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1. 发明授权

US08086422B2 Method for analyzing defect data and inspection apparatus and review system 有权
标题翻译：分析缺陷数据和检查仪器和审查系统的方法
公开(公告)号：US08086422B2
公开(公告)日：2011-12-27
申请号：US12341657
申请日：2008-12-22
申请人： Hisae Shibuya , Yuji Takagi
发明人： Hisae Shibuya , Yuji Takagi
IPC分类号： G06F11/00
CPC分类号： G01N21/956 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
摘要翻译：基于由检查装置检测到的缺陷坐标来分析缺陷的分布状态，将其分类为分布特征类别，或重复缺陷，拥塞缺陷，线性分布缺陷，环/块分布缺陷和随机缺陷。在半导体基板的制造工序中，基于由检查装置检测出的缺陷数据来分析缺陷分布状态，从而指定装置或处理中的缺陷的原因。

2. 发明申请

US20110164809A1 Method And Apparatus For Detecting Pattern Defects 失效
标题翻译：用于检测图案缺陷的方法和装置
公开(公告)号：US20110164809A1
公开(公告)日：2011-07-07
申请号：US13049943
申请日：2011-03-17
申请人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
发明人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
IPC分类号： G06K9/00
CPC分类号： G06K9/6221 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95676
摘要： With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.
摘要翻译：为了在短时间内实现缺陷种类训练，目的在于教导检查薄膜装置的检测缺陷的分类条件，根据本发明的一个方面，提供一种目视检查方法，其装置包括以下步骤：基于由光学或电子缺陷检测装置获取的检查图像检测缺陷，同时计算缺陷的特征; 并根据预先设定的分类条件对缺陷进行分类，其中所述分类条件设置步骤还包括以下步骤：从缺陷检测步骤预先获取的大量缺陷中收集缺陷特征; 基于收集的缺陷特征分布在大量缺陷上的采样缺陷; 并根据检查采样缺陷的结果设置缺陷分类条件。

3. 发明申请

US20060239536A1 Method for analyzing defect data and inspection apparatus and review system 审中-公开
公开(公告)号：US20060239536A1
公开(公告)日：2006-10-26
申请号：US11472399
申请日：2006-06-22
申请人： Hisae Shibuya , Yuji Takagi
发明人： Hisae Shibuya , Yuji Takagi
IPC分类号： H04N7/18 , G06K9/00 , G01N21/00
CPC分类号： G01N21/956 , G01N21/9501 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

4. 发明申请

US20050168731A1 Method for analyzing defect data and inspection apparatus and review system 失效
标题翻译：分析缺陷数据和检查仪器和审查系统的方法
公开(公告)号：US20050168731A1
公开(公告)日：2005-08-04
申请号：US11095614
申请日：2005-04-01
申请人： Hisae Shibuya , Yuji Takagi
发明人： Hisae Shibuya , Yuji Takagi
IPC分类号： H01L21/66 , G01N21/95 , G06T7/00 , G01N21/88
CPC分类号： G01N21/956 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
摘要翻译：基于由检查装置检测到的缺陷坐标来分析缺陷的分布状态，将其分类为分布特征类别，或重复缺陷，拥塞缺陷，线性分布缺陷，环/块分布缺陷和随机缺陷。在半导体基板的制造工序中，基于由检查装置检测出的缺陷数据来分析缺陷分布状态，从而指定装置或处理中的缺陷的原因。

5. 发明授权

US07720275B2 Method and apparatus for detecting pattern defects 有权
标题翻译：检测图案缺陷的方法和装置
公开(公告)号：US07720275B2
公开(公告)日：2010-05-18
申请号：US11319271
申请日：2005-12-29
申请人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
发明人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G06K9/6221 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95676
摘要： With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefore, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.
摘要翻译：为了在短时间内实现缺陷种类训练，目的在于教导检查薄膜装置的检测缺陷的分类条件，根据本发明的一个方面，提供一种目视检查方法，因此，包括以下步骤：基于由光学或电子缺陷检测装置获取的检查图像，同时计算缺陷的特征来检测缺陷; 并根据预先设定的分类条件对缺陷进行分类，其中所述分类条件设置步骤还包括以下步骤：从缺陷检测步骤预先获取的大量缺陷中收集缺陷特征; 基于收集的缺陷特征分布在大量缺陷上的采样缺陷; 并根据检查采样缺陷的结果设置缺陷分类条件。

6. 发明申请

US20060238755A1 Method for analyzing defect data and inspection apparatus and review system 有权
公开(公告)号：US20060238755A1
公开(公告)日：2006-10-26
申请号：US11472368
申请日：2006-06-22
申请人： Hisae Shibuya , Yuji Takagi
发明人： Hisae Shibuya , Yuji Takagi
IPC分类号： G01N21/00 , G06K9/00
CPC分类号： G01N21/956 , G01N21/9501 , G06T7/0006 , G06T7/001 , G06T2207/30148
摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

