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1. 发明授权

US08556547B2 Radius end mill 有权
标题翻译：半径立铣刀
公开(公告)号：US08556547B2
公开(公告)日：2013-10-15
申请号：US13138126
申请日：2010-01-13
申请人： Yuji Takagi , Seiichiro Kitaura
发明人： Yuji Takagi , Seiichiro Kitaura
IPC分类号： B23C5/10
CPC分类号： B23C5/10 , B23C2210/084
摘要： An end mill body wiih a corner cutting edge forming a convex arc shape of which the rotation locus becomes convex toward the tip outer peripheral side is formed at a side ridge portion of the corner cutting edge rake face, a gash is formed on the inner peripheral side of the corner cutting edge rake face, and an end cutting edge connected to the corner cutting edge and extending toward the inner peripheral side is formed at a tip-side side ridge portion of the end cutting edge rake face. An intersection line between the corner cutting edge rake face and the end cutting edge rake face is located closer to the radial inner peripheral side with respect to the axis than the center of the convex arc that the corner cutting edge forms in the rotation locus.
摘要翻译：在角切削刃前刀面的侧脊部形成端铣刀体，形成在前刀面外周侧形成有凸起的凸弧形状的角刃，在内周面形成有间隙并且在端部切削刃前刀面的前端侧的隆起部形成有与切削刃连接并向内周侧延伸的端部切削刃。角切削刃前刀面和端切削刃前刀面之间的交线相对于轴线比径向内周侧更靠近转角轨迹中形成的凸弧的中心。

2. 发明申请

US20090232610A1 END MILL 有权
标题翻译：末端铣刀
公开(公告)号：US20090232610A1
公开(公告)日：2009-09-17
申请号：US12400098
申请日：2009-03-09
申请人： Yuji Takagi , Seiichiro Kitaura
发明人： Yuji Takagi , Seiichiro Kitaura
IPC分类号： B26D1/12
CPC分类号： B23C5/10 , B23C2210/0485 , B23C2210/282 , B23C2210/40 , Y10T407/1946 , Y10T407/1948 , Y10T407/1966
摘要： A plurality of chip discharge flutes are located on an outer periphery of a tip portion of the end mill body which rotates on its axis. Helix angles between the axis and the cutting edges in the chip discharge flutes, of which are at least one or more; are different from others. A cross-section perpendicular to the axis shows that a flute bottom face in a main flute portion forms a concavely curved shape from the rake face to a point where the flute bottom face, touches a web thickness circle of the end mill body, forms a linear shape, and goes toward the end mill rotating direction; and a flute bottom face in a sub-flute portion forms a linear shape, intersects with the flute bottom face in the main flute portion at an obtuse angle, goes further toward the end mill rotating direction.
摘要翻译：多个排屑槽位于端铣刀本体的其轴线旋转的末端部分的外周上。芯片排出槽之间的轴与切削刃之间的螺旋角度至少为一个以上; 与其他人不同垂直于轴线的横截面示出了主凹槽部分中的凹槽底面从前刀面形成凹形弯曲形状，其中凹槽底面接触端铣刀体的腹板厚度圆形形成线性形状，朝向立铣刀旋转方向; 并且子槽部分中的凹槽底面形成直线形状，与主凹槽部分中的凹槽底面以钝角相交，进一步朝向端铣刀旋转方向。

3. 发明授权

US07934890B2 End mill 有权
标题翻译：立铣刀
公开(公告)号：US07934890B2
公开(公告)日：2011-05-03
申请号：US12400098
申请日：2009-03-09
申请人： Yuji Takagi , Seiichiro Kitaura
发明人： Yuji Takagi , Seiichiro Kitaura
IPC分类号： B23C5/10 , B26D1/12
CPC分类号： B23C5/10 , B23C2210/0485 , B23C2210/282 , B23C2210/40 , Y10T407/1946 , Y10T407/1948 , Y10T407/1966
摘要： A plurality of chip discharge flutes are located on an outer periphery of a tip portion of the end mill body which rotates on its axis. Helix angles between the axis and the cutting edges in the chip discharge flutes, of which are at least one or more; are different from others. A cross-section perpendicular to the axis shows that a flute bottom face in a main flute portion forms a concavely curved shape from the rake face to a point where the flute bottom face, touches a web thickness circle of the end mill body, forms a linear shape, and goes toward the end mill rotating direction; and a flute bottom face in a sub-flute portion forms a linear shape, intersects with the flute bottom face in the main flute portion at an obtuse angle, goes further toward the end mill rotating direction.
摘要翻译：多个排屑槽位于端铣刀本体的其轴线旋转的末端部分的外周上。芯片排出槽之间的轴与切削刃之间的螺旋角度至少为一个以上; 与其他人不同垂直于轴线的横截面示出了主凹槽部分中的凹槽底面从前刀面形成凹形弯曲形状，其中凹槽底面接触端铣刀体的腹板厚度圆形形成线性形状，朝向立铣刀旋转方向; 并且子槽部分中的凹槽底面形成直线形状，与主凹槽部分中的凹槽底面以钝角相交，进一步朝向端铣刀旋转方向。

