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    • 1. 发明申请
    • HALOGEN-FREE FLAME RETARDANT RESIN COMPOSITION, AND, PREPREG, LAMINATE, AND LAMINATE FOR PRINTED CIRCUIT MADE THEREFROM
    • 无卤素阻燃树脂组合物,和PREPREG,层压板和层压板用于印刷电路
    • US20110045303A1
    • 2011-02-24
    • US12861742
    • 2010-08-23
    • Yueshan HeTao ChengShiguo SuBiwu WangJie Li
    • Yueshan HeTao ChengShiguo SuBiwu WangJie Li
    • B32B15/08C08K5/5399B32B27/38
    • C08K5/357C08G59/5073C08G59/621C08G59/686C08J5/24C08J2385/02C08J2463/00C08K5/5399C08L63/00H05K1/0326H05K1/0353H05K1/0366H05K2201/012H05K2201/0209Y10T428/24994Y10T428/31511Y10T428/31529
    • The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.
    • 本发明提供一种无卤阻燃树脂组合物,以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物,预浸料,层压材料和印刷电路用层压材料。 无卤阻燃树脂组合物包含:(A)40-80重量份的苯氧基磷腈化合物(A1)和含二氢苯并恶嗪环的化合物(A2)的混合物,以及苯氧基磷腈化合物( A1)和含二氢苯并恶嗪环的化合物(A2)为1:10至1:2之间; (B)15-45重量份聚环氧化合物; (C)5-25重量份酚醛树脂型固化剂; 和(D)0.1-1重量份作为固化促进剂的咪唑型化合物。 由本发明提供的无卤阻燃树脂组合物制成的预浸料,层压板和印刷电路用层压板具有优异的阻燃性,并且具有高玻璃化转变温度(Tg),高耐热性 抗弯强度高,可靠性高,介电损耗因数低,水分低,CTE低,耐化学性好,加工性好。