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1. 发明授权

US06302312B1 Bonding apparatus and method 失效
标题翻译：接合装置及方法
公开(公告)号：US06302312B1
公开(公告)日：2001-10-16
申请号：US09322801
申请日：1999-05-27
申请人： Kuniyuki Takahashi , Hijiri Hayashi
发明人： Kuniyuki Takahashi , Hijiri Hayashi
IPC分类号： B23K2010
CPC分类号： H01L24/80 , B23K20/10 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082
摘要： Instead of using the ordinary pulse train command inputted from a computer to the control circuit, an offset signal outputted from an offset compensation circuit is employed for performing scrubbing of a bonding surface of, for instance, a semiconductor device. The offset compensation circuit controls a DC motor in drive amounts smaller than the resolution of the DC motor which moves an XY table having a bonding tool which performs the scrubbing, and the drive amounts smaller than the resolution outputted from the offset compensation circuit are controlled by a computer.
摘要翻译：代替使用从计算机输入到控制电路的普通脉冲串命令，从偏移补偿电路输出的偏移信号用于擦除例如半导体器件的接合表面。偏移补偿电路控制直流电动机的驱动量小于直流电动机的分辨率，该直流电动机移动具有执行擦洗的接合工具的XY工作台，并且小于由偏移补偿电路输出的分辨率的驱动量由一台电脑。

2. 发明授权

US06299051B1 Bonding method of electronic parts employing ultrasonic coupling oscillation 有权
标题翻译：采用超声耦合振荡的电子零件的接合方法
公开(公告)号：US06299051B1
公开(公告)日：2001-10-09
申请号：US09533078
申请日：2000-03-22
申请人： Jiromaru Tsujino
发明人： Jiromaru Tsujino
IPC分类号： B23K2010
CPC分类号： B23K20/106 , H01L24/75 , H01L24/81 , H01L24/95 , H01L2924/14 , H01L2924/00
摘要： An object of the present invention is to provide a sealing method by which an excellent bonding may be realized without thermal shock by bonding at a normal temperature due to ultrasonic coupling oscillation to seal a small size of surface mounting type quartz oscillator or the like. A bonding face (1a) of a sealing metal cap (1) is positioned on a bonded face (2a) of a package substrate (2), and ultrasonic oscillations of different directions are simultaneously imparted in the bonding plane while a suitable load is applied from an upper or a lower part of the bonding portion to the plane in a vertical direction so that the sealing metal cap (1) and the package substrate (2) are welded and fixed to be sealed on the bonding face.
摘要翻译：本发明的目的是提供一种密封方法，通过这种密封方法，可以通过超声耦合振荡在常温下进行结合而不发生热冲击，从而密封小尺寸的表面安装型石英振荡器等。密封金属盖（1）的接合面（1a）位于封装基板（2）的接合面（2a）上，并且在施加适当的负载的同时，在接合面上同时施加不同方向的超声波振荡从接合部分的上部或下部到垂直方向的平面，使得密封金属盖（1）和封装基板（2）被焊接和固定以密封在接合面上。

3. 发明授权

US06705508B2 Friction stir welding method, and method for manufacturing car body 失效
标题翻译：摩擦搅拌焊接方法，车身制造方法
公开(公告)号：US06705508B2
公开(公告)日：2004-03-16
申请号：US10084420
申请日：2002-02-28
申请人： Masakuni Ezumi , Kazushige Fukuyori
发明人： Masakuni Ezumi , Kazushige Fukuyori
IPC分类号： B23K2010
CPC分类号： B23K20/126 , B23K20/1245 , B23K20/1265 , B23K20/128 , B23K20/24 , Y10T428/12493
摘要： A cutting tool 60 cuts along the butted portion between two members 10, 20. A filling material 30 is inserted to the gap 40 formed by said cutting, and a roller 70 presses protrusions 12 and 22 to crimp said protrusions 12 and 22 so as to fix said filling material to position. Next, friction stir welding is performed to the protrusions 12, 22 and the filling material 30 using a rotary tool 80. In another example, instead of cutting, the filling material can be welded and filled to the gap. In yet another example, cutting can be performed so as to approximate the two members before performing the friction stir welding step.
摘要翻译：切割工具60沿着两个构件10,20之间的对接部分切割。填充材料30插入到通过所述切割形成的间隙40中，并且辊70按压突起12和22以压接所述突起12和22，以便将填充材料固定到位置。接下来，使用旋转工具80对突起12,22和填充材料30进行摩擦搅拌焊接。在另一示例中，代替切割，可以将填充材料焊接并填充到间隙中。在另一个例子中，可以在进行摩擦搅拌焊接步骤之前进行切割以便近似两个部件。