4. 发明申请

US20110268513A1 RADIUS END MILL 有权
标题翻译： RADIUS终端铣刀
公开(公告)号：US20110268513A1
公开(公告)日：2011-11-03
申请号：US13138126
申请日：2010-01-13
申请人： Yuji Takagi , Seiichiro Kitaura
发明人： Yuji Takagi , Seiichiro Kitaura
IPC分类号： B23C5/10
CPC分类号： B23C5/10 , B23C2210/084
摘要： Damage to a corner cutting edge or degradation of the roughness of a surface of workpiece caused by changes in the cutting edge strength of the corner cutting edge or variations of cutting load is prevented. A flute (4) is formed at the outer periphery of a tip portion of an end mill body (1) rotated around an axis (O), the tip outer peripheral side of the wall face of the flute which faces a rotational direction (T) is used as a corner cutting edge rake face (11), a corner cutting edge (12) forming a convex arc shape of which the rotation locus becomes convex toward the tip outer peripheral side is formed at a side ridge portion of the corner cutting edge rake face, a gash (7) is formed on the inner peripheral side of the corner cutting edge rake face (11), the wall face of the gash which faces the rotational direction (T) is used as an end cutting edge rake face (8), an end cutting edge (9) connected to the corner cutting edge (12) and extending toward the inner peripheral side is formed at a tip-side side ridge portion of the end cutting edge rake face, and an intersection line (L) between the corner cutting edge rake face (11) and the end cutting edge rake face (8) is located closer to the radial inner peripheral side with respect to the axis (O) than the center (S) of the convex arc that the corner cutting edge (12) forms in the rotation locus, and extends from the rear end side in the direction of the axis (O) more than a protruding end (P) of the corner cutting edge (12) in the direction of the axis (O).
摘要翻译：防止角切削刃的损伤或由于切削刃的切削刃强度的变化引起的工件表面的粗糙度的劣化或切削负荷的变化。在端铣刀体（1）的沿轴线（O）旋转的前端部的外周形成有槽（4），槽的壁面的前端外周侧面向旋转方向（T ）用作角切削刃前刀面（11），在角部切削刃的侧脊部形成有朝向前端外周侧形成有旋转轨迹的凸弧形状的角切削刃（12）边缘前刀面，在角切削刃前刀面（11）的内周侧形成有间隙（7），将前述旋转方向（T）的间隙的壁面作为前刀刃前刀面（8）中，在所述端部切削刃前刀面的前端侧的隆起部形成有与所述角部切削刃（12）连接且向内周侧延伸的端部切削刃（9）角切削刃前刀面（11）和末端切削刃前刀面（8）之间的距离L（L）更靠近相对于轴线（O）的径向内周侧比角切削刃（12）在旋转轨迹中形成的凸弧的中心（S）大，并且沿着轴的方向从后端侧延伸（O）的方向上的所述角切削刃（12）的突出端（P）的距离（O）大。

5. 发明授权

US09191628B2 Pattern dimension measurement method, pattern dimension measurement device, program for causing computer to execute pattern dimension measurement method, and recording medium having same recorded thereon 有权
标题翻译：图案尺寸测量方法，图案尺寸测量装置，使计算机执行图案尺寸测量方法的程序，以及记录在其上的记录介质
公开(公告)号：US09191628B2
公开(公告)日：2015-11-17
申请号：US13699167
申请日：2011-05-18
申请人： Shinya Yamada , Yuji Takagi
发明人： Shinya Yamada , Yuji Takagi
IPC分类号： G06K9/00 , H04N7/18 , H01J37/244 , H01J37/28 , G01N23/00
CPC分类号： H04N7/18 , G01B2210/56 , H01J37/244 , H01J37/28 , H01J2237/221 , H01J2237/24578
摘要： A technique for calculating the angle from an auxiliary dot sequence indicating the track of a pattern and for performing pattern measurement is provided, thereby enabling achievement of high-accuracy pattern measurement with reduced influence of the roughness of pattern edges.
摘要翻译：提供了用于从指示图案的轨迹的辅助点序列计算角度并执行图案测量的技术，从而能够以较少的图案边缘粗糙度的影响实现高精度图案测量。

6. 发明申请

US20130120551A1 Pattern Dimension Measurement Method, Pattern Dimension Measurement Device, Program for Causing Computer to Execute Pattern Dimension Measurement Method, and Recording Medium Having Same Recorded Thereon 有权
标题翻译：图案尺寸测量方法，图案尺寸测量装置，使计算机执行图案尺寸测量方法的程序，以及记录有相同记录的记录介质
公开(公告)号：US20130120551A1
公开(公告)日：2013-05-16
申请号：US13699167
申请日：2011-05-18
申请人： Shinya Yamada , Yuji Takagi
发明人： Shinya Yamada , Yuji Takagi
IPC分类号： H04N7/18
CPC分类号： H04N7/18 , G01B2210/56 , H01J37/244 , H01J37/28 , H01J2237/221 , H01J2237/24578
摘要： A technique for calculating the angle from an auxiliary dot sequence indicating the track of a pattern and for performing pattern measurement is provided, thereby enabling achievement of high-accuracy pattern measurement with reduced influence of the roughness of pattern edges.
摘要翻译：提供了用于从指示图案的轨迹的辅助点序列计算角度并执行图案测量的技术，从而能够以较少的图案边缘粗糙度的影响实现高精度图案测量。

