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1. 发明授权

US08229032B2 Signal receiver for receiving differential signal via transmission line 有权
标题翻译：用于通过传输线接收差分信号的信号接收器
公开(公告)号：US08229032B2
公开(公告)日：2012-07-24
申请号：US12389691
申请日：2009-02-20
申请人： Youichirou Suzuki , Noboru Maeda , Shigeki Takahashi , Koji Kondo , Kazuyoshi Nagase , Takahisa Koyasu
发明人： Youichirou Suzuki , Noboru Maeda , Shigeki Takahashi , Koji Kondo , Kazuyoshi Nagase , Takahisa Koyasu
IPC分类号： H03K9/00
CPC分类号： H04M3/18 , H04L25/0272 , H04L25/0292 , H04L25/085
摘要： A signal receiver includes: a receiving circuit that receives a differential signal via a transmission line, which includes a pair of signal wires for transmitting the differential signal; and an impedance control circuit that controls an input impedance so as to reduce a common mode noise. The impedance control circuit includes a detection element for detecting at least one of a voltage, a current and an electric power of the common mode noise. The impedance control circuit controls the input impedance in accordance with change of the at least one of the voltages the current and the electric power of the common mode noise.
摘要翻译：信号接收机包括：接收电路，经由传输线接收差分信号，该传输线包括用于发送差分信号的一对信号线; 以及阻抗控制电路，其控制输入阻抗以减小共模噪声。阻抗控制电路包括用于检测共模噪声的电压，电流和电功率中的至少一个的检测元件。阻抗控制电路根据共模噪声的电流和电功率的至少一个电压的变化来控制输入阻抗。

2. 发明授权

US08160531B2 Receiving device for adjusting energy of a received signal sent over a transmission line 有权
标题翻译：用于调整通过传输线路发送的接收信号的能量的接收装置
公开(公告)号：US08160531B2
公开(公告)日：2012-04-17
申请号：US12382139
申请日：2009-03-10
申请人： Youichirou Suzuki , Noboru Maeda , Takahisa Koyasu , Koji Kondo , Shigeki Takahashi
发明人： Youichirou Suzuki , Noboru Maeda , Takahisa Koyasu , Koji Kondo , Shigeki Takahashi
IPC分类号： H04B1/18
CPC分类号： H04L25/12 , H04L25/0272 , H04L25/0278 , H04L25/0294
摘要： A receiving device is provided capable of avoiding reception of unnecessary energy when a signal waveform actually changes on a receiving side. An impedance control circuit includes a sensing unit to sense one or more of a voltage, current, or power of a signal to be received by a receiving circuit. The impedance control unit varies an input impedance according to the change in the sensed one or more quantities so that the received signal will be reflected. Thus the excess energy of the signal is reflected and fed to any other receiving circuit achieving stable communications.
摘要翻译：提供一种接收装置，其能够在信号波形在接收侧实际改变时避免接收不必要的能量。阻抗控制电路包括感测单元，用于感测由接收电路接收的信号的电压，电流或功率中的一个或多个。阻抗控制单元根据感测的一个或多个量的变化来改变输入阻抗，使得接收到的信号将被反射。因此，信号的过剩能量被反射并馈送到实现稳定通信的任何其它接收电路。

3. 发明授权

US08396164B2 Receiving device including impedance control circuit and semiconductor device including impedance control circuit 有权
标题翻译：接收装置包括阻抗控制电路和包括阻抗控制电路的半导体装置
公开(公告)号：US08396164B2
公开(公告)日：2013-03-12
申请号：US12320802
申请日：2009-02-05
申请人： Youichirou Suzuki , Noboru Maeda , Takashi Nakano , Kazuyoshi Nagase , Koji Kondo , Shigeki Takahashi , Yoshihiko Ozeki
发明人： Youichirou Suzuki , Noboru Maeda , Takashi Nakano , Kazuyoshi Nagase , Koji Kondo , Shigeki Takahashi , Yoshihiko Ozeki
IPC分类号： H03K9/00 , H04L27/00
CPC分类号： H04B3/30 , H01L27/092 , H01L27/0928 , H01L27/1203 , H04L25/0272 , H04L25/0278 , H04L25/0292
摘要： A receiving device includes a receiving circuit and an impedance control circuit. The receiving circuit receives a signal transmitted through a communication line. The impedance control circuit is coupled with the receiving circuit and has a detecting part. The detecting part detects a physical value of the signal and the physical value includes at least one of a voltage, an electric current, and an electric power. The impedance control circuit changes an input impedance based on the detected value so that a ringing of the signal is reduced.
摘要翻译：接收装置包括接收电路和阻抗控制电路。接收电路接收通过通信线路发送的信号。阻抗控制电路与接收电路耦合并具有检测部分。检测部分检测信号的物理值，物理值包括电压，电流和电力中的至少一个。阻抗控制电路根据检测值改变输入阻抗，从而降低信号的振铃。

