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1. 发明授权

US08445605B2 Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom 有权
标题翻译：无卤阻燃树脂组合物，以及由其制成的印刷电路用预浸料，层压板和层叠体
公开(公告)号：US08445605B2
公开(公告)日：2013-05-21
申请号：US12861742
申请日：2010-08-23
申请人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
发明人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
IPC分类号： B32B15/08 , B32B17/04 , B32B27/04 , B32B27/38 , C08K3/20 , C08K3/36 , C08L61/06 , C08L63/02 , C08L63/04 , C08K7/14
CPC分类号： C08K5/357 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2385/02 , C08J2463/00 , C08K5/5399 , C08L63/00 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529
摘要： The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.
摘要翻译：本发明提供一种无卤阻燃树脂组合物，以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物，预浸料，层压材料和印刷电路用层压材料。无卤阻燃树脂组合物包含：（A）40-80重量份的苯氧基磷腈化合物（A1）和含二氢苯并恶嗪环的化合物（A2）的混合物，以及苯氧基磷腈化合物（ A1）和含二氢苯并恶嗪环的化合物（A2）为1:10至1:2之间; （B）15-45重量份聚环氧化合物; （C）5-25重量份酚醛树脂型固化剂; 和（D）0.1-1重量份作为固化促进剂的咪唑型化合物。由本发明提供的无卤阻燃树脂组合物制成的预浸料，层压板和印刷电路用层压板具有优异的阻燃性，并且具有高玻璃化转变温度（Tg），高耐热性抗弯强度高，可靠性高，介电损耗因数低，水分低，CTE低，耐化学性好，加工性好。

2. 发明申请

US20110045303A1 HALOGEN-FREE FLAME RETARDANT RESIN COMPOSITION, AND, PREPREG, LAMINATE, AND LAMINATE FOR PRINTED CIRCUIT MADE THEREFROM 有权
标题翻译：无卤素阻燃树脂组合物，和PREPREG，层压板和层压板用于印刷电路
公开(公告)号：US20110045303A1
公开(公告)日：2011-02-24
申请号：US12861742
申请日：2010-08-23
申请人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
发明人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
IPC分类号： B32B15/08 , C08K5/5399 , B32B27/38
CPC分类号： C08K5/357 , C08G59/5073 , C08G59/621 , C08G59/686 , C08J5/24 , C08J2385/02 , C08J2463/00 , C08K5/5399 , C08L63/00 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , Y10T428/24994 , Y10T428/31511 , Y10T428/31529
摘要： The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.
摘要翻译：本发明提供一种无卤阻燃树脂组合物，以及由无卤阻燃树脂组合物制成的无卤阻燃树脂组合物，预浸料，层压材料和印刷电路用层压材料。无卤阻燃树脂组合物包含：（A）40-80重量份的苯氧基磷腈化合物（A1）和含二氢苯并恶嗪环的化合物（A2）的混合物，以及苯氧基磷腈化合物（ A1）和含二氢苯并恶嗪环的化合物（A2）为1:10至1:2之间; （B）15-45重量份聚环氧化合物; （C）5-25重量份酚醛树脂型固化剂; 和（D）0.1-1重量份作为固化促进剂的咪唑型化合物。由本发明提供的无卤阻燃树脂组合物制成的预浸料，层压板和印刷电路用层压板具有优异的阻燃性，并且具有高玻璃化转变温度（Tg），高耐热性抗弯强度高，可靠性高，介电损耗因数低，水分低，CTE低，耐化学性好，加工性好。