7. 发明授权

US06870169B2 Method and apparatus for analyzing composition of defects 有权
标题翻译：分析缺陷组成的方法和装置
公开(公告)号：US06870169B2
公开(公告)日：2005-03-22
申请号：US10735575
申请日：2003-12-11
申请人： Kenji Obara , Yuji Takagi , Hisae Shibuya , Naoki Hosoya
发明人： Kenji Obara , Yuji Takagi , Hisae Shibuya , Naoki Hosoya
IPC分类号： G01N23/225 , G01Q30/02 , G01R31/26 , G06T7/00 , H01J37/147 , H01J37/252 , H01L21/66
CPC分类号： G06T7/0004 , G06T2207/30148
摘要： In order to be able to detect an irradiation position of an electron beam matching a defect position and conduct composition analysis of a defect with high precision and high efficiency, in the present invention, when a composition analysis target defect is selected and irradiation conditions of the electron beam are set for EDX analysis, a low-resolution reference image of low resolution is acquired using the electron beam at a defect corresponding position corresponding to the position of this defect on a chip in the vicinity of a target chip including defects, and a low-resolution defect image of the same low resolution is next acquired at the defect position of the target chip. Then, by comparing these low-resolution images, the defect position is acquired, the electron beam is slanted and irradiated on this defect position to acquire a composition spectrum of the defect.
摘要翻译：为了能够检测匹配缺陷位置的电子束的照射位置并且以高精度和高效率进行缺陷的组成分析，在本发明中，当选择组成分析目标缺陷并且电子束被设置用于EDX分析，使用电子束在与包括缺陷的目标芯片附近的芯片上的该缺陷的位置相对应的缺陷对应位置处采集低分辨率的低分辨率参考图像，并且接下来在目标芯片的缺陷位置获取相同低分辨率的低分辨率缺陷图像。然后，通过比较这些低分辨率图像，获取缺陷位置，电子束被倾斜并照射在该缺陷位置以获得缺陷的组成谱。

8. 发明授权

US06741941B2 Method and apparatus for analyzing defect information 失效
标题翻译：用于分析缺陷信息的方法和装置
公开(公告)号：US06741941B2
公开(公告)日：2004-05-25
申请号：US10449528
申请日：2003-05-29
申请人： Kenji Obara , Yuji Takagi , Hisae Shibuya
发明人： Kenji Obara , Yuji Takagi , Hisae Shibuya
IPC分类号： G06F1900
CPC分类号： H01L21/67253
摘要： To efficiently extract identification of apparatuses causing problems in a thin-film device manufacturing process, candidates for the problem-generating manufacturing apparatus are extracted by evaluating data obtained in relation to produced inspections and data indicating the states of the manufacturing apparatus, with respect to products that enable efficient extraction of problem-generated apparatuses in a thin-film devise manufacturing process. This facilitates inferring the identification of the problem-generating apparatus.
摘要翻译：为了有效地提取在薄膜器件制造过程中导致问题的装置的识别，通过对与产生的检查获得的数据和指示制造装置的状态的数据相关的产品，提取问题产生制造装置的候选这能够在薄膜设计制造过程中有效地提取问题产生的装置。这有助于推断问题产生装置的识别。

9. 发明授权

US08306312B2 Method and apparatus for detecting pattern defects 失效
标题翻译：检测图案缺陷的方法和装置
公开(公告)号：US08306312B2
公开(公告)日：2012-11-06
申请号：US13049943
申请日：2011-03-17
申请人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
发明人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G06K9/6221 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95676
摘要： With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.
摘要翻译：为了在短时间内实现缺陷种类训练，目的在于教导检查薄膜装置的检测缺陷的分类条件，根据本发明的一个方面，提供一种目视检查方法，其装置包括以下步骤：基于由光学或电子缺陷检测装置获取的检查图像检测缺陷，同时计算缺陷的特征; 并根据预先设定的分类条件对缺陷进行分类，其中所述分类条件设置步骤还包括以下步骤：从缺陷检测步骤预先获取的大量缺陷中收集缺陷特征; 基于收集的缺陷特征分布在大量缺陷上的采样缺陷; 并根据检查采样缺陷的结果设置缺陷分类条件。

10. 发明授权

US07912276B2 Method and apparatus for detecting pattern defects 有权
标题翻译：检测图案缺陷的方法和装置
公开(公告)号：US07912276B2
公开(公告)日：2011-03-22
申请号：US12755453
申请日：2010-04-07
申请人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
发明人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G06K9/6221 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95676
摘要： With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.
摘要翻译：为了在短时间内实现缺陷种类训练，目的在于教导检查薄膜装置的检测缺陷的分类条件，根据本发明的一个方面，提供一种目视检查方法，其装置包括以下步骤：基于由光学或电子缺陷检测装置获取的检查图像检测缺陷，同时计算缺陷的特征; 并根据预先设定的分类条件对缺陷进行分类，其中所述分类条件设置步骤还包括以下步骤：从缺陷检测步骤预先获取的大量缺陷中收集缺陷特征; 基于收集的缺陷特征分布在大量缺陷上的采样缺陷; 并根据检查采样缺陷的结果设置缺陷分类条件。

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