4. 发明申请

US20100177829A1 Receiving device including impedance control circuit and semiconductor device including impedance control circuit 有权
标题翻译：接收装置包括阻抗控制电路和包括阻抗控制电路的半导体装置
公开(公告)号：US20100177829A1
公开(公告)日：2010-07-15
申请号：US12320802
申请日：2009-02-05
申请人： Youichirou Suzuki , Noboru Maeda , Takashi Nakano , Kazuyoshi Nagase , Koji Kondo , Shigeki Takahashi , Yoshihiko Ozeki
发明人： Youichirou Suzuki , Noboru Maeda , Takashi Nakano , Kazuyoshi Nagase , Koji Kondo , Shigeki Takahashi , Yoshihiko Ozeki
IPC分类号： H04B3/02 , H02H9/04
CPC分类号： H04B3/30 , H01L27/092 , H01L27/0928 , H01L27/1203 , H04L25/0272 , H04L25/0278 , H04L25/0292
摘要： A receiving device includes a receiving circuit and an impedance control circuit. The receiving circuit receives a signal transmitted through a communication line. The impedance control circuit is coupled with the receiving circuit and has a detecting part. The detecting part detects a physical value of the signal and the physical value includes at least one of a voltage, an electric current, and an electric power. The impedance control circuit changes an input impedance based on the detected value so that a ringing of the signal is reduced.
摘要翻译：接收装置包括接收电路和阻抗控制电路。接收电路接收通过通信线路发送的信号。阻抗控制电路与接收电路耦合并具有检测部分。检测部分检测信号的物理值，物理值包括电压，电流和电力中的至少一个。阻抗控制电路根据检测值改变输入阻抗，从而降低信号的振铃。

5. 发明申请

US20090233565A1 Receiving decive 有权
标题翻译：接收决定
公开(公告)号：US20090233565A1
公开(公告)日：2009-09-17
申请号：US12382139
申请日：2009-03-10
申请人： Youichirou Suzki , Noboru Maeda , Takahisa Koyasu , Koji Kondo , Shigeki Takahashi
发明人： Youichirou Suzki , Noboru Maeda , Takahisa Koyasu , Koji Kondo , Shigeki Takahashi
IPC分类号： H04B7/00
CPC分类号： H04L25/12 , H04L25/0272 , H04L25/0278 , H04L25/0294
摘要： A receiving device is provided capable of avoiding reception of unnecessary energy when a signal waveform actually changes on a receiving side. An impedance control circuit includes a sensing unit to sense one or more of a voltage, current, or power of a signal to be received by a receiving circuit. The impedance control unit varies an input impedance according to the change in the sensed one or more quantities so that the received signal will be reflected. Thus the excess energy of the signal is reflected and fed to any other receiving circuit achieving stable communications.
摘要翻译：提供一种接收装置，其能够在信号波形在接收侧实际改变时避免接收不必要的能量。阻抗控制电路包括感测单元，用于感测由接收电路接收的信号的电压，电流或功率中的一个或多个。阻抗控制单元根据感测的一个或多个量的变化来改变输入阻抗，使得接收到的信号将被反射。因此，信号的过剩能量被反射并馈送到实现稳定通信的任何其它接收电路。

6. 发明授权

US07356917B2 Method for manufacturing multi-layer printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US07356917B2
公开(公告)日：2008-04-15
申请号：US11116320
申请日：2005-04-28
申请人： Toshikazu Harada , Koji Kondo
发明人： Toshikazu Harada , Koji Kondo
IPC分类号： H05K3/30 , H05K1/03
CPC分类号： H05K1/0242 , H05K1/024 , H05K3/382 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0191 , H05K2201/0352 , H05K2203/065 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163 , Y10T428/24917
摘要： A multi-layer printed circuit board includes an insulation substrate; a surface conductive pattern disposed on a surface of the insulation substrate; and an inner conductive pattern embedded in the insulation substrate. The surface conductive pattern has a surface roughness on an insulation substrate side, the surface roughness of the surface conductive pattern being larger than that of the inner conductive pattern.
摘要翻译：多层印刷电路板包括绝缘基板; 设置在所述绝缘基板的表面上的表面导电图案; 以及嵌入绝缘基板中的内导电图案。表面导电图案在绝缘基板侧具有表面粗糙度，表面导电图案的表面粗糙度大于内部导电图案的表面粗糙度。