4. 发明授权

US06619532B2 Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 有权
标题翻译：利用超声波能量来减少已知好的模具或永久接触系统中的初始接触力的方法
公开(公告)号：US06619532B2
公开(公告)日：2003-09-16
申请号：US10196666
申请日：2002-07-15
申请人： David R. Hembree , Michael E. Hess , John O. Jacobson , Warren M. Farnworth , Alan G. Wood
发明人： David R. Hembree , Michael E. Hess , John O. Jacobson , Warren M. Farnworth , Alan G. Wood
IPC分类号： B23K2010
CPC分类号： B23K20/10 , B23K2101/38
摘要： A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.
摘要翻译：用于将互连的穿刺型导电接触构件接合到裸半导体管芯的接合焊盘的机器和方法包括使用安装成振动模具和互连中的一个或两者的一个或两个超声波振动器。超声能量的短轴向线性爆发使得接触构件能够以低得多的压缩力在接合焊盘的表面上刺穿硬氧化物层并且迅速地实现完全的穿透深度。

5. 发明授权

US06299052B1 Anti-slide splice welder 有权
标题翻译：防滑焊接机
公开(公告)号：US06299052B1
公开(公告)日：2001-10-09
申请号：US09606251
申请日：2000-06-28
申请人： John Wnek , James Markus
发明人： John Wnek , James Markus
IPC分类号： B23K2010
CPC分类号： B23K20/10 , B23K2101/32
摘要： An ultrasonic welder for splicing a plurality of workpieces has four anvils, each formed with a meeting surface and displaceable to form a workpiece nest, which has a rectangular shape of a predetermined width. The width of the workpiece nest is sufficient to receive only at least one vertical column of workpieces to be welded, so as to produce a vertical splice. The ultrasonic welder further has a controller controlling a starting position of tooling, which forms the predetermined width of the workpiece nest, and displacing at least one of tools, which form side faces of the nest in reciprocal and time controlled manner. The displaceable tool is brought back to its starting position corresponding to the predetermined width of the workpiece nest before a new bundle of workpieces is loaded therein.
摘要翻译：用于拼接多个工件的超声波焊接机具有四个砧座，每个砧座形成有会合表面，并且可移位以形成具有预定宽度的矩形形状的工件嵌套。工件嵌套的宽度足以只容纳至少一个待焊接的垂直工件列，以便产生垂直接头。超声波焊接机还具有控制工具的起始位置的控制器，其形成工件嵌套的预定宽度，并且以倒数和时间控制方式移位形成嵌套的侧面的工具中的至少一个。在将新的工件束装入其中之前，可移位工具被带回到与工件嵌套的预定宽度对应的起始位置。

6. 发明授权

US06776323B2 Sonotrode for ultrasound welding of plastics 有权
标题翻译： Sonotrode超声波焊接塑料
公开(公告)号：US06776323B2
公开(公告)日：2004-08-17
申请号：US10126524
申请日：2002-04-22
申请人： Gerhard Schmidt
发明人： Gerhard Schmidt
IPC分类号： B23K2010
CPC分类号： B29C65/08 , B29C66/21 , B29C66/232 , B29C66/73921 , B29C66/81433 , B29L2009/006 , B29L2009/008
摘要： A sonotrode for an ultrasonic welding device has an ultrasound generator that supplies high-frequency electrical energy to a converter that converts this energy into mechanical vibrations and conveys the latter, optionally via a booster, to a sonotrode (2). The sonotrode (2) is formed with a contact surface (3). In order to avoid troublesome sink marks, pegs (1) are arranged on the contact surface (3).
摘要翻译：用于超声波焊接装置的超声波发生器具有超声波发生器，其将高频电能提供给转换器，该转换器将该能量转换成机械振动，并将后者可选地通过增压器传送到超声波发生器（2）。超声波发生器（2）形成有接触表面（3）。为了避免麻烦的凹痕，钉（1）布置在接触表面（3）上。

