of 0 to 200 mass parts with respect to resin ingredient of 100 mass parts, and a backing layer integrally formed at a lower surface side of the second intermediate resin layer, the backing layer being formed of a fibrous fabric constituted by fibers containing resin having no chloride atom in chemical structure. A content ratio of the filler in the second intermediate resin layer with respect to the resin ingredient thereof is smaller than a content ratio of the filler in the first intermediate resin layer with respect to the resin ingredient thereof. A thickness of the second intermediate resin layer is 100 μm or more. A thickness of the second intermediate resin layer is 50% or less of a total thickness of three resin layers.
摘要翻译：非卤素系列地板材料包括相对于100质量份的树脂成分含有100〜400质量份的填料的第一中间树脂层，所述树脂成分基本上由化学结构中没有氯原子的树脂组成，表面树脂层一体地形成在第一中间树脂层的上表面侧，表面树脂层含有化学结构中没有氯原子的树脂，其厚度为100-1000μm，在第一中间树脂层的下表面一体形成的第二中间树脂层第一中间树脂层，含有化学结构中不含氯原子的树脂的第二中间树脂层和相对于100质量份的树脂成分为0〜200质量份的填料，以及在第一中间树脂层的下表面侧一体形成的背衬层第二中间树脂层，背衬层由由含树脂的纤维构成的纤维织物形成化学结构中没有氯原子。第二中间树脂层中的填料相对于树脂成分的含有率小于第一中间树脂层中的填料相对于树脂成分的含有比例。第二中间树脂层的厚度为100μm以上。第二中间树脂层的厚度为三层树脂层的总厚度的50％以下。

8. 发明申请

US20050095412A1 Non-halogen series floor material 有权
标题翻译：非卤素系列地板材料
公开(公告)号：US20050095412A1
公开(公告)日：2005-05-05
申请号：US10695450
申请日：2003-10-29
申请人： Eiji Sakaguchi , Makoto Koyama , Junichi Takeda , Yoshiharu Nishino , Hiroaki Ishii
发明人： Eiji Sakaguchi , Makoto Koyama , Junichi Takeda , Yoshiharu Nishino , Hiroaki Ishii
IPC分类号： B32B5/30 , B32B7/02 , E04F15/16 , B32B1/00 , B32B27/32
CPC分类号： B32B27/20 , B32B5/30 , B32B7/02 , B32B25/10 , B32B27/32 , B32B2309/105 , B32B2323/10 , B32B2419/04 , E04F15/16 , Y10T428/2495 , Y10T428/24975 , Y10T428/26 , Y10T428/263 , Y10T428/266 , Y10T428/268 , Y10T428/269 , Y10T442/3886 , Y10T442/678 , Y10T442/699
摘要： A non-halogen series floor material includes a first intermediate resin layer containing filler of 100 to 400 mass parts with respect to resin ingredient of 100 mass parts, the resin ingredient consisting essentially of resin having no chlorine atom in chemical structure, a surface resin layer integrally formed at an upper surface side of the first intermediate resin layer, the surface resin layer containing resin having no chloride atom in chemical structure and having a thickness of 100 to 1,000 μm, a second intermediate resin layer integrally formed at a lower surface side of the first intermediate resin layer, the second intermediate resin layer containing resin having no chloride atom in chemical structure and filler of 0 to 200 mass parts with respect to resin ingredient of 100 mass parts, and a backing layer integrally formed at a lower surface side of the second intermediate resin layer, the backing layer being formed of a fibrous fabric constituted by fibers containing resin having no chloride atom in chemical structure. A content ratio of the filler in the second intermediate resin layer with respect to the resin ingredient thereof is smaller than a content ratio of the filler in the first intermediate resin layer with respect to the resin ingredient thereof. A thickness of the second intermediate resin layer is 100 μm or more. A thickness of the second intermediate resin layer is 50% or less of a total thickness of three resin layers.
摘要翻译：非卤素系列地板材料包括相对于100质量份的树脂成分含有100〜400质量份的填料的第一中间树脂层，所述树脂成分基本上由化学结构中没有氯原子的树脂组成，表面树脂层一体地形成在第一中间树脂层的上表面侧，表面树脂层含有化学结构中没有氯原子的树脂，其厚度为100-1000μm，在第一中间树脂层的下表面一体形成的第二中间树脂层第一中间树脂层，含有化学结构中不含氯原子的树脂的第二中间树脂层和相对于100质量份的树脂成分为0〜200质量份的填料，以及在第一中间树脂层的下表面侧一体形成的背衬层第二中间树脂层，背衬层由由含树脂的纤维构成的纤维织物形成化学结构中没有氯原子。第二中间树脂层中的填料相对于树脂成分的含有率小于第一中间树脂层中的填料相对于树脂成分的含有比例。第二中间树脂层的厚度为100μm以上。第二中间树脂层的厚度为三层树脂层的总厚度的50％以下。

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