7. 发明申请

US20080049849A1 Communication system using differential two-wire type of communication line 有权
标题翻译：通信系统采用差分两线式通信线路
公开(公告)号：US20080049849A1
公开(公告)日：2008-02-28
申请号：US11882289
申请日：2007-07-31
申请人： Naoto Sakai , Koji Kondo
发明人： Naoto Sakai , Koji Kondo
IPC分类号： H04B3/00
CPC分类号： H04B3/50 , H04L25/0272 , H04L25/085
摘要： A communication system comprises the network, plural nodes, and a reducer. The network comprises a main line and a plurality of branch lines branched from the main line respectively, the main line and each of the branch lines being respectively formed into a differential two-wire type of communication line consisting of a first communion line and a second communication line. The plural nodes are connected to two or more branch lines of the branch lines to communicate frames of data among the branches with each other. The reducer is arranged to each node to reduce either an impedance of each of the first and second communication lines or an impedance between the first and second communication lines during a specified period of time starting at a time instant when a node completes sending out the frames of data to be transmitted.
摘要翻译：通信系统包括网络，多个节点和减速器。网络包括主线和分别从主线分支的多条分支线，主线和每条分支线分别形成为由第一通道线和第二通线组成的差分两线式通信线路通讯线。多个节点连接到分支线路的两条或更多条支线，以便在分支之间彼此传送数据帧。减速器被布置到每个节点以在从节点完成发送帧的时刻开始的指定时间段内减小第一和第二通信线路中的每一个的阻抗或第一和第二通信线路之间的阻抗要发送的数据。

8. 发明授权

US07304248B2 Multi-layer printed circuit board and method for manufacturing the same 有权
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US07304248B2
公开(公告)日：2007-12-04
申请号：US10814803
申请日：2004-04-01
申请人： Kazuo Tada , Koji Kondo , Satoshi Takeuchi
发明人： Kazuo Tada , Koji Kondo , Satoshi Takeuchi
IPC分类号： H05K1/16
CPC分类号： H05K1/167 , H05K3/4611 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0317 , H05K2203/065 , Y10T29/49082 , Y10T29/49126 , Y10T29/49128
摘要： A multi-layer printed circuit board includes: a resin substrate including a plurality of laminated thermoplastic resin films; a thin film resistor embedded in the resin substrate; and an electrode disposed on the thin film resistor. The thermoplastic resin film includes a conductive pattern made of metallic film. The electrode is covered with the conductive pattern disposed over or under the electrode.
摘要翻译：多层印刷电路板包括：具有多层叠热塑性树脂膜的树脂基板; 嵌入树脂基板中的薄膜电阻器; 以及设置在薄膜电阻器上的电极。热塑性树脂膜包括由金属膜制成的导电图案。电极被设置在电极之上或之下的导电图案覆盖。

9. 发明申请

US20060067534A1 Storage medium storing stereo enhancement processing program, stereo enhancement apparatus and stereo enhancement method 审中-公开
标题翻译：存储介质存储立体声增强处理程序，立体声增强装置和立体声增强方法
公开(公告)号：US20060067534A1
公开(公告)日：2006-03-30
申请号：US11157978
申请日：2005-06-22
申请人： Masato Mizuta , Yasushi Ida , Koji Kondo
发明人： Masato Mizuta , Yasushi Ida , Koji Kondo
IPC分类号： H04R5/00 , H04B1/00
CPC分类号： H04S1/002
摘要： A game apparatus functioning as a stereo enhancement apparatus includes a CPU, and the CPU generates sound signals of stereo sounds required for the game. The CPU adjusts volumes of stereo sounds simultaneously played from respective sound sources on the basis of pan of the respective sound sources, and mixes the plurality of stereo sounds whose volumes have been adjusted to generate a stereo sound of two channels. Next, the stereo sound including an L channel sound signal (Lin) and an R channel sound signal (Rin) that have been mixed is divided into two systems, and then, a stereo enhancement signal (Lin−Rin) is generated. Then, the stereo enhancement signal is delayed, an added signal obtained by adding the delayed stereo enhancement signal to the Lin is generated, and a subtracted signal obtained by subtracting the delayed stereo enhancement signal from the Rin is generated. Then, the added signal is output from a speaker for L channel, and the subtracted signal is output from a speaker for R channel.
摘要翻译：用作立体声增强装置的游戏装置包括CPU，并且CPU生成游戏所需的立体声的声音信号。 CPU根据相应声源的平移来调整从相应的声源同时播放的立体声音量，并且将已经调节其音量的多个立体声混合以产生两声道的立体声。接下来，包括混合的L声道声音信号（Lin）和R声道声音信号（Rin）的立体声被分成两个系统，然后产生立体声增强信号（Lin-Rin）。然后，立体声增强信号被延迟，产生通过将延迟立体声增强信号加到林而获得的相加信号，并且产生通过从Rin中减去延迟立体声增强信号而获得的相减信号。然后，从L通道的扬声器输出相加的信号，并且从用于R声道的扬声器输出相减信号。

10. 发明申请

US20060044735A1 Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device 有权
标题翻译：用于半导体器件的封装衬底，其制造方法和半导体器件
公开(公告)号：US20060044735A1
公开(公告)日：2006-03-02
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
IPC分类号： H05K1/00
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译：具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。

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