7. 发明授权

US06523734B1 Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules 有权
标题翻译：用于接合布线板和制造数据载体的方法以及用于安装电子部件模块的装置
公开(公告)号：US06523734B1
公开(公告)日：2003-02-25
申请号：US09591346
申请日：2000-06-09
申请人： Wakahiro Kawai , Masanobu Okada
发明人： Wakahiro Kawai , Masanobu Okada
IPC分类号： B23K2010
CPC分类号： G06K19/07718 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01R12/52 , H01R43/0207 , H05K3/328 , H05K3/361 , H05K2203/0195 , H05K2203/0285 , H05K2203/065
摘要： A method for joining a first wiring board covered with a conductive pattern on a surface of a thin resin basic plate to a second wiring board covered with a conductive pattern on a thin resin basic plate to ensure the electric connection therebetween, including the steps of putting said first and second wiring boards together in a confront relationship so as to adjust join predetermined portions on the conductive patterns, catching the join predetermined portions in the status by a pair of ultrasonic welding tools, and applying an ultrasonic vibration to said ultrasonic welding tools to weld the conductive metals located on the join predetermined portions.
摘要翻译：一种在薄树脂基板的表面上将由导电图案覆盖的第一布线板连接到覆盖有导电图案的第二布线板的方法，以确保其间的电连接，包括以下步骤：所述第一和第二布线板一起处于对置关系，以便调整连接在导电图案上的预定部分，通过一对超声波焊接工具捕捉状态中的预定部分，并将超声波振动施加到所述超声波焊接工具焊接位于连接预定部分上的导电金属。

8. 发明授权

US06422448B1 Ultrasonic horn for a bonding apparatus 有权
公开(公告)号：US06422448B1
公开(公告)日：2002-07-23
申请号：US09822924
申请日：2001-03-30
申请人： Ryuichi Kyomasu , Shinichi Nishiura
发明人： Ryuichi Kyomasu , Shinichi Nishiura
IPC分类号： B23K2010
摘要： An ultrasonic horn used in, for instance, a bonding apparatus, being provided with a capillary attachment hole formed so as to be smaller than the capillary and a jig insertion hole that communicates with the capillary attachment hole. By way of inserting a jig into the jig insertion hole, the jig insertion hole is pushed open that causes the capillary attachment hole to be widened, so that the capillary is inserted and received in this enlarged capillary attachment hole. The capillary is fastened in place by the elastic force that is generated when the capillary attachment hole returns to its original shape, and the capillary is held in the horn main body without using any fastening tools.

9. 发明授权

US06419143B2 Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems 有权
公开(公告)号：US06419143B2
公开(公告)日：2002-07-16
申请号：US09921621
申请日：2001-08-03
申请人： David R. Hembree , Michael E. Hess , John O. Jacobson , Warren M. Farnworth , Alan G. Wood
发明人： David R. Hembree , Michael E. Hess , John O. Jacobson , Warren M. Farnworth , Alan G. Wood
IPC分类号： B23K2010
CPC分类号： B23K20/10 , B23K2101/38
摘要： A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

10. 发明授权

US06739493B2 Device with an electrode for the formation of a ball at the end of a wire 失效
标题翻译：具有用于在线末端形成球的电极的装置
公开(公告)号：US06739493B2
公开(公告)日：2004-05-25
申请号：US10454891
申请日：2003-06-05
申请人： Silvan Thuerlemann
发明人： Silvan Thuerlemann
IPC分类号： B23K2010
CPC分类号： H01L24/85 , B23K20/007 , H01L24/78 , H01L2224/78268 , H01L2224/78301 , H01L2224/85045 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2224/48 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： With a device for the formation of a wire ball at the end of a wire an in and out swivelling electrode with an oblong shape is connected to the shaft of a motor directly or indirectly via a connecting piece so that the electrode is essentially rotated on its longitudinal axis when swivelling in and out. The mass inertia of the electrode is low as regards the rotational axis which is why it can be turned with negligible expenditure of energy. On swivelling in and out, the electrode is turned back and forth between a lower limit position in which a surface necessary for creating the spark, the so-called firing lug is located underneath the capillary of the Wire Bonder and an upper limit position in which the firing lug is located laterally elevated next to the capillary.
摘要翻译：利用在线端部形成线球的装置，具有长方形的进出旋转电极通过连接件直接或间接地连接到马达的轴，使得电极基本上在其上旋转纵向轴线在进出时。电极的质量惯性相对于旋转轴度低，这就是为什么可以以可忽略的能量消耗转动的原因。在旋转进出时，电极在产生火花所需的表面的下限位置之间来回转动，即所谓的触发片位于焊线机的毛细管下方，上限位置触发耳片位于旁边毛细管旁边。

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