7. 发明授权

US08428336B2 Inspecting method, inspecting system, and method for manufacturing electronic devices 有权
标题翻译：检查方法，检查系统和电子设备制造方法
公开(公告)号：US08428336B2
公开(公告)日：2013-04-23
申请号：US11431709
申请日：2006-05-11
申请人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
发明人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
IPC分类号： G06K9/00
CPC分类号： G06F3/0486 , G06F2203/04803 , G06T7/0004 , G06T2200/24 , G06T2207/30148
摘要： A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.
摘要翻译：一种用于对缺陷进行分类的方法，包括：通过对样品上的缺陷进行成像而获得的缺陷图像的特征量化计算; 通过使用关于计算的特征量的信息将缺陷图像分类成分类的类别; 在分类的类别的显示屏幕上的区域中显示分类的缺陷图像; 将分类类别的信息添加到所显示的缺陷图像; 将所述分类类别中的信息添加到所述其他类别中的所显示的缺陷图像，并且将所传送的缺陷图像显示在所述显示屏幕上定义为所述其他类别之一的区域中; 并更改关于该类别的信息。

8. 发明申请

US20120128230A1 DEFECT INSPECTION METHOD AND APPARATUS 审中-公开
标题翻译：缺陷检查方法和装置
公开(公告)号：US20120128230A1
公开(公告)日：2012-05-24
申请号：US13362151
申请日：2012-01-31
申请人： Shunji Maeda , Kenji Oka , Yukihiro Shibata , Minoru Yoshida , Chie Shishido , Yuji Takagi , Atsushi Yoshida , Kazuo Yamaguchi
发明人： Shunji Maeda , Kenji Oka , Yukihiro Shibata , Minoru Yoshida , Chie Shishido , Yuji Takagi , Atsushi Yoshida , Kazuo Yamaguchi
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/95607 , G06T7/0004 , G06T2207/30148
摘要： An inspection method, including: illuminating a light on a wafer on which plural chips having identical patterns are formed; imaging corresponding areas of two chips formed on the wafer to obtain inspection images and reference images with an image sensor; and processing the obtained inspection image and the reference image to produce a difference image which indicates a difference between the inspection image and the reference image and detect a defect by comparing the difference image with a threshold, wherein a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging peripheral portion of the wafer is different from a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging central portion of the wafer.
摘要翻译：一种检查方法，包括：在其上形成有多个具有相同图案的芯片的晶片上照射光; 对形成在晶片上的两个芯片的对应区域进行成像，以获得具有图像传感器的检查图像和参考图像; 并且处理所获得的检查图像和参考图像以产生指示检查图像和参考图像之间的差异的差异图像，并且通过将差异图像与阈值进行比较来检测缺陷，其中应用于差分图像的阈值是通过比较检查图像和通过对晶片的周边部分进行成像获得的参考图像而产生的参考图像与通过比较检查图像和通过对晶片的中心部分进行成像而获得的参考图像而产生的差分图像的阈值不同。

9. 发明授权

US08086422B2 Method for analyzing defect data and inspection apparatus and review system 有权
标题翻译：分析缺陷数据和检查仪器和审查系统的方法
公开(公告)号：US08086422B2
公开(公告)日：2011-12-27
申请号：US12341657
申请日：2008-12-22
申请人： Hisae Shibuya , Yuji Takagi
发明人： Hisae Shibuya , Yuji Takagi
IPC分类号： G06F11/00
CPC分类号： G01N21/956 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
摘要翻译：基于由检查装置检测到的缺陷坐标来分析缺陷的分布状态，将其分类为分布特征类别，或重复缺陷，拥塞缺陷，线性分布缺陷，环/块分布缺陷和随机缺陷。在半导体基板的制造工序中，基于由检查装置检测出的缺陷数据来分析缺陷分布状态，从而指定装置或处理中的缺陷的原因。

10. 发明申请

US20110164809A1 Method And Apparatus For Detecting Pattern Defects 失效
标题翻译：用于检测图案缺陷的方法和装置
公开(公告)号：US20110164809A1
公开(公告)日：2011-07-07
申请号：US13049943
申请日：2011-03-17
申请人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
发明人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
IPC分类号： G06K9/00
CPC分类号： G06K9/6221 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95676
摘要： With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.
摘要翻译：为了在短时间内实现缺陷种类训练，目的在于教导检查薄膜装置的检测缺陷的分类条件，根据本发明的一个方面，提供一种目视检查方法，其装置包括以下步骤：基于由光学或电子缺陷检测装置获取的检查图像检测缺陷，同时计算缺陷的特征; 并根据预先设定的分类条件对缺陷进行分类，其中所述分类条件设置步骤还包括以下步骤：从缺陷检测步骤预先获取的大量缺陷中收集缺陷特征; 基于收集的缺陷特征分布在大量缺陷上的采样缺陷; 并根据检查采样缺陷的结果设置缺陷分类条件。

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