3. 发明授权

US08518527B2 Method for improving flame retardant efficiency of phenoxyphosphazene compound, and prepreg. laminate for printed circuit made by the method 有权
标题翻译：提高苯氧基磷腈化合物和预浸料的阻燃效率的方法。通过该方法制作的印刷电路层压板
公开(公告)号：US08518527B2
公开(公告)日：2013-08-27
申请号：US12870830
申请日：2010-08-29
申请人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
发明人： Yueshan He , Tao Cheng , Shiguo Su , Biwu Wang , Jie Li
IPC分类号： B32B27/12 , B32B27/18 , B32B27/38 , C08L63/00
CPC分类号： B32B15/20 , B32B5/022 , B32B5/22 , B32B5/26 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/06 , B32B2262/08 , B32B2262/10 , B32B2307/20 , B32B2307/306 , B32B2307/3065 , B32B2307/50 , B32B2307/546 , B32B2307/714 , B32B2307/7246 , B32B2307/7265 , B32B2457/08 , C08K5/357 , C08K5/5399 , C08L63/00 , C08L85/02 , C08L2203/20 , Y10T428/249952 , Y10T428/31511 , Y10T428/31529 , Y10T428/31678 , C08L2666/14
摘要： The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc. Furthermore, epoxy resins are interfused to greatly overcome the brittleness of the benzoxazine resin, so, the cured resin has comparatively high flexural strength and good processability.
摘要翻译：本发明提供了一种提高苯氧基磷腈化合物的阻燃效率的方法，并提供了通过该方法制备的预浸料，层压材料和印刷电路用层压材料。本发明在无卤阻燃树脂组合物中化合苯氧基磷腈化合物和二氢苯并恶嗪环化合物，以有效提高苯氧基磷腈化合物的阻燃效率。此外，通过提高苯氧基磷腈化合物的阻燃效率的方法制备的预浸料，层压体和印刷电路用层压体具有优异的阻燃性，耐化学性，抗CAF性，高玻璃化转变温度（Tg），高耐热性，低介电损耗因子，低水分和低CTE等。此外，环氧树脂被连接以大大克服苯并恶嗪树脂的脆性，因此，固化树脂具有较高的弯曲强度和良好的加工性能。

4. 发明申请

US20110059324A1 Method for Improving Flame Retardant Efficiency of Phenoxyphosphazene Compound, and Prepreg. Laminate for printed circuit Made by the Method 有权
标题翻译：提高苯氧基磷腈化合物和预浸料的阻燃效率的方法。印刷电路层压板由方法制成
公开(公告)号：US20110059324A1
公开(公告)日：2011-03-10
申请号：US12870830
申请日：2010-08-29
申请人： YUESHAN HE , TAO CHENG , SHIGUO SU , BIWU WANG , JIE LI
发明人： YUESHAN HE , TAO CHENG , SHIGUO SU , BIWU WANG , JIE LI
IPC分类号： B32B15/04 , C08K5/5399
CPC分类号： B32B15/20 , B32B5/022 , B32B5/22 , B32B5/26 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/06 , B32B2262/08 , B32B2262/10 , B32B2307/20 , B32B2307/306 , B32B2307/3065 , B32B2307/50 , B32B2307/546 , B32B2307/714 , B32B2307/7246 , B32B2307/7265 , B32B2457/08 , C08K5/357 , C08K5/5399 , C08L63/00 , C08L85/02 , C08L2203/20 , Y10T428/249952 , Y10T428/31511 , Y10T428/31529 , Y10T428/31678 , C08L2666/14
摘要： The present invention provides a method for improving the flame retardant efficiency of a phenoxyphosphazene compound, and provides a prepreg, a laminate, and a laminate for printed circuit that are made by the method. The present invention compounds a phenoxyphosphazene compound and a dihydrobenzoxazine ring-containing compound in a halogen-free flame retardant resin composition, so as to effectively improve the flame-retardant efficiency of the phenoxyphosphazene compound. Besides, the prepreg, the laminate and the laminate for printed circuit that are made by the method for improving the flame retardant efficiency of a phenoxyphosphazene compound have excellent flame retardancy, chemical resistance, anti-CAF property, high glass transition temperature (Tg), high thermal resistance, low dielectric dissipation factor, low moisture, and low C.T.E, etc. Furthermore, epoxy resins are interfused to greatly overcome the brittleness of the benzoxazine resin, so, the cured resin has comparatively high flexural strength and good processability.
摘要翻译：本发明提供了一种提高苯氧基磷腈化合物的阻燃效率的方法，并提供了通过该方法制备的预浸料，层压材料和印刷电路用层压材料。本发明在无卤阻燃树脂组合物中化合苯氧基磷腈化合物和二氢苯并恶嗪环化合物，以有效提高苯氧基磷腈化合物的阻燃效率。此外，通过提高苯氧基磷腈化合物的阻燃效率的方法制备的预浸料，层压体和印刷电路用层压体具有优异的阻燃性，耐化学性，抗CAF性，高玻璃化转变温度（Tg），高耐热性，低介电损耗因子，低水分和低CTE等。此外，环氧树脂被连接以大大克服苯并恶嗪树脂的脆性，因此，固化树脂具有较高的弯曲强度和良好的加工性能。

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